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91. 发明公开

KR1020070041369A 전자소자의 생산방법 失效
标题翻译：制造电子元件的方法
公开(公告)号：KR1020070041369A
公开(公告)日：2007-04-18
申请号：KR1020060099492
申请日：2006-10-12
申请人： 르네사스 일렉트로닉스 가부시키가이샤
发明人： 이노마타데루지 , 스기우라마사토시
IPC分类号： H01L21/60
CPC分类号： B23K3/0692 , B23K2201/40 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H05K3/3484 , H05K3/3494 , H05K2203/043 , H05K2203/1476 , H01L2224/05599
摘要： 본 발명은 땜납 속의 보이드(void)를 감소시키고 땜납을 확실히 용융시킬 수 있는 전자소자의 생산방법을 제공한다. 위의 전자소자는 금속접합(전극 (11))을 가진 요소(기판(1))을 포함하는 것으로서, 위의 전자소자의 생산방법은,
위의 접합(전극(11))에 용제, 수지성분, 활성제 및 용가재를 포함한 땜납(5)을 공급하는 단계와; 제1가열온도로 소정의 시간동안 땜납에 열을 가하고 유지하는 제1가열공정을 수행하는 단계와; 용제와 수지성분을 증발시키기 위해 제1가열온도보다 높은 제2가열온도로 일정시간동안 땜납에 열을 가하고 유지하는 제2가열공정을 수행하는 단계; 및 땜납에 열을 가하여 땜납을 녹이는 제3가열공정을 수행하는 단계; 를 포함하여 구성된다.
땜납, 반도체소자, 땜납범프, 보이드(void), 산화막, 접합

92. 发明公开

EP2671661A4 SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT 有权
标题翻译： LÖTVORRICHTUNG以外地区SOWIE DAMIT HERGESTELLTES SUBSTRAT UND ELEKTRONISCHE KOMPONENTE
公开(公告)号：EP2671661A4
公开(公告)日：2016-04-27
申请号：EP12829099
申请日：2012-04-14
申请人： TANIGUROGUMI CORP
发明人： TANIGURO KATSUMORI
IPC分类号： B23K1/018 , B23K1/08 , B23K1/20 , B23K35/26 , H05K3/34
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/20 , B23K1/206 , B23K3/0692 , H01L2924/14 , H05K1/0296 , H01L2924/00

93. 发明公开

EP2157841A1 SOLDER BALL MOUNTING METHOD 审中-公开
标题翻译： MONTAGEGERÄTFÜREINELÖTKUGEL
公开(公告)号：EP2157841A1
公开(公告)日：2010-02-24
申请号：EP08811125.7
申请日：2008-09-24
申请人： IBIDEN CO., LTD.
发明人： SAWA, Shigeki , TANNO, Katsuhiko , KIMURA, Osamu , KURIBAYASHI, Koji
IPC分类号： H05K3/34
CPC分类号： H05K3/3478 , B23K3/0623 , B23K3/0692 , B23K2201/36 , H05K3/3489 , H05K2203/041 , H05K2203/0485 , H05K2203/0557
摘要： A flux 79 is applied on each connection pad group 75g except for a contact portion between a spacer 86 and a printed wiring board 10. For this reason, the flux is not attached on the spacer 86. Therefore, when the mask is detached from the printed wiring board, the printed wiring board needs not to be inverted, and damage to the solder resist layer 70 cannot be occur. In addition, the heights of the solder ball 78 and the upper surface of the mask 80 are equalized by using the spacer 86, so that it is possible to surely load the solder balls one by one on the electrode pad 75 and to reduce a probability of occurrence of defects that solder balls are not loaded or that a plurality of the solder balls are loaded.
摘要翻译：除了间隔件86和印刷电路板10之间的接触部分之外，在每个连接焊盘组75g上施加焊剂79.因此，焊剂未附着在间隔件86上。因此，当将掩模从印刷电路板，印刷电路板不需要反转，并且不能发生对抗焊剂层70的损坏。此外，焊球78的高度和掩模80的上表面通过使用间隔件86相等，使得可以将焊球一个接一个地可靠地装载在电极焊盘75上并且降低概率发生焊球未装载的缺陷或多个焊球被装载的情况。

94. 发明授权

EP1144150B1 METHOD AND APPARATUS FOR DISPENSING MATERIAL IN A PRINTER 有权
标题翻译：方法和装置用于分配材料的打印机
公开(公告)号：EP1144150B1
公开(公告)日：2006-05-31
申请号：EP00908338.7
申请日：2000-01-21
申请人： Speedline Technologies, Inc.
发明人： ROSSMEISL, Mark , FREEMAN, Gary , BALOG, Robert, J.
IPC分类号： B23K3/06
CPC分类号： B23K3/0692 , B23K3/0607 , B23K2201/36 , H05K3/1233 , H05K3/3484 , H05K2203/0126 , H05K2203/0783 , H05K2203/1105
摘要： A printer (10) for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer (10) includes a frame (12), a device, mounted to the frame (12), having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber (110) to contain the viscous material to be printed on the substrate. The chamber (110) has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame (12), positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

95. 发明公开

EP1144150A1 METHOD AND APPARATUS FOR DISPENSING MATERIAL IN A PRINTER 有权
标题翻译：方法和装置用于分配材料的打印机
公开(公告)号：EP1144150A1
公开(公告)日：2001-10-17
申请号：EP00908338.7
申请日：2000-01-21
申请人： Speedline Technologies, Inc.
发明人： ROSSMEISL, Mark , FREEMAN, Gary , BALOG, Robert, J.
IPC分类号： B23K3/06
CPC分类号： B23K3/0692 , B23K3/0607 , B23K2201/36 , H05K3/1233 , H05K3/3484 , H05K2203/0126 , H05K2203/0783 , H05K2203/1105
摘要： A printer (10) for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer (10) includes a frame (12), a device, mounted to the frame (12), having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber (110) to contain the viscous material to be printed on the substrate. The chamber (110) has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame (12), positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

96. 发明公开

EP0669857A1 METHOD AND APPARATUS FOR SOLDERING CIRCUIT BOARDS 失效
标题翻译：方法和设备进行焊接印刷电路板。
公开(公告)号：EP0669857A1
公开(公告)日：1995-09-06
申请号：EP94900343.0
申请日：1993-09-20
申请人： VELIE CIRCUITS, INC.
发明人： VELIE, Larry N.
IPC分类号： B23K3 , H05K3
CPC分类号： B23K3/0692 , B23K3/0653 , B23K2201/42 , H05K3/3452 , H05K3/3468 , H05K2203/0143 , H05K2203/0278 , H05K2203/1509
摘要： A method and apparatus for depositing solder on the terminal pads (10) of printed circuit boards (12) in which a solder resist layer (16) or layers (16, 17) having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir (58) is directed by nozzles (72) against the sides of the board (12) to fill the cavities extending above the terminal pads while the board (12) is moving via a conveyor mechanism relative to the reservoir (58). The cavities when filled with molten solder are covered by a suitable element such as a flexible belt (52) or roller. The molten solder within the covered cavities is then cooled below its solidification point and the covering element removed. If desired, part or all of the solder resist layer (16) or layers (16, 17) may then be stripped from the board (12) to leave solder pads extending above the surface of the board (12).

97. 发明授权

EP0498828B1 SOLDER LEVELLER 失效
标题翻译：焊料调平。
公开(公告)号：EP0498828B1
公开(公告)日：1995-06-14
申请号：EP90916164.8
申请日：1990-11-02
申请人： LYMN, Peter Philip Andrew
发明人： LYMN, Peter Philip Andrew
IPC分类号： B23K3/06
CPC分类号： B23K3/0692 , B23K3/0646 , H05K3/3468
摘要： A horizontal solder leveller for applying solder to a board comprises: means (15u, 151; 16u, 161; 17u, 171) including a solder bath (1) for applying molten solder (2) to a board; means (47) for levelling solder applied to the board, including nozzles for directing solder-levelling air jets at the board; and means (19u, 191, 48) for creating a dispersion of oil in an air stream from the levelling means, the oil dispersion means being provided between the solder applying means and the levelling means.

98. 发明公开

EP0637057A1 Method and apparatus for depositing metal fine lines on a substrate 失效
标题翻译： Vorrichtung und Verfahren um feine Metal-linie auf einem Substrat abzulegen。
公开(公告)号：EP0637057A1
公开(公告)日：1995-02-01
申请号：EP93480106.9
申请日：1993-07-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , ORSAY PHYSICS
发明人： Corbin, Antoine , Foulu, Jacques , Demoncy, Philippe , Sudraud, Pierre
IPC分类号： H01L21/00 , B23K3/06
CPC分类号： H01L21/67011 , B23K3/02 , B23K3/0615 , B23K3/0692 , G03F1/74 , H01L21/76838 , H01L21/76892 , H01L31/022425 , H05K3/1241 , Y02E10/50 , Y10S977/857
摘要： This invention is concerned with the method and apparatus for forming a desired pattern of a material of either the conductive or non conductive type on a great variety of substrates. It is based on the use of a pen which essentially consists of a refractory tip wetted with the material in the molten state. The pen (10) first consists of a pointed tungsten tip (11) attached, e.g. by micro welding, to the top of a V-shaped tungsten heater (12), forming an assembly (14). The tip and the heater top portion are roughened at the vicinity of the welding point (13). In turn, the extremities of the V-shaped heater are welded to the pins (16, 16') of a 3-lead TO-5 package base (15). The pen (10) is incorporated in an apparatus adapted to the direct writing technique. To that end, the pen is attached to a supporting device capable of movements in the X, Y and Z directions, while the substrate is placed on an X-Y stage for adequate X, Y and Z relative movements therebetween. The two pins of the pen are connected to a power supply to resistively heat the heater. When the welding point of the tip/heater assembly reaches the melting point temperature of the material to be deposited, it is dipped in a crucible containing the said material in the molten state. The welding point nucleates a minute drop of the liquid material thus forming a reservoir. A thin film of the liquid material flows from the reservoir and wets the whole tip surface. Finally, the wetted tip is gently brought into contact with the substrate and deposition of the material can take place, as soon as the substrate is adequately moved, to produce the said desired pattern.
摘要翻译：本发明涉及用于在各种基板上形成导电或非导电类型的材料的期望图案的方法和装置。它基于使用笔，其基本上由在熔融状态下被材料润湿的耐火顶端组成。笔（10）首先由附着的尖头钨尖（11）组成。通过微焊接到V形钨加热器（12）的顶部，形成组件（14）。尖端和加热器顶部在焊接点（13）附近被粗糙化。依次将V形加热器的末端焊接到3引脚TO-5封装基座（15）的引脚（16,16'）上。笔（10）被并入适用于直写技术的装置中。为此，将笔连接到能够在X，Y和Z方向上移动的支撑装置，同时将基板放置在X-Y台上以使它们之间有足够的X，Y和Z相对运动。笔的两个引脚连接到电源以电阻加热加热器。当尖端/加热器组件的焊接点达到要沉积的材料的熔点温度时，将其浸入含有熔融状态的所述材料的坩埚中。焊接点使液滴物料滴下一小滴，从而形成储存器。液体材料的薄膜从储存器流出并润湿整个尖端表面。最后，一旦衬底被充分移动，润湿的尖端就轻轻地与衬底接触并且材料的沉积可以发生，以产生所需的图案。

99. 发明授权

EP0322859B1 Method and apparatus for solder coating of leads 失效
标题翻译：焊接涂料的方法和装置
公开(公告)号：EP0322859B1
公开(公告)日：1993-05-19
申请号：EP88121720.2
申请日：1988-12-27
申请人： FUJI SEIKI MACHINE WORKS, LTD.
发明人： Makino, Shinichi , Kojima, Naokatsu
IPC分类号： B23K3/06 , H01L21/00
CPC分类号： H01L21/67144 , B23K3/0692 , H01R43/0235

100. 发明专利

TW200807585A 電子元件之製造方法 METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT 审中-公开
简体标题：电子组件之制造方法 METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT
公开(公告)号：TW200807585A
公开(公告)日：2008-02-01
申请号：TW095136915
申请日：2006-10-04
申请人： NEC電子股份有限公司 NEC ELECTRONICS CORPORATION
发明人： 輝司 INOMATA, TERUJI , 杉浦正俊 SUGIURA, MASATOSHI
IPC分类号： H01L
CPC分类号： B23K3/0692 , B23K2201/40 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H05K3/3484 , H05K3/3494 , H05K2203/043 , H05K2203/1476 , H01L2224/05599
摘要：提供一種電子元件的製造方法,其可降低焊料中的孔隙並可可靠地熔化焊料。包含具有金屬接面(電極11)之構件(基板1)之電子元件的製造方法包含下列步驟:將包含溶劑、樹脂成分、催化劑及焊接填充金屬之焊料5供給至接面(電極11)的步驟;第一加熱步驟,在其中對該焊料5施行第一加熱處理並將焊料5維持在第一加熱溫度持續一段預定時間;第二加熱步驟,在其中對該焊料5施行第二加熱處理並將焊料5維持在高於第一加熱溫度的第二加熱溫度持續一段預定時間,以蒸發溶劑及樹脂成分;及第三加熱步驟,在其中對該焊料5施行第三加熱處理而使焊料5熔化。
简体摘要：提供一种电子组件的制造方法,其可降低焊料中的孔隙并可可靠地熔化焊料。包含具有金属接面(电极11)之构件(基板1)之电子组件的制造方法包含下列步骤:将包含溶剂、树脂成分、催化剂及焊接填充金属之焊料5供给至接面(电极11)的步骤;第一加热步骤,在其中对该焊料5施行第一加热处理并将焊料5维持在第一加热温度持续一段预定时间;第二加热步骤,在其中对该焊料5施行第二加热处理并将焊料5维持在高于第一加热温度的第二加热温度持续一段预定时间,以蒸发溶剂及树脂成分;及第三加热步骤,在其中对该焊料5施行第三加热处理而使焊料5熔化。

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