
基本信息:
- 专利标题: 多路静电释放保护器件的加工方法
- 专利标题(英):Processing method of multipath electrostatic discharge (ESD) protector
- 申请号:CN201210585611.8 申请日:2012-12-30
- 公开(公告)号:CN103107127A 公开(公告)日:2013-05-15
- 发明人: 黄冕
- 申请人: 深圳中科系统集成技术有限公司
- 申请人地址: 广东省深圳市南山区高新技术园中区深圳软件园4号楼601A号房
- 专利权人: 深圳中科系统集成技术有限公司
- 当前专利权人: 深圳中科系统集成技术有限公司
- 当前专利权人地址: 广东省深圳市南山区高新技术园中区深圳软件园4号楼601A号房
- 代理机构: 深圳市深佳知识产权代理事务所
- 代理人: 唐华明
- 主分类号: H01L21/768
- IPC分类号: H01L21/768
The invention discloses a processing method of a multipath electrostatic discharge (ESD) protector. The processing method of the multipath ESD protector comprises that N through holes are formed in a first base material which comprises a first conducting layer, a second conducting layer and a first insulating layer located between the first conducting layer and the second conducting layer; the N through holes are filled with conducting materials; pattern processing is carried out on the second conducting layer; pattern processing is carried out on the first conducting layer and/or blind grooves penetrating through the first conducting layer to the first insulating layer are machined on the first conducting layer, and a first resin layer is arranged on the first conducting layer; a protective layer is arranged on the first resin layer, N/2 blind holes penetrating from the protective layer to the first insulating layer are formed in the protective layer; the N/2 blind holes are filled with slurry; the protective layer is peeled from the first resin layer; and a protective upper body is arranged on the first resin layer. By means of the processing method, manufacturing cost of the ESD protector can be lowered, and safety of the ESD protector can be improved.
公开/授权文献:
- CN103107127B 多路静电释放保护器件的加工方法 公开/授权日:2015-08-19
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
------------H01L21/768 | ...利用互连在器件中的分离元件间传输电流 |