
基本信息:
- 专利标题: PCB板散热安装座
- 专利标题(英):PCB (Printed Circuit Board) heat dissipation mounting seat
- 申请号:CN201410731954.X 申请日:2014-12-06
- 公开(公告)号:CN104486930A 公开(公告)日:2015-04-01
- 发明人: 谭华强
- 申请人: 重庆市库格尔电子有限公司
- 申请人地址: 重庆市长寿区新市镇政府办公大楼第一楼1-30#
- 专利权人: 重庆市库格尔电子有限公司
- 当前专利权人: 重庆市库格尔电子有限公司
- 当前专利权人地址: 重庆市长寿区新市镇政府办公大楼第一楼1-30#
- 代理机构: 重庆强大凯创专利代理事务所
- 代理人: 黄书凯
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
The invention relates to the field of manufacturing of electronic products, in particular to a PCB (Printed Circuit Board) heat dissipation mounting seat. The mounting seat comprises a fixed seat, a heat conduction seat, a connector and a refrigerating board, wherein the connector and the refrigerating board are matched with a PCB heat dissipation lead-out pin; the connector is provided with a heat conduction pin; the heat conduction pin is connected to the heat conduction seat through the fixed plate; the heat conduction seat is embedded into the refrigerating board; side edges of a PCB are clamped on the fixed seat; the fixed seat is fixedly arranged on an outer frame; the outer frame is fixedly arranged on the refrigerating board; the refrigerating board comprises a upper supporting seat, a lower supporting seat and refrigerating fins; the refrigerating fins are slantwise, crosswise and fixedly arranged between the upper supporting seat and the lower supporting seat. The mounting seat has the beneficial effects that heat on the PCB is introduced into the refrigerating board for cooling, noise-free refrigeration can be realized, and the PCB is clamped through the outer frame and is prevented from shaking.
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
--------H05K7/20 | .便于冷却、通风或加热的改进 |