
基本信息:
- 专利标题: 挟模装置用以对所挟模具形成真空环境的气密机构
- 专利标题(英):Gas-tight mechanism of die device for forming vacuum environment
- 申请号:CN200610161990.2 申请日:2006-12-12
- 公开(公告)号:CN101200107A 公开(公告)日:2008-06-18
- 发明人: 陈法胜
- 申请人: 陈法胜
- 申请人地址: 中国台湾台中市
- 专利权人: 陈法胜
- 当前专利权人: 钜钢机械股份有限公司
- 当前专利权人地址: 中国台湾台中市
- 代理机构: 北京天平专利商标代理有限公司
- 代理人: 孙刚; 赵海生
- 主分类号: B29C33/00
- IPC分类号: B29C33/00 ; B29C33/20
Disclosed is a die pinching device which is an air tightness mechanism to form a vacuum environment for the pinched die. The invention comprises a base, a long shaped frame which is connected fixedly and vertically on the base with one end of a long shaft of the frame; a top which is bridged at the other end of the long shaft of the frame and is arranged above the base, so as to correspond up and down to the base and form a die pinching space for the pinched die to be arranged between the top and the base; an air tight pipe shaped cover which can do reciprocating linear movement along the long shaft of the frame and between an air tight position and starting position; when in the air tight position, the cover is positioned in the die pinching space and is around the pinched die; a first closed end part which is arranged on the base and is provided with a ring shaped first closed connecting end which is used to be connected in butt in corresponding and coaxial air tightness with one end of a pipe axis of the cover on the air tight position; a second closed end part which is arranged on the top and is provided with a ring shaped second closed connecting end which is used to be connected in butt in corresponding and coaxial air tightness with the other end of the pipe axis of the cover on the air tight position. The invention can achieve the effect of reducing the integral height of the die pinching device, which is convenient for operation and maintenance.
公开/授权文献:
- CN100569477C 挟模装置之用以对所挟模具形成真空环境的气密机构 公开/授权日:2009-12-16
IPC结构图谱:
B | 作业;运输 |
--B29 | 塑料的加工;一般处于塑性状态物质的加工 |
----B29C | 塑料的成型或连接;塑性状态物质的一般成型;已成型产品的后处理,如修整 |
------B29C33/00 | 模型或型芯;其零件或所用的附件 |