
基本信息:
- 专利标题: 一种移动配件的线套结构及其制法
- 专利标题(英):Wire sheath construction of movable accessory and manufacturing method thereof
- 申请号:CN200710109464.6 申请日:2007-06-26
- 公开(公告)号:CN101335414B 公开(公告)日:2010-06-09
- 发明人: 谢芳昌 , 林一鸣
- 申请人: 美律实业股份有限公司
- 申请人地址: 中国台湾
- 专利权人: 美律实业股份有限公司
- 当前专利权人: 美律实业股份有限公司
- 当前专利权人地址: 中国台湾
- 代理机构: 北京科龙寰宇知识产权代理有限责任公司
- 代理人: 孙皓晨
- 主分类号: H01R43/00
- IPC分类号: H01R43/00 ; H01R43/18 ; H01R13/58 ; H01R13/56 ; H05K7/00 ; B29C45/00 ; B29C45/16 ; B29L31/36 ; B29L31/34
The invention relates to a clip structure of a mobile accessory and the manufacturing method thereof. The structure comprises a wire rod, an internal mold which covers the wire rod, and an external mold which covers the internal mold. Through processing and manufacturing, the hard internal mold and the soft external mold can be combined closely and can not be separated easily, and the wire can undertake severe bending test and the tensile capacity thereof can be improved. The structure of the invention can provide an extensive part with a smooth and flat surface, with no net hole design, thusno dirt is hidden and contained; in addition, the internal mold can cooperate mutually with the mobile accessory to reach an excellent fixing effect. Therefore, the structure of the invention is a design with high quality and capability to extend service life.
公开/授权文献:
- CN101335414A 一种移动配件的线套结构及其制法 公开/授权日:2008-12-31
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01R | 导电连接;一组相互绝缘的电连接元件的结构组合;连接装置;集电器 |
------H01R43/00 | 专用于制造、组装、维护或修理线路连接器或集电器的设备或方法,或专用于连接电导体的设备或方法 |