The invention discloses an integrated silicon condenser microphone. The integrated silicon condenser microphone comprises a shell, which is provided with at least one sound inlet hole, a substrate, which is provided with a hole, two or four MEMS (Micro-Elecro-Mechanical System) sensing elements, which are in seamless physical connection, an integrated circuit and sound cavities, wherein the sound cavities are formed by the two or four MEMS sensing elements and the substrate together, specifically, the sound cavities of the two or four MEMS sensing elements are symmetrically communicated through holes in the substrate, and through the symmetrical sound cavities, which are shared and arranged in the shell and are formed by the same sound inlet path relative to the position of each MEMS sensing element, the sound wave is input until a sound transmission path for an electric signal, which is converted by the sound wave through each MEMS sensing element, is fully symmetrical for each MEMS sensing element in the silicon microphone, wherein a sound inlet path is a path formed from the sound inlet hole in the shell to the sound cavities to a vibrating diaphragm of each MEMS sensing element; the integrated circuit is used for buffering/amplifying and outputting the electric signal, which is converted by sending the sound wave to each MEMS sensing element through the sound transmission path.