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    • 14. 发明申请
    • Cooler device for canned drinks
    • 罐装饮料的冷却装置
    • US20060179872A1
    • 2006-08-17
    • US11293095
    • 2005-12-05
    • Robert Hilton
    • Robert Hilton
    • F25D3/08
    • F25D31/007F25D2331/805
    • A cooler device includes an elongate housing for receiving canned drinks. A lid is selectively secured by a catch mechanism for enclosing an open top end of the housing in a closed position of the lid. The housing has an external surface configured to have the appearance of an animal, with the lid being concealed within the external surface of the housing to provide an entertaining and finished appearance to the cooler device. The catch mechanism is also concealed by the external surface of the housing by forming a release button of the catch mechanism to be a facial feature of the animal which decorates the external surface of the housing.
    • 冷却器装置包括用于接收罐头饮料的细长壳体。 盖被选择性地通过卡扣机构固定,用于将盖的敞开的顶端封闭在盖子的关闭位置。 壳体具有被配置为具有动物外观的外表面,其中盖被隐藏在壳体的外表面内,以向冷却器装置提供娱乐和完成的外观。 捕捉机构还通过将捕获机构的释放按钮形成为装饰外壳的外表面的动物的面部特征而被壳体的外表面遮蔽。
    • 16. 发明申请
    • Wafer probing that conditions devices for flip-chip bonding
    • 晶圆探测条件用于倒装芯片焊接
    • US20050231222A1
    • 2005-10-20
    • US11153018
    • 2005-06-14
    • Mark DiOrioRobert Hilton
    • Mark DiOrioRobert Hilton
    • G01R1/04G01R1/073G01R1/44G01R31/02
    • G01R1/0483G01R1/07314G01R1/44
    • A probing system or process for electrical testing of a device fabricated on a wafer also conditions terminals such as solder balls on the device to improve uniformity of the heights of the terminals and improve the reliability of connections to an interconnect substrate in a flip-chip package or to a printed circuit board in a chip-on-board application. The system can employ a probe card that is a printed circuit board and/or is substantially identical to interconnect substrates used in flip-chip packaging. The probe card can be replaceable on a test head to allow for quick changes the reduce ATE downtime and to accommodate device changes such as a die shrink. Probe tips on the probe card can be the contact pads or bumps that are the normal electrical contact structures of the interconnect substrates.
    • 用于在晶片上制造的器件的电测试的探测系统或过程还可以调节诸如器件上的焊球的端子,以提高端子的高度的均匀性,并提高倒装芯片封装中与互连衬底的连接的可靠性 或者在片上应用中的印刷电路板。 该系统可以使用作为印刷电路板的探针卡和/或与倒装芯片封装中使用的互连基板基本相同。 探头卡可以在测试头上更换,以便快速更改减少ATE停机时间,并适应设备更换(如模具缩小)。 探针卡上的探针尖端可以是作为互连基板的正常电接触结构的接触焊盘或凸块。
    • 17. 发明授权
    • One-piece interconnection package and process
    • 一体式互连包和流程
    • US4876587A
    • 1989-10-24
    • US46988
    • 1987-05-05
    • Robert HiltonAli EmamjomehJagdish Belani
    • Robert HiltonAli EmamjomehJagdish Belani
    • H01L23/50H01L21/60H01L23/495
    • H01L23/49548H01L23/49541H01L2224/16H01L2224/16245H01L2924/3511
    • A one-piece interconnection structure (10) for an SO package (60) is formed from a single sheet strip (12) of copper having a thickness of about 8 mils. Contact finger patterns (14) are formed from a plurality of contact fingers (22) which extend in cantilever fashion. The fingers (22) have tips (24) of a reduced thickness of between about 2-3 mils. Stress relief slots (26) having a depth of about 2 mils are formed in the underside of each finger (22) spaced back from the tips (24) to give the fingers increased flexibility for downward bending during assembly operations. Vertical slots (28) on opposing sides of the fingers behind the stress relief slots give increased lateral flexibility to the fingers. Steps (30) extend vertically along the lateral fingers (22) and have two surfaces (32 and 34) angularly disposed with respect to central surface (36) on the top and bottom fingers. In combination, the stress relief slots (26), vertical slots (28) and the different configuration of the steps (30) make the fingers (22) have the same flexing characteristics in response to bending forces on them, even though the fingers (22) have different shapes depending on their positions in the finger pattern (14). The contact fingers (22) and the reduced thickness tips (24) are formed by masking strip (12) with photoresist in patterns on the top and bottom of the strip to define the contact fingers, but leaving the strip exposed on its top surface where the reduced thickness tips are to be formed, and directing spray etchant at the top of the strip and at the bottom of the strip at different pressures.
    • 用于SO封装(60)的一体式互连结构(10)由具有约8密耳厚度的单个铜片片(12)形成。 接触指形图案(14)由以悬臂方式延伸的多个接触指状物(22)形成。 手指(22)具有约2-3密耳之间的厚度减小的尖端(24)。 在每个手指(22)的与尖端(24)间隔开的下侧形成具有约2密耳深度的应力消除槽(26),以在组装操作期间使手指增加柔性以使向下弯曲。 在应力消除槽后面的指状物的相对侧上的垂直狭槽(28)对手指增加了侧向柔性。 台阶(30)沿着侧指(22)垂直延伸并且具有相对于顶部和底部指状物上的中心表面(36)成角度地设置的两个表面(32和34)。 组合在一起,应力消除槽26,垂直槽28和台阶30的不同结构使得手指22响应于它们上的弯曲力而具有相同的弯曲特性,即使手指 22)根据其在手指图案(14)中的位置具有不同的形状。 接触指状物(22)和缩小的厚度尖端(24)通过在带的顶部和底部上以图案的光刻胶掩模条形(12)形成,以限定接触指,但是将条暴露在其顶表面上 将形成减小的厚度的尖端,并且在不同的压力下在带的顶部和带的底部引导喷雾蚀刻剂。