
基本信息:
- 专利标题: 框构件
- 专利标题(英):Frame component
- 申请号:CN201620066730.6 申请日:2016-01-22
- 公开(公告)号:CN205542871U 公开(公告)日:2016-08-31
- 发明人: 三田亮太 , 北山善彦
- 申请人: 日东电工株式会社
- 申请人地址: 日本大阪府
- 专利权人: 日东电工株式会社
- 当前专利权人: 日东电工株式会社
- 当前专利权人地址: 日本大阪府
- 代理机构: 北京林达刘知识产权代理事务所
- 代理人: 刘新宇; 张会华
- 优先权: 2015-011100 2015.01.23 JP; 2015-243559 2015.12.14 JP
- 主分类号: H01L33/48
- IPC分类号: H01L33/48 ; H01L33/50 ; H01L33/52
The utility model provides a frame component, its pollution that can prevent component on every side. Frame component is used for utilizing the sealing layer that is formed by sealing material to seal light semiconductor component's frame component. Frame component includes: the 1st frame portion, its mode in order to form the 1st space constitutes, the 2nd frame portion, it separates the interval with the outside in the 1st frame portion and the 1st frame portion and form the mode configuration in the 2nd space between its and the 1st frame portion to with the mode configuration of surrounding the 1st frame portion, binding portion, its be used for with the 1st frame portion with the 2nd frame portion links up. The 1st space supplies sealing layer and the configuration of light semiconductor component. The remaining part outside the part of smooth semiconductor component's sealing layer has been sealed in formation that the 2nd space is arranged in accomodating sealing material.