
基本信息:
- 专利标题: 一种LED复合玻璃基板的制造方法
- 专利标题(英):Manufacturing method for LED composite glass substrate
- 申请号:CN201410676604.8 申请日:2014-11-21
- 公开(公告)号:CN105679914A 公开(公告)日:2016-06-15
- 发明人: 程君 , 严敏 , 周鸣波
- 申请人: 程君 , 严敏 , 周鸣波
- 申请人地址: 北京市海淀区远大路远大园一区四号楼三单元B1F室
- 专利权人: 程君,严敏,周鸣波
- 当前专利权人: 环视先进数字显示无锡有限公司
- 当前专利权人地址: 北京市海淀区远大路远大园一区四号楼三单元B1F室
- 代理机构: 北京亿腾知识产权代理事务所
- 代理人: 陈惠莲
- 主分类号: H01L33/48
- IPC分类号: H01L33/48
The invention relates to a manufacturing method for an LED composite glass substrate. The manufacturing method comprises the steps of preparing a glass substrate, wherein the glass substrate has a flat upper surface and lower surface; performing adhesive dispensing in a preset position on the lower surface; preparing multiple single-color LED flip wafers; ranking the multiple single-color LED wafers; enabling the light-output surfaces of the graded multiple single-color LED wafers to be adhered to multiple pieces of first interleaving paper; performing reverse moulding on the multiple single-color LED wafers; after performing reverse moulding, enabling the electrode sides of the multiple single-color LED wafers to be adhered to second interleaving paper to form wafer arrays; performing a wafer-expansion operation on the second interleaving paper to enable the spacing among the multiple single-color LED wafers supported by the interleaving paper to achieve a set threshold value; enabling the light-output sides of the multiple single-color LED wafers on the second interleaving paper to be adhered to the lower surface of the glass substrate through adhesive dispensing; and performing adhesive-fixing and shaping to enable the electrode sides of the multiple single-color LED wafers to be arranged on the same horizontal plane to obtain the LED composite glass substrate.
公开/授权文献:
- CN105679914B 一种LED复合玻璃基板的制造方法 公开/授权日:2018-02-23