基本信息:
- 专利标题： MULTI-BAND INTERCONNECT FOR INTER-CHIP AND INTRA-CHIP COMMUNICATIONS
- 专利标题（中）：多芯片互连和芯片间通信
- 申请号：US13965077 申请日：2013-08-12
- 公开(公告)号：US20140044157A1 公开(公告)日：2014-02-13
- 发明人： Mau-Chung Chang , Sai-Wang Tam , Gyung-Su Byun , Yanghyo Kim , Kanit Therdsteerasukdi , Jeremy Ir , Glenn Reinman , Jingsheng Cong
- 申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- 申请人地址： US CA Oakland
- 专利权人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- 当前专利权人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- 当前专利权人地址： US CA Oakland
- 主分类号： H04L25/02
- IPC分类号： H04L25/02 ; H04L27/04
摘要：
Systems, apparatus, modules, and methods of communicating with memory devices utilizing multi-band communication containing a baseband and one or more amplitude shift keyed (ASK) RF channels over each differential pair of off-chip transmission lines. Configurations are described for interfacing between microprocessors, or controllers and memory devices or modules, and within a DIMM and its DRAM devices, and between multiple DIMM memory modules.
摘要（中）：
使用包含基带和一个或多个幅移键控（ASK）RF信道的多频带通信的存储器件进行通信的系统，装置，模块和方法，每个差分对的芯片外传输线路。 描述了用于在微处理器或控制器和存储设备或模块之间以及在DIMM及其DRAM设备内以及在多个DIMM存储器模块之间进行接口的配置。