
基本信息:
- 专利标题: 高精度温度传感器用NTC热敏芯片制作方法
- 专利标题(英):Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor
- 申请号:CN201010529612.1 申请日:2010-11-02
- 公开(公告)号:CN101995306A 公开(公告)日:2011-03-30
- 发明人: 段兆祥 , 杨俊 , 柏琪星 , 唐黎明 , 叶建开 , 黄亚桃
- 申请人: 肇庆爱晟电子科技有限公司
- 申请人地址: 广东省肇庆市端州区睦岗镇棠下工业区
- 专利权人: 肇庆爱晟电子科技有限公司
- 当前专利权人: 珠海爱晟医疗科技有限公司
- 当前专利权人地址: 广东省肇庆市端州区睦岗镇棠下工业区
- 代理机构: 广州新诺专利商标事务所有限公司
- 代理人: 华辉; 曹爱红
- 主分类号: G01K7/22
- IPC分类号: G01K7/22
The invention belongs to the technical field of electronic parts and components, in particular to a method for manufacturing a negative temperature coefficient (NTC) thermosensitive chip for a high-precision temperature sensor, comprising the following steps: (1) preparing NTC thermosensitive semiconductor ceramic powder; (2) forming/sintering into a strip shape; (3) encapsulating by utilizing glass; (4) testing the resistivity; (5) cutting based on the size; and (6) adding terminal electrodes. As for the NTC thermosensitive chip manufactured by the method in the invention, in high-precision temperature measuring application occasions, the precision of the resistance R and the precision of the material constant B are controlled within 0.3%, namely the temperature precision can be controlled at 0.1% DEG C, and the annual drift rate of electric properties ( the resistance R and the material constant B) is less than 0.1% after the chip is utilized in an application circuit, thus the NTC thermosensitive chip can preferably ensure that high-precision resistance adjustments is realized, and has good stability preferably.
公开/授权文献:
- CN101995306B 高精度温度传感器用NTC热敏芯片制作方法 公开/授权日:2012-10-10
IPC结构图谱:
G | 物理 |
--G01 | 测量;测试 |
----G01K | 温度测量;热量测量;未列入其他类目的热敏元件 |
------G01K7/00 | 以应用直接对热敏感的电或磁性元件为基础的温度测量 |
--------G01K7/02 | .应用热电元件,例如,热电偶 |
----------G01K7/22 | ..元件为非线性电阻,例如,热敏电阻 |