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    • 92. 发明专利
    • Punching device, sheet processing device and image forming device
    • 打孔装置,片材加工装置和图像形成装置
    • JP2007062872A
    • 2007-03-15
    • JP2005248093
    • 2005-08-29
    • Ricoh Co Ltd株式会社リコー
    • TAMURA MASAHIROSUZUKI NOBUYASUNAGASAKO HIDEYANOMURA TOMOICHIMAEDA KEIJIKOBAYASHI KAZUHIROSATO SHOICHIKUNIEDA AKIRA
    • B65H37/04G03G15/00
    • B26D7/2614B26D5/00B26D5/16B26D7/00Y10T83/141Y10T83/148Y10T83/4473Y10T83/9411Y10T83/9457Y10T225/12Y10T225/30
    • PROBLEM TO BE SOLVED: To provide a punching device which is easily changed corresponding to the punching condition such as punched holes and the punching number, and capable of automatically recognizing the condition setting and the positioning during the change. SOLUTION: The punching device has a posture straightening means 7 for performing the skew correction and the tip alignment by butting tips of paper sheets, a punching means 8 having a punch for punching the paper sheets, and a transverse resist adjustment means capable of adjusting the position of the punch of the punching means 8 with respect to the paper sheets corrected in posture by the posture straightening means 7 before the punching by the punching means 8 in the direction orthogonal to the moving direction of the paper sheets. The punching means 8 is attachable/detachable to/from a fixed supporting part 33a having a drive source 21 of the transverse resist adjustment means, and has a configuration 16 capable of recognizing the kind of the punching means 8 when attached. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种冲孔装置,其可以根据冲孔等冲孔条件和冲孔数量而容易地改变,并且能够在更换期间自动识别条件设置和定位。 解决方案:冲压装置具有用于进行歪斜校正的姿势矫直装置7,以及用于冲压纸张的冲头的冲压装置8和具有用于冲压纸张的冲头的冲压装置8以及能够 通过冲压装置8在与纸张的移动方向正交的方向进行冲压之前,通过姿势矫直装置7调整冲压装置8的冲头相对于以姿势校正的纸张的位置。 冲压装置8可以从具有横向抗蚀剂调节装置的驱动源21的固定支撑部分33a附接/拆卸,并且具有能够在附着时识别冲压装置8的种类的构造16。 版权所有(C)2007,JPO&INPIT
    • 93. 发明专利
    • Wafer dividing apparatus
    • 波浪分拣装置
    • JP2006128211A
    • 2006-05-18
    • JP2004311317
    • 2004-10-26
    • Disco Abrasive Syst Ltd株式会社ディスコ
    • NAGAI YUSUKE
    • H01L21/301
    • H01L21/67132H01L21/67092H01L21/6838Y10T83/8773Y10T225/30Y10T225/329Y10T225/371
    • PROBLEM TO BE SOLVED: To provide a wafer dividing apparatus for dividing a wafer whose strength has been reduced along a scheduled division line accurately and reliably along the scheduled division line. SOLUTION: The wafer dividing apparatus divides the wafer, where strength is reduced along the schedule division line, along the schedule division line. The wafer dividing apparatus comprises a taper holding means for holding a protection tape affixed on one surface of the wafer, and a wafer rupturing means composed of first and second sucking/holding members having holding surfaces for sucking and holding the wafer held by the tape holding means via the protection tape at both sides of the schedule division line via the protection tape, and a moving means for moving the first and second sucking/holding members in a direction where the members are separated from each other. The holding surface of the first sucking/holding member and that of the second sucking/holding member are formed while being inclined in lower or upper directions toward mutually opposing side edges. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种用于沿着预定划分线精确可靠地沿着预定划分线分割强度已经减小的晶片的晶片分割装置。 解决方案:晶片分割装置沿着进度划分线分割沿着进度分割线减小强度的晶片。 晶片分割装置包括用于保持固定在晶片的一个表面上的保护带的锥形保持装置,以及由具有用于吸持和保持被保持的晶片的保持表面的第一和第二吸入/保持部件构成的晶片破裂装置 经由保护带通过保护带在调度分割线的两侧的装置;以及移动装置,用于沿着构件彼此分离的方向移动第一和第二吸入/保持构件。 形成第一吸引保持部件的保持面和第二吸引保持部件的保持面,同时沿相反的侧缘朝上下方向倾斜。 版权所有(C)2006,JPO&NCIPI
    • 97. 发明授权
    • 광파이버 절단 장치
    • 光纤切割装置
    • KR101056208B1
    • 2011-08-11
    • KR1020057021636
    • 2005-01-20
    • 스미토모 덴키 고교 가부시키가이샤
    • 혼마도시히코
    • G02B6/00G02B6/25
    • G02B6/25Y10T225/30
    • 작업 환경에 따르지 않고 단시간에 글라스 파이버 부분의 절단을 실행하는 광파이버 절단 장치를 제공한다. 광파이버의 글라스 파이버 부분을 고정하는 고정 부재와, 고정 부재로 고정된 글라스 파이버 부분에 흠을 내는 커터 부재와, 커터 부재를 이동시키는 탄성 부재와, 탄성 부재를 탄성 변형한 상태로 유지하는 유지 부재로 이루어진 광파이버 절단 장치가 제공된다. 또한, 광파이버의 글라스 파이버 부분을 고정하는 고정 부재와, 고정 부재로 고정된 글라스 파이버 부분에 흠을 내는 커버 부재와, 광파이버를 보호 피복의 부분에서 유지하는 홀더를 고정하는 홀더 고정 부재로 이루어지고, 홀더 고정부는 홀더에 커터 부재의 이동 방향과 평행으로 힘을 가하여 고정하는 제 1 홀더 고정 부재를 갖는 광파이버 절단 장치가 제공된다.
    • 提供一种不依赖于作业环境而在短时间内切断玻璃纤维部分的光纤切断装置。 和用于固定光纤的玻璃纤维部,该玻璃划伤通过固定构件切割构件,用于保持弹性件和用于切割构件在弹性变形状态下移动的弹性构件的保持构件,其固定所述纤维部的固定部件 提供光纤切割装置。 此外,形成了固定构件和划伤通过固定构件固定所述纤维部分的玻璃覆盖部件,以及保持器,用于固定一个夹具夹持在保护涂层的部分的光纤,用于固定光纤的玻璃纤维部固定部件的, 提供了一种光纤切割设备,其具有用于保持和固定与刀具部件的移动方向平行的保持器的力的第一保持器保持部件。
    • 98. 发明公开
    • 취성재료 기판 절단장치 및 절단방법
    • 用于切割脆性材料的基材的装置和方法
    • KR1020080011702A
    • 2008-02-05
    • KR1020077029427
    • 2006-05-26
    • 미쓰보시 다이야몬도 고교 가부시키가이샤
    • 니시사카유키오토다겐지이노우에슈이치구마가이도루
    • C03B33/033B28D5/00
    • C03B33/033B28D1/222B28D5/0011B28D5/0023B28D5/0029B65G2249/04Y02P40/57Y10T83/0333Y10T225/30Y10T225/325
    • A method and a device for cutting off a substrate of fragile material which can prevent the substrate of fragile material from being damaged or contaminated through contact by preventing contact of divided surfaces in a break process for cutting off the substrate of fragile material continuously. The device for cutting off a substrate of fragile material comprises dividing means (112, 122) for exerting a pressing force to the vicinity of a scribe line S formed on a substrate G and cutting off the substrate G at the pressed portion, and a holding portion moving substantially in parallel with the scribe line S while holding the dividing means to cut off the substrate G continuously along the scribe line S. The holding portion is provided with divided surface separating means (113, 123) for pressing at least one part of the divided substrate G while clamping it, and moving the substrate G substantially in parallel with the major surface thereof and in such a direction that the opposing divided surfaces obtained by cutting off separate from each other.
    • 一种用于切断易碎材料的基材的方法和装置,其可以通过防止在断裂过程中分开的表面的接触而使易碎材料的基底受到接触而损坏或污染,以连续地切断脆性材料的基底。 用于切断脆性材料的基板的装置包括用于对形成在基板G上的划刻线S附近施加按压力并且在按压部分处切断基板G的分割装置(112,122) 保持分割装置沿划线S连续切断基板G.保持部设有分割表面分离装置(113,123),用于将至少一部分 分割的基板G,同时夹持基板G,并且使基板G与其主表面大致平行并且使得通过彼此分离切割而获得的相对的分割表面的方向移动。
    • 99. 发明公开
    • 스크라이브 헤드 및 스크라이브 장치
    • SCRIBE HEAD AND SCRIBE DEVICE
    • KR1020060127103A
    • 2006-12-11
    • KR1020067015211
    • 2004-12-28
    • 미쓰보시 다이야몬도 고교 가부시키가이샤
    • 니시오요시타카
    • C03B33/027C03B33/033
    • C03B33/107B28D1/225C03B33/027C03B33/10Y02P40/57Y10T83/0333Y10T83/0393Y10T225/30Y10T225/325Y10T225/371
    • A scribe head has scribe line forming means (29) constructed to form a scribe line on a substrate and has moving means (502, 503) for moving the scribe line forming means such that the scribe line forming means presses the substrate by a load of a fixed magnitude. The moving means are composed of rotation means (502) and power transmitting means (503). The rotation means (502) is means rotating about a rotation shaft and is provided such that the axis of the rotation shaft is along a predetermined direction in which the scribe line forming means moves. The power transmitting means (503) is means for transmitting power between the rotation means and the scribe line forming means so that the scribe line forming means moves in a straight line along the axis of the rotation shaft depending on the rotation of the rotation means, and the power transmitting means (503) is provided along a predetermined direction.
    • 划线头具有划片线形成装置(29),其被构造成在基板上形成刻划线,并具有用于移动划线形成装置的移动装置(502,503),使得划线形成装置通过负载 一个固定的大小。 移动装置由旋转装置(502)和动力传递装置(503)构成。 旋转装置(502)是围绕旋转轴旋转并且设置成使得旋转轴的轴线沿着划线形成装置移动的预定方向的装置。 动力传递装置(503)是用于在旋转装置和划线形成装置之间传递动力的装置,使得划线生成装置根据旋转装置的旋转沿着旋转轴的轴线沿直线移动, 并且沿预定方向设置动力传递装置(503)。