The utility model discloses a problem of the thermal diffusivity of the occasion of the base plate that the control substrate that improve to make the base plate (power base plate) of having installedthe power semiconductor that handles big electric power etc. And be used for handling little electric power becomes one etc. The utility model discloses constitute heat radiation substrate (100), ithas disposed on one side of the fitting up face and has been formed with base plate (110) that are used for installing electronic parts's circuit, and whole or partly configuration radiators (170) ofback one side of fitting up face one side of base plate are followed back one side orientation of base plate (110) fitting up face one side sets up hole portion (120), hole portion (120) by formed into hole portion fitting up face one side is not still link up the base plate is being used for the constitution to be in by formation the lower part of the conductor membrane of the circuit of fittingup face one side leaves thin and thick portion (T), sets up conductor (180) of erectting the setting from above -mentioned radiator (170) in the inside of above -mentioned hole portion (120), and thesetting has obturator (190) of thermal conductivity between internal surface through the inboard in above -mentioned hole portion (120) and above -mentioned conductor (180) for can come from effectively the heat dissipation of heat radiation substrate (100).