
基本信息:
- 专利标题: 一种复合LED玻璃基面板的封装工艺方法和面板
- 申请号:CN201510355325.6 申请日:2015-06-24
- 公开(公告)号:CN106299039B 公开(公告)日:2018-12-21
- 发明人: 程君 , 严敏 , 周鸣波
- 申请人: 程君 , 严敏 , 周鸣波
- 申请人地址: 北京市海淀区远大路远大园一区四号楼三单元B1F室
- 专利权人: 程君,严敏,周鸣波
- 当前专利权人: 环视先进数字显示无锡有限公司
- 当前专利权人地址: 北京市海淀区远大路远大园一区四号楼三单元B1F室
- 代理机构: 北京权泰知识产权代理事务所
- 代理人: 王道川
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L33/48 ; H01L25/13
The invention relates to a packaging technique of a composite LED glass panel and the panel. The packaging technique comprises the steps that a glass substrate is prepared, and the glass substrate comprises matrix pits for loading a plurality of LED wafers; the section of each pit in the matrix pits is in a rectangle or dovetail shape; the plurality of LED wafers are arranged into a wafer array according to the design; the positions of the plurality of LED wafers in the wafer array correspond to those of the pits in the matrix pits one by one; barrier structures of the matrix pits are manufactured and the matrix pits with the barrier structures are filled with a low glass powder solution or transparent glass paste; and the plurality of LED wafers are sucked up through suction nozzles of a vacuum suction nozzle matrix die head on a male die of a heating and cooling system and are transferred to the positions corresponding to female die, so that light-exiting surfaces of the plurality of LED wafers are combined with the low glass powder solution or transparent glass paste in the corresponding matrix pits; and the heating and cooling system is controlled to cool, so that the plurality of LED wafers are bonded to the corresponding matrix pits to obtain the composite LED glass panel.
公开/授权文献:
- CN106299039A 一种复合LED玻璃基面板的封装工艺方法和面板 公开/授权日:2017-01-04