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1. 发明申请

US20140230240A1 METHOD OF PRODUCING LITHIUM ION SECONDARY BATTERY 审中-公开
标题翻译：生产锂离子二次电池的方法
公开(公告)号：US20140230240A1
公开(公告)日：2014-08-21
申请号：US14347154
申请日：2012-09-24
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Tatsuro Sasaki , Yuichi Ichikawa
IPC分类号： H01M10/04
CPC分类号： H01M10/0431 , H01M10/0525 , H01M10/0587 , Y10T29/49108 , Y10T29/4911
摘要： A method of producing a lithium ion secondary battery includes: a first winding process of winding a positive electrode plate (2) in a roll shape to form a first roll (11) and to provide a curling tendency to the positive electrode plate (2), and of winding a negative electrode plate (3) in a roll shape to form a second roll (12) and to provide a curling tendency to the negative electrode plate (3); and a second winding process of unrolling the positive electrode plate (2) from the first roll (11), unrolling the negative electrode plate (3) from the second roll (12), and winding the unrolled positive electrode plate (2) and negative electrode plate (3) in a roll shape to form a third roll (13) while allowing the positive electrode plate (2) and the negative electrode plate (3) to overlap with each other and maintaining the curling tendency.
摘要翻译：锂离子二次电池的制造方法包括：卷绕正极板（2）以形成第一辊（11）并且向正极板（2）提供卷曲倾向的第一卷绕工序，并且卷绕负极板（3）以形成第二辊（12）并且向负极板（3）提供卷曲趋势; 以及从所述第一辊（11）展开所述正极板（2）的第二卷绕工序，将所述负极板（3）从所述第二辊（12）展开，并且卷绕所述未拉出的正极板（2）和负极板电极板（3）形成第三辊（13），同时允许正极板（2）和负极板（3）彼此重叠并保持卷曲倾向。

2. 发明授权

US11634579B2 Resin composition, molded body, optical layer, cover member and moving body 有权
公开(公告)号：US11634579B2
公开(公告)日：2023-04-25
申请号：US17598980
申请日：2020-03-24
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Tomoya Kosaka , Yuichiro Funakoshi
IPC分类号： C08L69/00 , G02B1/04 , C08K5/00 , C08J7/04 , C08J7/046 , C08K5/08 , C08K5/3437
摘要： A resin composition of the present invention is used in an optical layer 10 provided with a first layer (base material layer 1) including a polycarbonate-based resin and a visible light absorber for forming the first layer. The visible light absorber includes a plurality of kinds of light absorbers, and a melting point of a first light absorber having the lowest melting point is equal to or higher than 200° C., in which a melting point of a second light absorber having the highest melting point is equal to or lower than 330° C. The resin composition is such that the viscosity at 260° C. obtainable when a shear rate is 243.2 [1/sec] is equal to or more than 400 Pa·s and equal to or less than 3500 Pa·s.

3. 发明申请

US20230036342A1 SOLID RESIN MOLDING MATERIAL, MOLDED PRODUCT, AND METHOD FOR PRODUCING MOLDED PRODUCT 有权
公开(公告)号：US20230036342A1
公开(公告)日：2023-02-02
申请号：US17786058
申请日：2020-12-24
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Wakana NOBE , Masaru MIZOHATA , Kensuke NOTSU , Masato YOSHIDA , Katsushi YAMASHITA
IPC分类号： C08K13/02
摘要： A solid resin molding material according to the present invention includes a thermosetting resin (A), a curing agent (B), a carboxylic acid-based dispersant (C), and magnetic particles (D).

4. 发明申请

US20230011467A1 OPTICAL SHEET AND OPTICAL COMPONENT 有权
公开(公告)号：US20230011467A1
公开(公告)日：2023-01-12
申请号：US17772713
申请日：2020-10-26
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Satoshi Nishino , Hiroshi Oya
IPC分类号： G02B1/04 , G02C7/10 , G02C7/12 , C09B33/02 , C09B29/33
摘要： An optical sheet 10 of the present invention includes a laminate including a polarizing layer 4 containing at least one kind of a light absorbing agent and having a polarizing function, and a protective layer 1 laminated on the polarizing layer 4, in which in the polarizing layer 4, a value of a* is 0 or more and 30 or less and a value of b* is 0 or more and 30 or less in an L*a*b* color system defined by JIS Z 8781-4, and in the optical sheet 10, a size of a Q Blue value defined by Australian Standard Australia/New Zealand Standard 1067-2016 is 0.70 or more. Thus, even when the optical sheet is toned to brown, blue light can be distinguished with excellent distinguishability.

5. 发明申请

US20220380521A1 RESIN COMPOSITION AND MOLDED ARTICLE 有权
公开(公告)号：US20220380521A1
公开(公告)日：2022-12-01
申请号：US17765887
申请日：2020-10-01
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Wakana NOBE , Masato YOSHIDA , Katsushi YAMASHITA
IPC分类号： C08G59/24 , C08G59/62 , C08K3/36 , C08K3/08 , H01F1/26
摘要： Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.

6. 发明申请

US20220213248A1 RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME 有权
公开(公告)号：US20220213248A1
公开(公告)日：2022-07-07
申请号：US17603628
申请日：2020-04-10
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Hajime Mifuka
IPC分类号： C08G8/28 , C08G12/32 , C08L61/14 , C08K5/3467
摘要： According to the present invention, A resin material including a phenolic resin and a dicyandiamide polymer finely dispersed in the phenolic resin; and a method for producing a resin material including a phenolic resin and a dicyandiamide polymer dispersed in the phenolic resin, the method including a step of preparing a resin composition including the phenolic resin and dicyandiamide and a step of heating the resin composition to polymerize the dicyandiamide and form the dicyandiamide polymer are provided.

7. 发明申请

US20220118746A1 MULTILAYER FILM AND PACKAGE 有权
公开(公告)号：US20220118746A1
公开(公告)日：2022-04-21
申请号：US17563516
申请日：2021-12-28
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Hideki KAI
IPC分类号： B32B27/08 , B32B27/32 , B65D75/36
摘要： A multilayer film, including: a barrier layer in which an unstretched first film layer containing a first resin, and an unstretched second film layer containing a second resin different from the first resin are alternately and repeatedly laminated; a pair of unstretched first outer layers sandwiching the barrier layer; and a pair of unstretched second outer layers sandwiching the pair of unstretched first outer layers, wherein the average thickness per layer of the first film layers is 10 to 1,000 nm, and the lamination number of the first film layers in the barrier layer is in the range of 50 to 5,000.

8. 发明授权

US11293926B2 Method for preparing sugar chain 有权
公开(公告)号：US11293926B2
公开(公告)日：2022-04-05
申请号：US16084454
申请日：2018-02-28
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Masaaki Toyoda
IPC分类号： G01N33/58 , C12Q1/34 , C12P19/04
摘要： Provided is a method for preparing a sugar chain, including: a labeling step of adding a labeling reagent to a sugar chain-containing sample which contains a sugar chain to obtain a labeled product containing a labeled substance of the sugar chain, in which a reaction environment of the labeling reagent and the sugar chain contains water in the labeling step.

9. 发明申请

US20220073727A1 RESIN COMPOSITION FOR SEALING, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 有权
公开(公告)号：US20220073727A1
公开(公告)日：2022-03-10
申请号：US17417852
申请日：2019-12-23
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Shinya KAWAMURA
IPC分类号： C08L63/00 , C08G59/24 , C08G59/62 , C08K3/36 , C09K3/10 , H01L21/56 , H01L23/29
摘要： According to the present invention, there is provided a resin composition for sealing containing (A) an epoxy resin; (B) a curing agent; and (C) a filler, wherein the epoxy resin (A) includes an epoxy resin (A-1) having a naphthyl ether skeleton, and wherein the resin composition for sealing satisfies the following Formula (1): Formula (1) E2×(α2×10−6)×(175−Tg)×η2≤0.3
wherein, in Formula (1), Tg (° C.) is a glass transition temperature of a cured product of the resin composition for sealing, α2 (ppm/° C.) is a coefficient of linear expansion over a range from 190° C. to 230° C. of the cured product, and E2 (MPa) is a hot elastic modulus at 260° C. of the cured product, and η2 (MPa) is a rectangular pressure at 175° C. of the resin composition for sealing as measured by the following method; (method) the resin composition for sealing is injected, using a low-pressure transfer molding machine, into a rectangular-shaped flow channel having a width of 15 mm, a thickness of 1 mm, and a length of 175 mm under conditions of a mold temperature of 170° C. and an injection flow rate of 177 mm3/sec, a change in pressure over time is measured with a pressure sensor embedded at a position 25 mm away from an upstream tip of the flow channel, a lowest pressure (MPa) during a flow of the resin composition for sealing is measured, and the lowest pressure is regarded as the rectangular pressure.

10. 发明申请

US20220055344A1 RESIN COMPOSITION AND METAL BASE COPPER-CLAD LAMINATE 有权
公开(公告)号：US20220055344A1
公开(公告)日：2022-02-24
申请号：US17417228
申请日：2019-11-28
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Daisuke Kitahara
IPC分类号： B32B15/092 , B32B15/09 , B32B15/20 , C08K3/013 , C08K3/22 , C08K5/3445 , C08L63/00 , C08L71/10 , C09K5/14
摘要： A resin composition of the present invention is a resin composition used for forming a stress relaxation layer (102) of a metal base copper-clad laminate (100) configured by laminating a metal plate (101), the stress relaxation layer (102), and a piece of copper foil (103) in this order, the resin composition including: an epoxy resin having a polyether structure; a phenoxy resin; and a heat dissipation filler, in which the resin composition satisfies a characteristic of a storage elastic modulus at 25° C. being equal to or more than 0.01 GPa and equal to or less than 1.6 GPa.

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