基本信息:
- 专利标题： 大功率LED灯及其制作方法
- 专利标题（英）：High-power LED lamp and manufacturing method thereof
- 申请号：CN201010293542.4 申请日：2010-09-27
- 公开(公告)号：CN101949500A 公开(公告)日：2011-01-19
- 发明人： 李志江 , 刘平 , 王立一
- 申请人： 深圳万润科技股份有限公司
- 申请人地址： 广东省深圳市光明新区光明街道圳美公常路雅盛科技工业园B3栋
- 专利权人： 深圳万润科技股份有限公司
- 当前专利权人： 深圳万润科技股份有限公司
- 当前专利权人地址： 广东省深圳市光明新区光明街道圳美公常路雅盛科技工业园B3栋
- 代理机构： 深圳市博锐专利事务所
- 代理人： 张明; 邓云鹏
- 主分类号： F21S2/00
- IPC分类号： F21S2/00 ; F21V5/08 ; H01L33/54 ; F21Y101/02
The invention discloses a high-power LED lamp and a manufacturing method thereof. The high-power LED lamp comprises an LED chip and a transparent packaging body covering the light emitting surface of the LED chip, wherein the curve of the outer surface of the transparent packaging body is defined by the formula (disclosed in the specification). The invention can change the inherent light spot distribution of the LED and ensures that the light spot distribution of the LED roughly forms a rectangle. The material packaged with the appearance can reduce the dependence on the application of secondary lens optics when the high-power LED is used as an application product, and moreover, the volume of the LED material is greatly reduced under the same effect, which is more beneficial to the use of the high-power LED in the aspect of the application products.
公开/授权文献:
- CN101949500B 大功率LED灯及其制作方法 公开/授权日：2011-06-29
IPC结构图谱:
| F | 机械工程；照明；加热；武器；爆破 |
| --F21 | 照明 |
| ----F21S | 非便携式照明装置或其系统 |
| ------F21S2/00 | 照明装置的系统，没有包含在大组F21S4/00至F21S10/00中，例如积木式结构的 |