专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明专利

JP4443121B2 Computer systems and methods that can avoid the impact of improper operation 有权
公开(公告)号：JP4443121B2
公开(公告)日：2010-03-31
申请号：JP2003020403
申请日：2003-01-29
申请人：神基科技股▲ふん▼有限公司
发明人：清泉陳
IPC分类号： G06F9/445 , G06F1/00 , G06F1/28 , G06F3/02 , G06F3/023 , G06F15/177 , H03M11/04 , H03M11/22
CPC分类号： G06F3/0227 , G06F1/28

12. 发明专利

JP4087405B2 Method and computer system of touch selection and quick execution of computer multimedia av Play 有权
标题翻译：空值
公开(公告)号：JP4087405B2
公开(公告)日：2008-05-21
申请号：JP2005336270
申请日：2005-11-21
申请人：神基科技股▲ふん▼有限公司
发明人：聖凱徐
IPC分类号： G06F3/048 , G06F3/041
CPC分类号： G06F3/04886 , Y10S715/961

13. 发明专利

JP2007073025A Method of fast switching control for operation systems in computer device including a plurality of operation systems 审中-公开
标题翻译：包括多种操作系统的计算机设备中操作系统的快速切换控制方法
公开(公告)号：JP2007073025A
公开(公告)日：2007-03-22
申请号：JP2005351458
申请日：2005-12-06
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： WANG SZU-CHUNG
IPC分类号： G06F9/445 , G06F1/00
CPC分类号： G06F9/4843 , G06F9/4406
摘要： PROBLEM TO BE SOLVED: To fast switch operation systems in a computer device including a plurality of operation systems. SOLUTION: A first OS (operating system) 171a, a second OS 172a and a second OS kernel program 172b are stored in a hard disk, and an event signal generation unit 24 is connected to the computer device 100. When the computer device 100 completes the booting process, the first OS 171a is loaded from the hard disk 17 and executed, a second OS kernel program memory region 141 is established in a system memory 14, and the second OS kernel program 172b is loaded thereto. When the computer device 100 detects that a preset event signal is generated from the event signal generation unit 24, the second OS kernel program 172b is executed, so that the computer device 100 is switched from executing the first OS 171a to executing the second OS 172a. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：在包括多个操作系统的计算机设备中快速切换操作系统。解决方案：第一OS（操作系统）171a，第二OS 172a和第二OS内核程序172b存储在硬盘中，并且事件信号生成单元24连接到计算机设备100.当计算机设备100完成引导过程，第一OS 171a从硬盘17加载并被执行，在系统存储器14中建立第二OS内核程序存储区域141，并且第二OS内核程序172b被加载到其中。当计算机设备100检测到从事件信号生成单元24生成了预设事件信号时，执行第二OS内核程序172b，使得计算机设备100从执行第一OS 171a切换到执行第二OS 172a 。版权所有（C）2007，JPO＆INPIT

14. 发明专利

JP2007037144A Sound source processing circuit structure and processing method therefor 有权
标题翻译：声源加工电路结构及其处理方法
公开(公告)号：JP2007037144A
公开(公告)日：2007-02-08
申请号：JP2006203067
申请日：2006-07-26
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： SAI SHII
IPC分类号： H03G5/16 , H03G3/34
CPC分类号： H03F3/72 , H03F3/181
摘要： PROBLEM TO BE SOLVED: To provide a sound source processing circuit structure, which is extended with a sound source signal sensor unit in sound source processing circuit structure, and its processing method. SOLUTION: This invention describes the sound source processing structure and its processing method, and is applied to AV equipment. The sound source processing circuit structure comprises at least the sound source signal sensor unit, an OR-circuit unit, and an AND-circuit unit and an amplifier unit. The sound source signal sensor unit further comprises a capacitor, a signal magnification circuit, a DC level correction circuit, a charging circuit and a switching circuit. The sound source signal sensor unit converts the signal of a distinct magnitude and frequency to a high-level or a low-level dc logical level signal. The high-level dc logical level signal shows an audio range signal, and the low-level dc logical signal shows noise. When noise is inputted, the sound source signal sensor unit outputs a muting control signal appropriately, makes an amplifier unit off, and inhibits output of the noise. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种利用声源处理电路结构中的声源信号传感器单元扩展的声源处理电路结构及其处理方法。解决方案：本发明描述了声源处理结构及其处理方法，并应用于AV设备。声源处理电路结构至少包括声源信号传感器单元，或电路单元，AND电路单元和放大器单元。声源信号传感器单元还包括电容器，信号放大电路，DC电平校正电路，充电电路和开关电路。声源信号传感器单元将不同幅度和频率的信号转换为高电平或低电平直流逻辑电平信号。高电平直流逻辑电平信号显示音频范围信号，低电平直流逻辑信号显示噪声。当输入噪声时，声源信号传感器单元适当地输出静音控制信号，使放大器单元关闭，并且抑制噪声的输出。版权所有（C）2007，JPO＆INPIT

15. 发明专利

JP2007034252A Method of displaying on-screen image display data, loading and executing off-screen computer program 有权
标题翻译：显示屏幕图像显示数据的方法，加载和执行远程屏幕计算机程序
公开(公告)号：JP2007034252A
公开(公告)日：2007-02-08
申请号：JP2005334025
申请日：2005-11-18
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： CHANG WEN-HUA
IPC分类号： G09G5/00
CPC分类号： G06F9/4401
摘要： PROBLEM TO BE SOLVED: To provide a method for displaying on-screen image data, loading and executing an off-screen computer program. SOLUTION: When a computer system detects that a hot key is operated, the computer system is activated and a BIOS of the computer system is executed. The BIOS loads, executes a drive program, loads the on-screen image data relevant to application programs set in the hot key and a display device displays the on-screen image data. The display device displays the on-screen image data, simultaneously loads, executes an operation system in off-screen and after completion of start of the operation system, loads and executes the hot key setting application program corresponding to the hot key. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于显示屏幕上图像数据，加载和执行离屏计算机程序的方法。
解决方案：当计算机系统检测到热键被操作时，计算机系统被激活，并且执行计算机系统的BIOS。 BIOS加载，执行驱动程序，加载与热键中设置的应用程序相关的屏幕上的图像数据，并且显示设备显示屏幕上的图像数据。显示装置显示屏幕图像数据，同时加载，在屏幕外执行操作系统，并且在操作系统启动完成之后，加载并执行与热键相对应的热键设置应用程序。版权所有（C）2007，JPO＆INPIT

16. 发明专利

JP2006245576A Bonding material and its production process 审中-公开
标题翻译：粘接材料及其生产工艺
公开(公告)号：JP2006245576A
公开(公告)日：2006-09-14
申请号：JP2006051278
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/373 , H01L23/36 , H05K7/20
CPC分类号： H01L21/4882 , B23K35/22 , B23K35/327 , C09J1/00 , H01L23/3732 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a bonding material being employed in a member of a cooler for a semiconductor device and exhibiting excellent thermal conductivity, and to provide its production process.
SOLUTION: The bonding material for bonding a cooling piece being bonded to a semiconductor device and receiving heat generated therefrom, and a cooling means such as fins at a mutual bonding part such as a conduit for conducting heat and enhancing thermal conductivity, comprises a metal of good thermal conductivity such as aluminium or copper and fine carbon powder of diamond-like structure. The metal is melted and dispersed and mixed uniformly with fine carbon powder of diamond-like structure, and a rodlike bonding material is produced from the molten by flocculation pulling method. Since diamond exhibits excellent thermal conductivity and wideband optical transparency, cooling performance of the cooler by heat conduction is enhanced.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于半导体器件的冷却器的构件中并且显示出优异的导热性的接合材料，并提供其制造工艺。解决方案：用于接合粘合到半导体器件并接收由其产生的热的冷却片的接合材料以及诸如用于传导热量并增强导热性的导管等相互接合部分的翅片的冷却装置包括具有良好导热性的金属如铝或铜以及类金刚石结构的细碳粉末。金属与金刚石结构的细碳粉末熔融分散和均匀混合，并通过絮凝拉制法从熔融生产棒状粘合材料。由于金刚石具有优异的导热性和宽带光学透明性，所以通过热传导提高了冷却器的冷却性能。版权所有（C）2006，JPO＆NCIPI

17. 发明专利

JP2006245575A Printed circuit board structure and its manufacturing method 审中-公开
标题翻译：印刷电路板结构及其制造方法
公开(公告)号：JP2006245575A
公开(公告)日：2006-09-14
申请号：JP2006051276
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H05K1/09 , H01L23/14 , H01L23/373 , H05K1/05 , H05K3/44
CPC分类号： H05K3/28 , H05K1/0203 , H05K1/0306 , H05K1/05 , H05K2201/0179 , H05K2201/0323 , Y10T428/24917 , Y10T428/24926 , Y10T428/30
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board structure which efficiently conducts heat generated from a semiconductor device, and its manufacturing method. SOLUTION: The printed circuit board supports electronic parts 25 in a circuit, and conducts and dissipates heat generated from the electronic parts and its related equipment. The printed circuit board mounting the semiconductor device comprises a layer structure 31, and the layer structure is composed of a conductive layer 32 and an insulating base 33. The conductive layer has thermal conductivity, and forms a diamond-like structure carbon coat on a metal in which diamond-like structure carbon fine powder is mixed in scattering, or on a metal surface in which metal or diamond-like structure fine powder is dispersed and mixed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种有效地传导由半导体器件产生的热的印刷电路板结构及其制造方法。
解决方案：印刷电路板支持电路中的电子部件25，并且传导和散发由电子部件及其相关设备产生的热量。安装半导体器件的印刷电路板包括层结构31，并且层结构由导电层32和绝缘基底33组成。导电层具有导热性，并且在金属上形成类金刚石结构的碳涂层其中金刚石结构碳细粉末散射混合，或金属或类金刚石结构细粉末分散和混合的金属表面。版权所有（C）2006，JPO＆NCIPI

18. 发明专利

JP2006245570A Heat dissipation conduit structure for cooling device such as semiconductor chip and its production process 审中-公开
标题翻译：用于冷却装置的散热管结构如半导体芯片及其生产工艺
公开(公告)号：JP2006245570A
公开(公告)日：2006-09-14
申请号：JP2006047852
申请日：2006-02-24
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/427
CPC分类号： F28D15/046 , B23P2700/10 , C23C14/0611 , C23C14/3442 , C23C14/46 , C23C16/274 , C25D7/00 , C25D15/02 , F28F13/06 , F28F13/18 , F28F21/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation conduit structure for cooling a device such as a semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure comprises a hollow blocked tube 31, and a column 314 wherein the hollow blocked tube consists of a molding of mixture material of metal and carbon of diamond structure, or a molding obtained by coating that molding or a metal molding with carbon of diamond structure. The hollow blocked tube has a heat source end 14 touching a device heat source on one end side, and a heat dissipation end touching a low temperature heat sink on the other end side. The column has one end connected with the heat source end 14 of the hollow blocked tube, and a second end touching the heat dissipation end of the hollow blocked tube. A capillary texture structure having capillary action is formed on the inner wall face of the hollow blocked tube and the surface of the column, the blocked tube is filled with cooling fluid, the fluid is vaporized by heat conduction and evaporated. The vaporized fluid is condensed at the low temperature heat dissipation end and returned through capillary action of the capillary texture structure. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于冷却诸如半导体芯片的器件的散热管道结构，并提供其制造工艺。解决方案：散热管道结构包括中空封闭管31和塔314，其中中空封闭管由金属和金刚石结构的混合材料的模制件或通过涂覆该模制件获得的模制件具有金刚石结构的碳的金属模制品。中空封闭管具有在一端侧接触设备热源的热源端14和在另一端侧接触低温散热器的散热端。该柱的一端与中空阻塞管的热源端14连接，第二端接触中空阻塞管的散热端。在中空阻塞管的内壁面和塔的表面上形成具有毛细作用的毛细管结构结构，阻塞管填充有冷却流体，通过热传导蒸发流体并蒸发。蒸发的液体在低温散热端冷凝，并通过毛细管结构的毛细管作用返回。版权所有（C）2006，JPO＆NCIPI

19. 发明专利

JP2006245569A Heat dissipation conduit structure for semiconductor chip and its production process 审中-公开
标题翻译：半导体芯片的散热管结构及其生产工艺
公开(公告)号：JP2006245569A
公开(公告)日：2006-09-14
申请号：JP2006047851
申请日：2006-02-24
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/427
CPC分类号： F28D15/046 , H01L23/373 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink heat dissipation conduit structure for cooling semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure 31 is a hollow blocked tube arrangement in tight contact with a semiconductor chip at the heat source end 14 and being conducted with heat generated therefrom. The heat dissipation conduit structure 31 has a heat exchange surface 314 provided with fine irregularities on the inner wall surface and filled with cooling medium. In the heat dissipation conduit, surface of a metal molding is coated with carbon having a diamond structure or composed of a heat conduction material, i.e. a mixture material of a metal and fine carbon powder having a diamond structure. Carbon of a diamond structure has high thermal conductivity characteristics and can enhance heat conduction effect of the heat conduction material. Coating method of carbon having a diamond structure includes chemical vapor deposition, physical vapor deposition such as ion sputtering, electrodeposition, and other well known methods. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于冷却半导体芯片的散热片散热导管结构，并提供其制造工艺。解决方案：散热管道结构31是与热源端14处的半导体芯片紧密接触并且由其产生的热量传导的空心阻塞管装置。散热导管结构31具有热交换面314，该热交换面314在内壁面上设置有细小的凹凸，并填充有冷却介质。在散热导管中，金属模制品的表面涂覆有具有金刚石结构的碳或由导热材料构成的碳，即具有金刚石结构的金属和细小碳粉的混合材料。金刚石结构的碳具有很高的导热性能，可以提高导热材料的导热效果。具有金刚石结构的碳的涂覆方法包括化学气相沉积，诸如离子溅射的物理气相沉积，电沉积以及其它众所周知的方法。版权所有（C）2006，JPO＆NCIPI

20. 发明专利

JP2006148850A Apparatus and method for interactive touch control remote control 审中-公开
标题翻译：互动触摸控制远程控制的装置和方法
公开(公告)号：JP2006148850A
公开(公告)日：2006-06-08
申请号：JP2005023751
申请日：2005-01-31
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： CHIANG SHAO-PIN
IPC分类号： H04Q9/00
CPC分类号： G08C19/28 , G08C2201/20
摘要： PROBLEM TO BE SOLVED: To provide an interactive touch control remote control apparatus. SOLUTION: A signal sending button of a request acknowledge apparatus is arranged to send signals of the request acknowledge apparatus by a pressing operation by a user and a device identification data preservation unit connected in a target appliance control circuit of a target appliance preserves the set device code of the appliance itself. Upon receiving the signals of the request acknowledge apparatus from the interactive touch control remote control apparatus, the target appliance responds to data of its own device code, a communication protocol corresponding to the device code and control button mapping. When the interactive touch control remote control apparatus receives the device code of the response, it displays a control button corresponding to the device code at the display unit of a touch control display module, adjusts the communication protocol to be used, and performs remote control operations to the target appliance. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种交互式触摸控制遥控装置。解决方案：请求确认装置的信号发送按钮被布置成通过用户的按压操作发送请求确认装置的信号，并且连接在目标设备的目标设备控制电路中的设备识别数据保存单元保存设备本身的设备设备代码。当从交互式触摸控制遥控装置接收到请求确认装置的信号时，目标设备响应其自己的设备代码的数据，对应于设备代码和控制按钮映射的通信协议。当交互式触摸控制遥控装置接收到响应的设备代码时，它在触摸控制显示模块的显示单元处显示与设备代码对应的控制按钮，调整要使用的通信协议，并执行远程控制操作到目标设备。版权所有（C）2006，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式