
基本信息:
- 专利标题: 配线基板
- 专利标题(英):Wiring substrate
- 申请号:CN201290000940.5 申请日:2012-06-18
- 公开(公告)号:CN204014248U 公开(公告)日:2014-12-10
- 发明人: 斋藤孝夫
- 申请人: 三洋电机株式会社
- 申请人地址: 日本国大阪府守口市京阪本通2丁目5番5号
- 专利权人: 三洋电机株式会社
- 当前专利权人: 三洋电机株式会社
- 当前专利权人地址: 日本国大阪府守口市京阪本通2丁目5番5号
- 代理机构: 中科专利商标代理有限责任公司
- 代理人: 雒运朴
- 国际申请: PCT/JP2012/065449 2012.06.18
- 国际公布: WO2013/190604 JA 2013.12.27
- 进入国家日期: 2014-04-30
- 主分类号: H05K1/02
- IPC分类号: H05K1/02
An object of the utility model is to provide a wiring substrate; and even if lengths of wiring patterns become longer or the widths of the wiring patterns become wider, the wiring substrate can block up holes in the wiring pattern, and heating inhibition becomes easier. The wiring substrate (1) is equipped with a plurality of electronic parts and provided with the wiring patterns (2) for current circulation between the electronic parts, solders of the electronic parts are connected to the wiring patterns (2) through soldering, the wiring patterns (2) are provided with a plurality of long holes (3) along the flow of current, the long holes (3) in the current circulation direction form a first long-hole column (31) and a second long-hole column (32), the second long-hole column (32) and the first long-hole column (31) are arranged side by side, the long holes of the second long-hole column (32) and the continuous long holes of the first long-hole column (31) are oppositely disposed, and the solders (8) are used to block up the long holes of the first long-hole column (31) and the long holes of the second long-hole column (32).
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K1/00 | 印刷电路 |
--------H05K1/02 | .零部件 |