
基本信息:
- 专利标题: 笔记本散热模组的散热板体与铜片组件
- 专利标题(英):Heat dissipation plate body and sheet copper component for heat dissipation mould of notebook computer
- 申请号:CN201320802175.5 申请日:2013-12-08
- 公开(公告)号:CN203706078U 公开(公告)日:2014-07-09
- 发明人: 项彬
- 申请人: 重庆侨成科技发展有限公司
- 申请人地址: 重庆市铜梁县工业园区蒲吕工业园
- 专利权人: 重庆侨成科技发展有限公司
- 当前专利权人: 重庆侨成科技发展有限公司
- 当前专利权人地址: 重庆市铜梁县工业园区蒲吕工业园
- 代理机构: 重庆市前沿专利事务所
- 代理人: 谭小容
- 主分类号: G06F1/20
- IPC分类号: G06F1/20
The utility model discloses a heat dissipation plate body and sheet copper component for a heat dissipation mould of a notebook computer. The component comprises a heat collecting plate (1) and a sheet copper (2), wherein the heat dissipation plate (1) is a rectangular plate, and a rectangular hole (1a) is formed in the middle of the rectangular plate in the long direction; convex hulls (3) are arranged on both sides of the long edge of the rectangular hole (1a); both sides of the sheet copper (2) are riveted to the lower surfaces of the convex hulls (3) on both sides of the rectangular hole (1a); a baffle (4) is arranged on one side, which is close to the rectangular hole (1a), of each convex hull, and downward bends (5) are respectively arranged on the left side and the right side of the heat dissipation plate (1); mounting journal stirrups (6) are respectively arranged at both ends of the bends (5) on the left side and the right side of the heat dissipation plate (1); mounting holes (7) are formed in the mounting journal stirrups (6). The component has the advantages of reasonableness in design, simple structure, easiness in implementation, convenience in use and assembly, good assembly intensity and good heat dissipation effect.