
基本信息:
- 专利标题: 一种激光加工系统及方法
- 专利标题(英):Laser processing system and method
- 申请号:CN201511021911.3 申请日:2015-12-30
- 公开(公告)号:CN106938370A 公开(公告)日:2017-07-11
- 发明人: 徐文 , 宋春峰 , 王帆
- 申请人: 上海微电子装备有限公司
- 申请人地址: 上海市浦东新区张东路1525号
- 专利权人: 上海微电子装备有限公司
- 当前专利权人: 上海微电子装备(集团)股份有限公司
- 当前专利权人地址: 上海市浦东新区张东路1525号
- 代理机构: 上海思微知识产权代理事务所
- 代理人: 屈蘅; 李时云
- 主分类号: B23K26/38
- IPC分类号: B23K26/38 ; B23K26/064 ; B23K26/402 ; B23K26/70
The invention discloses a laser processing system and method. The laser processing system comprises a laser machine, an optical system, a sensor, a processor and a controller, wherein the laser machine is used for providing laser needed for processing, the optical system is arranged above a workpiece table and is used for adjusting the size of a laser spot, and projecting the adjusted laser spot onto the workpiece table, the sensor is arranged above the workpiece table and is used for collecting parameter information of workpiece material, the processor is connected with the sensor and is used for receiving and processing the parameter information acquired by the sensor to obtain the size of the laser spot needed by the workpiece material, and the controller is connected with the processor and is used for receiving the information of the processor to control the optical system. According to the laser processing system, the parameter information of the workpiece material is collected in real time through the sensor, the required size of the laser spot is calculated through the processor, the laser pulse energy density is adjusted in real time by adopting the controller to control the optical system to change the size of the laser spot, so that the real-time performance is good, and the cutting efficiency is high; and in the cutting process, the laser machine outputs lasers at the rated laser power all the time, and the utilization rate of laser energy is improved.
公开/授权文献:
- CN106938370B 一种激光加工系统及方法 公开/授权日:2019-12-24
IPC结构图谱:
B | 作业;运输 |
--B23 | 机床;不包含在其他类目中的金属加工 |
----B23K | 钎焊或脱焊;焊接;用钎焊或焊接方法包覆或镀敷;局部加热切割,如火焰切割;用激光束加工 |
------B23K26/00 | 用激光束加工,例如焊接,切割,打孔 |
--------B23K26/36 | .除掉材料 |
----------B23K26/38 | ..利用镗孔或切削 |