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1. 发明专利

JP2006245577A Forced air-cooling chip cooler and its manufacturing process 审中-公开
标题翻译：强制冷却芯片冷却器及其制造工艺
公开(公告)号：JP2006245577A
公开(公告)日：2006-09-14
申请号：JP2006051279
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/467 , H01L23/36
CPC分类号： H01L23/427 , B23P2700/10 , C25D7/00 , C25D15/02 , H01L23/3732 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To enhance thermal conductivity of a cooling piece in a forced air-cooling chip cooler. SOLUTION: The forced air-cooling chip cooler comprises a cooling piece for conducting heat by touching the chip plane of a semiconductor device, a cooling fin having a plurality of cooling fins arranged on the bottom side and forming a passage of air flow between the bottom side and the opposing upper side, a pipe for conducting heat by touching the surface of the cooling piece and the bottom face arranged with the cooling fins at the opposite ends thereof, and a fan having an outlet opposing the inlet of the air flow passage of the cooling fin wherein the cooling piece is produced by coating a metal mixed with fine carbon powder of diamond-like structure or a molding of a metal mixed or not mixed with fine carbon powder of diamond-like structure with carbon of diamond-like structure. Aluminium, copper, and other metals of high thermal conductivity are applicable as that metal. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提高强制风冷芯片冷却器中的冷却片的导热性。解决方案：强制风冷芯片冷却器包括通过触摸半导体器件的芯片平面来传导热量的冷却片，具有布置在底侧上的多个冷却翅片并形成空气流通道的冷却翅片在底侧和相对的上侧之间，通过接触冷却片的表面和与其相对的端部布置有冷却翅片的底面来传导热量的管，以及具有与空气入口相对的出口的风扇冷却翅片的流动通道，其中冷却片通过涂覆与金刚石结构的细碳粉末混合的金属或与金刚石结构的细碳粉末混合或不混合的金属的模制品制成金刚石 - 像结构。铝，铜等导热系数高的金属适用于金属。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006270068A Semiconductor chip cooling system, structure and manufacturing method of heat exchange device for the same 审中-公开
标题翻译：半导体芯片冷却系统，其交换装置的结构和制造方法
公开(公告)号：JP2006270068A
公开(公告)日：2006-10-05
申请号：JP2006043033
申请日：2006-02-20
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling system of a CPU semiconductor chip or the like, a heat exchange device and its manufacturing method. SOLUTION: A semiconductor chip cooling system comprises a fluid-cooled heat sink 23, a heat exchange device 31, a pumping device 25, and conduits 211 and 251 constituting the circulation path of a cooling fluid. This heat sink dissipates the heat generated of a semiconductor chip 21 to cool it. The heat exchange device blast-cools the heat of the cooling fluid, circulated via the conduits from the heat sink by the pumping device by a fan 241. The cooling fins and the heat sink pieces of the heat exchange device are formed, by coating the surface of a cast of carbon fine powders of a metal material having proper thermal conductivity and of a diamond-like structure or a molding formed of the metal material having proper thermal conductivity with carbons of a diamond-like structure. The carbons of the diamond-like structure are superior in thermal conductivity and can improve the cooling capacity. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供CPU半导体芯片等的冷却系统，热交换装置及其制造方法。解决方案：半导体芯片冷却系统包括流体冷却的散热器23，热交换装置31，泵送装置25以及构成冷却流体的循环路径的导管211和251。该散热器散发半导体芯片21产生的热量以使其冷却。热交换装置通过风扇241对冷却流体的热量进行喷射冷却，通过泵送装置经由导管从导热管循环。热交换装置的散热片和散热片通过涂覆具有适当导热性和金刚石结构的金属材料的铸造碳细粉末的表面或由具有类金刚石结构的碳的具有适当导热性的金属材料形成的模制品的表面。类金刚石结构的碳导热性优良，可提高制冷量。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006245561A Thin film structure on heat dissipation metal surface and its production process 审中-公开
标题翻译：散热金属表面薄膜结构及其生产工艺
公开(公告)号：JP2006245561A
公开(公告)日：2006-09-14
申请号：JP2006027578
申请日：2006-02-03
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/373
CPC分类号： H01L23/3732 , F28F13/18 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thin film structure on the surface of a heat dissipation metal exhibiting excellent heat dissipation effect, and to provide its production process. SOLUTION: A thin film 52 composed of carbon of a diamond structure is formed on the surface of a heat dissipation metal 51. A lower surface of the heat dissipation metal is arranged in tight contact with the heat dissipation surface of a heat generation source such as a semiconductor chip, and heat is dissipated from the thin film structure on the surface of the heat dissipation metal by heat conduction. Since a heat dissipation surface composed of carbon of a diamond structure is employed, thermal conduction characteristics are enhanced and high heat dissipation action is exhibited by infrared radiation activity. The thin film composed of carbon of diamond structure is formed by chemical vapor deposition or physical vapor deposition. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在散热金属的表面上提供薄膜结构，具有优异的散热效果，并提供其制造工艺。解决方案：在散热金属51的表面上形成由金刚石结构的碳构成的薄膜52.散热金属的下表面与发热的散热面紧密接触源如半导体芯片，并且热量通过热传导从散热金属的表面上的薄膜结构消散。由于采用由金刚石结构的碳组成的散热表面，所以热传导特性得到提高，并且通过红外辐射活性表现出高的散热作用。由金刚石结构的碳组成的薄膜通过化学气相沉积或物理气相沉积形成。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006245560A Structure of heat dissipation fin and its manufacturing process 审中-公开
标题翻译：散热结构及其制造工艺
公开(公告)号：JP2006245560A
公开(公告)日：2006-09-14
申请号：JP2006027577
申请日：2006-02-03
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/36 , H01L23/373
CPC分类号： F28F1/10 , B23P2700/10 , C25D7/00 , C25D15/02 , G06F1/20 , H01L23/3732 , H01L23/467 , H01L2224/73253
摘要： PROBLEM TO BE SOLVED: To enhance thermal conductivity of heat dissipation fins for cooling a semiconductor chip, or the like.
SOLUTION: The structure of heat dissipation fins comprises a connector 22 and a plurality of heat dissipation fins 21. The heat dissipation fins and the connector are a heat conduction material composed of a metal and carbon having a diamond structure, and a heat generation source such as a semiconductor device is applied tightly to the lower surface of the connector in order to dissipate heat by heat conduction. The connector and the heat dissipation fins are formed by die casting a metal such as aluminium or copper containing fine carbon particles of diamond structure. Alternatively, a film composed of carbon of diamond structure may be formed by CVD on the surface of the connector and the heat dissipation fins made of metal. Carbon of a diamond structure has extremely high thermal conductivity and enhances heat dissipation effect.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高用于冷却半导体芯片的散热片的导热性等。散热片的结构包括连接器22和多个散热翅片21.散热翅片和连接器是由具有金刚石结构的金属和碳组成的导热材料和热量诸如半导体器件的发生源被紧密地施加到连接器的下表面，以便通过热传导来散热。连接器和散热片通过压铸金属如铝或含有金刚石结构的细小碳颗粒的铜形成。或者，可以通过CVD在金属结构的表面上形成由金刚石结构的碳构成的膜和由金属制成的散热片。金刚石结构的碳具有极高的导热性和增强的散热效果。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006229220A Cooling structure for semiconductor device or like, and manufacturing method for same 审中-公开
标题翻译：用于半导体器件等的冷却结构及其制造方法
公开(公告)号：JP2006229220A
公开(公告)日：2006-08-31
申请号：JP2006027579
申请日：2006-02-03
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/36 , H01L23/02
CPC分类号： H01L23/3736 , H01L23/10 , H01L23/3675 , H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a chip cooling structure which is composed of a substrate, a semiconductor chip, and a package and characterized in that the package is made of metal and carbon in diamond structure as a heat-conductive material and the carbon in diamond structure has a high coefficient of heat conduction and improve the heat conduction effect of the heat-conductive material. SOLUTION: This cooling structure has an electric circuit structure and comprises the substrate 12 on which the semiconductor chip is mounted, the semiconductor chip 13, and the package 15. The semiconductor chip is electrically connected onto the substrate 12 by a flip-chip structure, and its generated heat is conducted to the metallic package 15 through heat conductive layer 14 from a rear side 131 to cool the semiconductor chip. The heat conductivity is improved by forming a carbon coating layer in diamond structure on the surface of the metallic package 15 which comes into contact with the semiconductor chip by CVD, sputtering, etc. Further, those structures may be formed on the metallic package by electroplating method using an electrolyte in which particulate carbon in diamond structure is suspended or a die-casting method wherein its particulates are mixed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供由基板，半导体芯片和封装构成的芯片冷却结构，其特征在于，所述封装由金刚石结构中的金属和碳制成，作为导热材料，金刚石结构中的碳具有高的导热系数，并且提高导热材料的导热效果。解决方案：该冷却结构具有电路结构，并且包括其上安装有半导体芯片的基板12，半导体芯片13和封装15.半导体芯片通过触发器电连接到基板12上，芯片结构，并且其产生的热量通过来自后侧131的导热层14传导到金属封装15，以冷却半导体芯片。通过在通过CVD，溅射等与半导体芯片接触的金属封装15的表面上形成金刚石结构中的碳涂层来提高导热性。此外，这些结构可以通过电镀形成在金属封装上使用其中悬浮金刚石结构中的颗粒碳的电解质的方法或其混合其颗粒的压铸方法。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2006086505A Circuit structure and circuit substrate for changing characteristic impedance using different reference surface 审中-公开
标题翻译：使用不同参考表面改变特性阻抗的电路结构和电路基板
公开(公告)号：JP2006086505A
公开(公告)日：2006-03-30
申请号：JP2005193647
申请日：2005-07-01
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： CHENG YU-CHIANG , JUANG GUO-MING
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/024 , H01P3/085 , H05K2201/0191 , H05K2201/0715
摘要： PROBLEM TO BE SOLVED: To provide a circuit structure for changing characteristic impedance using a different reference surface.
SOLUTION: A circuit structure (110) comprises an analog signal line (112), a digital signal line (114), an analog signal reference surface (116), and a digital signal reference surface (118). The line width of the analog signal line is identical to that of the digital signal line. Further, spacing between the analog signal line (112) and the analog signal reference surface (116) is longer than spacing between the digital signal line (114) and the digital signal reference surface (118). Therefore, characteristic impedance mismatch in signal transmission can be canceled and the quality of signal transmission can be improved.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供使用不同参考表面来改变特性阻抗的电路结构。解决方案：电路结构（110）包括模拟信号线（112），数字信号线（114），模拟信号参考表面（116）和数字信号参考表面（118）。模拟信号线的线宽与数字信号线的线宽相同。此外，模拟信号线（112）和模拟信号参考表面（116）之间的间隔比数字信号线（114）和数字信号参考表面（118）之间的间隔长。因此，可以消除信号传输中的特征阻抗失配，并且可以提高信号传输的质量。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006245576A Bonding material and its production process 审中-公开
标题翻译：粘接材料及其生产工艺
公开(公告)号：JP2006245576A
公开(公告)日：2006-09-14
申请号：JP2006051278
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/373 , H01L23/36 , H05K7/20
CPC分类号： H01L21/4882 , B23K35/22 , B23K35/327 , C09J1/00 , H01L23/3732 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a bonding material being employed in a member of a cooler for a semiconductor device and exhibiting excellent thermal conductivity, and to provide its production process.
SOLUTION: The bonding material for bonding a cooling piece being bonded to a semiconductor device and receiving heat generated therefrom, and a cooling means such as fins at a mutual bonding part such as a conduit for conducting heat and enhancing thermal conductivity, comprises a metal of good thermal conductivity such as aluminium or copper and fine carbon powder of diamond-like structure. The metal is melted and dispersed and mixed uniformly with fine carbon powder of diamond-like structure, and a rodlike bonding material is produced from the molten by flocculation pulling method. Since diamond exhibits excellent thermal conductivity and wideband optical transparency, cooling performance of the cooler by heat conduction is enhanced.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于半导体器件的冷却器的构件中并且显示出优异的导热性的接合材料，并提供其制造工艺。解决方案：用于接合粘合到半导体器件并接收由其产生的热的冷却片的接合材料以及诸如用于传导热量并增强导热性的导管等相互接合部分的翅片的冷却装置包括具有良好导热性的金属如铝或铜以及类金刚石结构的细碳粉末。金属与金刚石结构的细碳粉末熔融分散和均匀混合，并通过絮凝拉制法从熔融生产棒状粘合材料。由于金刚石具有优异的导热性和宽带光学透明性，所以通过热传导提高了冷却器的冷却性能。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006245575A Printed circuit board structure and its manufacturing method 审中-公开
标题翻译：印刷电路板结构及其制造方法
公开(公告)号：JP2006245575A
公开(公告)日：2006-09-14
申请号：JP2006051276
申请日：2006-02-27
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H05K1/09 , H01L23/14 , H01L23/373 , H05K1/05 , H05K3/44
CPC分类号： H05K3/28 , H05K1/0203 , H05K1/0306 , H05K1/05 , H05K2201/0179 , H05K2201/0323 , Y10T428/24917 , Y10T428/24926 , Y10T428/30
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board structure which efficiently conducts heat generated from a semiconductor device, and its manufacturing method. SOLUTION: The printed circuit board supports electronic parts 25 in a circuit, and conducts and dissipates heat generated from the electronic parts and its related equipment. The printed circuit board mounting the semiconductor device comprises a layer structure 31, and the layer structure is composed of a conductive layer 32 and an insulating base 33. The conductive layer has thermal conductivity, and forms a diamond-like structure carbon coat on a metal in which diamond-like structure carbon fine powder is mixed in scattering, or on a metal surface in which metal or diamond-like structure fine powder is dispersed and mixed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种有效地传导由半导体器件产生的热的印刷电路板结构及其制造方法。
解决方案：印刷电路板支持电路中的电子部件25，并且传导和散发由电子部件及其相关设备产生的热量。安装半导体器件的印刷电路板包括层结构31，并且层结构由导电层32和绝缘基底33组成。导电层具有导热性，并且在金属上形成类金刚石结构的碳涂层其中金刚石结构碳细粉末散射混合，或金属或类金刚石结构细粉末分散和混合的金属表面。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2006245570A Heat dissipation conduit structure for cooling device such as semiconductor chip and its production process 审中-公开
标题翻译：用于冷却装置的散热管结构如半导体芯片及其生产工艺
公开(公告)号：JP2006245570A
公开(公告)日：2006-09-14
申请号：JP2006047852
申请日：2006-02-24
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/427
CPC分类号： F28D15/046 , B23P2700/10 , C23C14/0611 , C23C14/3442 , C23C14/46 , C23C16/274 , C25D7/00 , C25D15/02 , F28F13/06 , F28F13/18 , F28F21/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation conduit structure for cooling a device such as a semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure comprises a hollow blocked tube 31, and a column 314 wherein the hollow blocked tube consists of a molding of mixture material of metal and carbon of diamond structure, or a molding obtained by coating that molding or a metal molding with carbon of diamond structure. The hollow blocked tube has a heat source end 14 touching a device heat source on one end side, and a heat dissipation end touching a low temperature heat sink on the other end side. The column has one end connected with the heat source end 14 of the hollow blocked tube, and a second end touching the heat dissipation end of the hollow blocked tube. A capillary texture structure having capillary action is formed on the inner wall face of the hollow blocked tube and the surface of the column, the blocked tube is filled with cooling fluid, the fluid is vaporized by heat conduction and evaporated. The vaporized fluid is condensed at the low temperature heat dissipation end and returned through capillary action of the capillary texture structure. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于冷却诸如半导体芯片的器件的散热管道结构，并提供其制造工艺。解决方案：散热管道结构包括中空封闭管31和塔314，其中中空封闭管由金属和金刚石结构的混合材料的模制件或通过涂覆该模制件获得的模制件具有金刚石结构的碳的金属模制品。中空封闭管具有在一端侧接触设备热源的热源端14和在另一端侧接触低温散热器的散热端。该柱的一端与中空阻塞管的热源端14连接，第二端接触中空阻塞管的散热端。在中空阻塞管的内壁面和塔的表面上形成具有毛细作用的毛细管结构结构，阻塞管填充有冷却流体，通过热传导蒸发流体并蒸发。蒸发的液体在低温散热端冷凝，并通过毛细管结构的毛细管作用返回。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006245569A Heat dissipation conduit structure for semiconductor chip and its production process 审中-公开
标题翻译：半导体芯片的散热管结构及其生产工艺
公开(公告)号：JP2006245569A
公开(公告)日：2006-09-14
申请号：JP2006047851
申请日：2006-02-24
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/427
CPC分类号： F28D15/046 , H01L23/373 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink heat dissipation conduit structure for cooling semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure 31 is a hollow blocked tube arrangement in tight contact with a semiconductor chip at the heat source end 14 and being conducted with heat generated therefrom. The heat dissipation conduit structure 31 has a heat exchange surface 314 provided with fine irregularities on the inner wall surface and filled with cooling medium. In the heat dissipation conduit, surface of a metal molding is coated with carbon having a diamond structure or composed of a heat conduction material, i.e. a mixture material of a metal and fine carbon powder having a diamond structure. Carbon of a diamond structure has high thermal conductivity characteristics and can enhance heat conduction effect of the heat conduction material. Coating method of carbon having a diamond structure includes chemical vapor deposition, physical vapor deposition such as ion sputtering, electrodeposition, and other well known methods. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于冷却半导体芯片的散热片散热导管结构，并提供其制造工艺。解决方案：散热管道结构31是与热源端14处的半导体芯片紧密接触并且由其产生的热量传导的空心阻塞管装置。散热导管结构31具有热交换面314，该热交换面314在内壁面上设置有细小的凹凸，并填充有冷却介质。在散热导管中，金属模制品的表面涂覆有具有金刚石结构的碳或由导热材料构成的碳，即具有金刚石结构的金属和细小碳粉的混合材料。金刚石结构的碳具有很高的导热性能，可以提高导热材料的导热效果。具有金刚石结构的碳的涂覆方法包括化学气相沉积，诸如离子溅射的物理气相沉积，电沉积以及其它众所周知的方法。版权所有（C）2006，JPO＆NCIPI

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