基本信息:
- 专利标题： 固态发光元件及光源模组
- 专利标题（英）：Solid state light-emitting element and light source module
- 申请号：CN200810305465.2 申请日：2008-11-10
- 公开(公告)号：CN101740678A 公开(公告)日：2010-06-16
- 发明人： 吕英杰 , 江国丰 , 赖志铭
- 申请人： 富士迈半导体精密工业(上海)有限公司 , 沛鑫能源科技股份有限公司
- 申请人地址： 上海市松江区松江工业区西部科技工业园区文吉路500号
- 专利权人： 富士迈半导体精密工业(上海)有限公司,沛鑫能源科技股份有限公司
- 当前专利权人： 富士迈半导体精密工业(上海)有限公司,沛鑫能源科技股份有限公司
- 当前专利权人地址： 上海市松江区松江工业区西部科技工业园区文吉路500号
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L25/075 ; H01L23/36 ; H01L23/367 ; H01L23/373 ; F21S2/00 ; F21V29/00 ; F21V19/00 ; F21Y101/02
The invention relates to a solid state light-emitting element with good heat dispersion, which comprises a ceramic packing body and at least one solid state light-emitting chip, wherein the ceramic packing body is provided with a first surface, and the at least one solid state light-emitting chip is jointed with the ceramic packing body through the first surface; at least one first through hole is formed on the ceramic packing body, one end of the at least one first through hole penetrates through the first surface, and a first metal which is in thermal contact with the at least one solid state light-emitting chip is filled in the at least one first through hole; and the ceramic packing body comprises an aluminum oxide composite material containing silicon oxide. In addition, the invention also relates to a light source module comprising the solid state light-emitting element.