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    • 92. 发明申请
    • COOLED DARK SPACE SHIELD FOR MULTI-CATHODE DESIGN
    • 冷藏深色空间屏蔽多阴极设计
    • US20080017501A1
    • 2008-01-24
    • US11780474
    • 2007-07-20
    • Makoto INAGAWA
    • Makoto INAGAWA
    • C23C14/34C23C14/04C23C14/50
    • C23C14/3407H01J37/34H01J37/3408H01J37/3435H01J37/3441H01J37/3497
    • A cooled dark space shield for a multi-cathode, large area PVD apparatus is disclosed. For multi-cathode systems, a dark space shield between adjacent cathodes/targets may be beneficial. The shields may be grounded and provide a path to ground for electrons present within a sputtering plasma. Because the shields are between adjacent targets, the grounded shields may contribute to the formation of a uniform plasma within the processing space by acting as anodes. As the temperatures in the chamber fluxuate between a processing temperature and a downtime temperature, the shields may expand and contract. Cooling the shields reduces the likelihood of expansion and contraction and thus, reduces the amount of flaking that may occur. Embossing the surface of the shields may reduce the amount of material deposited onto the shields and control the expansion and contraction of the shields.
    • 公开了一种用于多阴极,大面积PVD装置的冷却的暗空间屏蔽。 对于多阴极系统,相邻阴极/靶之间的暗空间屏蔽可能是有益的。 屏蔽层可以接地,并为溅射等离子体中存在的电子提供到地面的路径。 由于屏蔽层位于相邻的目标之间,所以接地的屏蔽件可能通过作为阳极而有助于在处理空间内形成均匀的等离子体。 当室内的温度在加工温度和停机温度之间流动时,屏蔽件可能膨胀和收缩。 冷却屏蔽减少膨胀和收缩的可能性,从而减少可能发生的剥落量。 压印屏蔽表面可能会减少沉积在屏蔽上的材料的数量并控制屏蔽层的膨胀和收缩。
    • 95. 发明授权
    • High-power ion sputtering magnetron
    • 大功率离子溅射磁控管
    • US06841051B2
    • 2005-01-11
    • US10763627
    • 2004-01-23
    • Daniel T. Crowley
    • Daniel T. Crowley
    • C23C14/34H01J37/34C23C14/35
    • H01J37/3411H01J37/3405H01J37/3497
    • A high-power ion sputtering magnetron having a rotary cathode comprising a conducting member disposed within the rotary cathode being made of an electrically conductive material for conducting electrical current from the power supply to the rotary cathode. The ion sputtering magnetron also has an electromagnetic field shield disposed between the conducting member and the drive shaft portion. The field shield is made of an electromagnetic field-permeable material such as a ferrous material for reducing damage to parts adjacent to the conducting member that are susceptible to inductive magnetic heating.
    • 具有旋转阴极的高功率离子溅射磁控管,其包括设置在旋转阴极内的导电构件,其由用于将电流从电源传导到旋转阴极的导电材料制成。 离子溅射磁控管还具有设置在导电构件和驱动轴部分之间的电磁场屏蔽。 场屏蔽由诸如铁类材料的电磁场可透过材料制成,用于减少对导电构件附近的对感应磁加热敏感的部件的损坏。
    • 97. 发明授权
    • Sputtering apparatus with isolated coolant and sputtering target therefor
    • 具有隔离冷却剂和溅射靶的溅射装置
    • US06689254B1
    • 2004-02-10
    • US08439490
    • 1995-05-11
    • Steven Hurwitt
    • Steven Hurwitt
    • C23C1434
    • H01J37/3435C23C14/3407C23C14/35C23C14/54H01J37/34H01J37/3408H01J37/3414H01J37/3423H01J37/3455H01J37/3458H01J37/3497
    • A sputtering apparatus is provided with a cathode assembly formed of a cathode unit having a moveable magnet assembly and a cooling water source therein, and a removable target assembly that includes a replaceable target unit and a removable and preferably reusable cooling jacket that seals to the rear face of the target unit and encloses a cooling cavity therebetween. Ducts are configured to automatically disconnect and reconnect the cooling cavity to the water source when the target assembly is removed from and reconnected in the cathode assembly. The target unit includes a volume of sputtering material on which is a front sputtering face, and has a recessed rim surrounding the sputtering face. The rim is configured to form a vacuum seal to the wall of a sputtering chamber and a water seal to the cooling jacket. Thereby, the magnet assembly is isolated from contact with the cooling liquid. A central connection, preferably in the form of a projecting hub, is centered at the target unit back and connects to a shaft in the cathode assembly to support the target material against distortion from pressure and heat variances, generally tending to force the center of the target into the processing chamber. Preferably, the target is formed of an integral piece of sputtering material, where the material permits, and otherwise the rim and hub may be part of a backing plate bonded to the target material to form the target unit. In either event, the back of the target unit is intrinsically, or is coated or otherwise treated to be, impermeable to contamination from the cooling water.
    • 溅射装置设置有由阴极单元形成的阴极组件,阴极单元具有可移动的磁体组件和冷却水源,以及可移除的目标组件,其包括可更换的目标单元和可拆卸且优选地可重复使用的冷却套,其密封到后部 目标单元的表面并且在其间包围冷却腔。 管道被配置为当目标组件从阴极组件中移出并重新连接时自动断开并重新连接冷却腔至水源。 目标单元包括溅射材料的体积,其上是前溅射面,并且具有围绕溅射面的凹陷边缘。 轮辋构造成对溅射室的壁形成真空密封,并将冷却套的水封形成真空密封。 由此,磁体组件与冷却液接触隔离。 优选地以突出轮毂的形式的中心连接在目标单元的后面中心并且连接到阴极组件中的轴以支撑目标材料以防止来自压力和热变化的变形,通常倾向于迫使 目标进入处理室。 优选地,目标由整体的溅射材料形成,其中材料允许,否则边缘和轮毂可以是结合到目标材料的背板的一部分以形成目标单元。 在任一情况下,目标单元的背面本质上或被涂覆或以其他方式被处理为不可渗透的来自冷却水的污染物。
    • 99. 发明授权
    • Sputtering cathode
    • 溅射阴极
    • US06171461B2
    • 2001-01-09
    • US09009219
    • 1998-01-20
    • Mark A. Bernick
    • Mark A. Bernick
    • C23C1434
    • H01J37/3497C23C14/3407H01J37/3408
    • A magnetron sputtering electrode for use within a magnetron sputtering device having more uniform cooling of the target with the use of a water chamber including water diverters to establish a turbulent water flow within the water chamber. The electrode also includes a direct power coupling to the cathode body to avoid degradation of the power supplied to the electrode. The electrode further includes introduction of process gas in an interstitial space between the anode shield and the cathode shield. The electrode also includes the use of removable shaped magnets providing improved target utilization and run times and a choice of erosion pattern and balanced or unbalanced sputtering by simple magnet substitution. In one embodiment, the invention includes the use of a threaded anode shield and a threaded cathode shield which significantly reduces the overall electrode size for a given target diameter.
    • 一种用于磁控溅射装置的磁控溅射电极,其具有使用包括水分配器的水室更均匀地冷却靶材,以在水室内建立湍流水流。 电极还包括与阴极体的直接电力耦合,以避免供给电极的功率的劣化。 电极还包括在阳极屏蔽和阴极屏蔽之间的间隙空间中引入工艺气体。 电极还包括使用可移除的成形磁体,其提供改善的目标利用率和运行时间,以及通过简单磁体替代选择侵蚀模式和平衡或不平衡溅射。 在一个实施例中,本发明包括使用螺纹阳极屏蔽和螺纹阴极屏蔽,其显着降低给定目标直径的总体电极尺寸。