基本信息:
- 专利标题： 配线基板
- 专利标题（英）：Wiring substrate
- 申请号：CN201290000939.2 申请日：2012-05-30
- 公开(公告)号：CN204014279U 公开(公告)日：2014-12-10
- 发明人： 斋藤孝夫 , 大岛诚
- 申请人： 三洋电机株式会社
- 申请人地址： 日本国大阪府守口市京阪本通2丁目5番5号
- 专利权人： 三洋电机株式会社
- 当前专利权人： 三洋电机株式会社
- 当前专利权人地址： 日本国大阪府守口市京阪本通2丁目5番5号
- 代理机构： 中科专利商标代理有限责任公司
- 代理人： 雒运朴
- 国际申请： PCT/JP2012/063837 2012.05.30
- 国际公布： WO2013/179403 JA 2013.12.05
- 进入国家日期： 2014-04-30
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01R4/02 ; H01R4/38
The utility model provides a wiring substrate which can inhibit heating in a terminal block installed on the wiring substrate. The wiring substrate (10) is equipped with a wiring pattern (11), the terminal block (13) which is provided with feet (31) and is formed through folding of a plate component capable of being welded, welding parts (14) which are used to connected the wiring pattern (11) and the terminal block (13) configured on the wiring pattern, and through holes (12) disposed in the welding part (14) and used for the feet (31) to be plugged into; the feet (31) are plugged into the through holes (12) to perform welding connections; the wiring substrate (10) is further equipped with metal wires (17) which are configured on the welding parts (14) along the terminal block (13) and which can be welded; and, when welding is performed, the welding parts (14), the terminal block (13) and the metal wires (17) are welded in an integral manner by utilizing solders supplied via the through holes (12).
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/18 | .在结构上与非印制电元件相联接的印刷电路 |