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11. 外观设计

USD608742S1 Shadow frame 有权
公开(公告)号：USD608742S1
公开(公告)日：2010-01-26
申请号：US29327941
申请日：2008-11-14
申请人： Robin L. Tiner
设计人： Robin L. Tiner

12. 发明授权

US07534301B2 RF grounding of cathode in process chamber 有权
标题翻译：处理室中阴极的RF接地
公开(公告)号：US07534301B2
公开(公告)日：2009-05-19
申请号：US10946403
申请日：2004-09-21
申请人： John M. White , Robin L. Tiner , Beom Soo Park , Wendell T Blonigan
发明人： John M. White , Robin L. Tiner , Beom Soo Park , Wendell T Blonigan
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01J37/32082 , H01J37/32174
摘要： An apparatus for providing a short return current path for RF current between a process chamber wall and a substrate support is provided. The RF grounding apparatus, which is RF grounded and is place above the substrate transfer port, establishes electrical contact with the substrate support only during substrate processing, such as deposition, to provide return current path for the RF current. One embodiment of the RF grounding apparatus comprises one or more low impedance flexible curtains, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Another embodiment of the RF grounding apparatus comprises a plurality of low impedance flexible straps, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Yet another embodiment of the RF grounding apparatus comprises a plurality of probes, which either are electrically connected to the grounded chamber wall or are grounded by other means, and actuators accompanying the probes. The actuators move the probes to make electrical contact with the substrate support during substrate processing.
摘要翻译：提供一种用于在处理室壁和衬底支撑件之间提供用于RF电流的短的返回电流路径的装置。射频接地装置，其RF接地并位于衬底传送端口之上，仅在衬底处理（例如沉积）期间与衬底支撑件电接触，以提供RF电流的返回电流路径。 RF接地装置的一个实施例包括电连接到接地室壁的一个或多个低阻抗柔性窗帘，以及在衬底处理期间与衬底支撑件接触的一个或多个低阻抗块。 RF接地装置的另一实施例包括多个低阻抗柔性带，其电连接到接地室壁，以及一个或多个低阻抗块，其在衬底处理期间与衬底支撑件接触。 RF接地装置的另一个实施例包括多个探针，它们或者被电连接到接地室壁，或者通过其它装置接地，以及伴随探头的致动器。致动器在衬底处理期间移动探针以与衬底支撑件电接触。

13. 发明申请

US20090101069A1 RF RETURN PLATES FOR BACKING PLATE SUPPORT 审中-公开
标题翻译： RF返回板用于支撑板支持
公开(公告)号：US20090101069A1
公开(公告)日：2009-04-23
申请号：US12248869
申请日：2008-10-09
申请人： SUHAIL ANWAR , Robin L. Tiner , John M. White
发明人： SUHAIL ANWAR , Robin L. Tiner , John M. White
IPC分类号： C23C16/505
CPC分类号： C23C16/505 , C23C16/45565 , H01J37/32091 , H01J37/32174 , H01J37/3244
摘要： Embodiments of the present invention generally comprise an RF return plate for use in an apparatus that utilizes RF current. Whenever a backing plate is so large that a backing plate support structure is needed to prevent the backing plate from sagging, RF current that flows across the backing plate towards the showerhead may be partially diverted and flow up the support structure. The RF current that flows up the support structure puts an unwanted bias on the support structure and also contributes to reduction of the RF current flowing to the showerhead. By returning the RF current to the source, the amount of RF current that may flow up the support structure may be reduced. An RF return plate may be disposed between the chamber lid and the support structure to redirect any RF current that may flow up the support structure back down to the chamber lid.
摘要翻译：本发明的实施例通常包括用于利用RF电流的装置中的RF返回板。每当背板太大以至于需要背板支撑结构以防止背板下垂时，流过背板的喷头的RF电流可以部分地转向并沿支撑结构向上流动。在支撑结构上流动的RF电流在支撑结构上产生不想要的偏压，并且还有助于减少流向喷头的RF电流。通过将RF电流返回到源，可以减少可能流过支撑结构的RF电流的量。 RF返回板可以设置在室盖和支撑结构之间，以将可能从支撑结构向上流动的任何RF电流重新定向到室盖。

14. 发明申请

US20080317973A1 DIFFUSER SUPPORT 审中-公开
标题翻译：扩音器支持
公开(公告)号：US20080317973A1
公开(公告)日：2008-12-25
申请号：US11767307
申请日：2007-06-22
申请人： John M. White , Robin L. Tiner , Yeh Kurt Chang
发明人： John M. White , Robin L. Tiner , Yeh Kurt Chang
IPC分类号： C23C16/00 , H05H1/24
CPC分类号： C23C16/45565
摘要： Embodiments of gas distribution apparatus comprise a diffuser support member coupled to a diffuser and moveably disposed through a backing plate. Embodiments of methods of processing a substrate on a substrate receiving surface of a substrate support comprise providing a diffuser in which a diffuser support member supports the diffuser and is moveably disposed through the backing plate.
摘要翻译：气体分配装置的实施例包括连接到扩散器并可移动地设置穿过背板的扩散器支撑构件。在衬底支撑件的衬底接收表面上处理衬底的方法的实施例包括提供扩散器，漫射器支撑构件支撑漫射器并且可移动地设置穿过背板。

15. 发明申请

US20080268173A1 PECVD PROCESS CHAMBER BACKING PLATE REINFORCEMENT 有权
标题翻译： PECVD过程室背板加固
公开(公告)号：US20080268173A1
公开(公告)日：2008-10-30
申请号：US12037885
申请日：2008-02-26
申请人： John M. White , Shinichi Kurita , Robin L. Tiner
发明人： John M. White , Shinichi Kurita , Robin L. Tiner
IPC分类号： H05H1/34
CPC分类号： H01J37/32449 , C23C16/44 , C23C16/5096 , H01J37/3244 , H01J37/32495 , H01J37/32623 , H01J2237/3321 , H01J2237/3325
摘要： The present invention generally comprises a backing plate reinforcement apparatus for use in a plasma enhanced chemical vapor deposition apparatus. When processing large area substrates, the backing plate extending across the chamber may also be quite large. By supporting a central area of the backing plate with a frame structure, the backing plate may be maintained substantially planar. Alternatively, as necessary, the contour of the backing plate may be adjusted to suit the particular needs of the process.
摘要翻译：本发明通常包括用于等离子体增强化学气相沉积设备中的背板加强装置。当处理大面积基板时，延伸穿过室的背板也可能相当大。通过用框架结构支撑背板的中心区域，背板可以保持基本上平面。或者，根据需要，可以调整背板的轮廓以适应该方法的特定需要。

16. 发明授权

US06746198B2 Substrate transfer shuttle 失效
标题翻译：基材转运班车
公开(公告)号：US06746198B2
公开(公告)日：2004-06-08
申请号：US09881009
申请日：2001-06-13
申请人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
发明人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
IPC分类号： B65G4907
CPC分类号： H01L21/67748 , C03B25/08 , C03B29/08 , C03B35/142 , C03B35/202 , C03B2225/02 , C03C17/002 , F27D3/00 , F27D5/00 , H01L21/67173 , H01L21/67236 , Y02P40/57 , Y10S414/135 , Y10S414/139
摘要： The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.
摘要翻译：本发明提供了一种用于基板输送的装置和方法。在根据本发明的系统中，提供至少第一和第二腔室。第一室可以是装载锁，第二室是处理室。提供基板传送梭，并且可沿着由第一室中的一个位置和第二室中的另一位置之间的导辊限定的线性路径移动。以这种方式，可以在第一室和第二室之间沿正向和反向的方向转移衬底。衬底传送穿梭被构造成使得可以通过将其中一个室中的支撑件从降低位置移动到中间位置而从其中移除基板，之后可以从室移除基板传送梭。

17. 发明授权

US09200368B2 Plasma uniformity control by gas diffuser hole design 有权
标题翻译：通过气体扩散器孔设计的等离子体均匀性控制
公开(公告)号：US09200368B2
公开(公告)日：2015-12-01
申请号：US13207227
申请日：2011-08-10
申请人： Soo Young Choi , John M. White , Qunhua Wang , Li Hou , Ki Woon Kim , Shinichi Kurita , Tae Kyung Won , Suhail Anwar , Beom Soo Park , Robin L. Tiner
发明人： Soo Young Choi , John M. White , Qunhua Wang , Li Hou , Ki Woon Kim , Shinichi Kurita , Tae Kyung Won , Suhail Anwar , Beom Soo Park , Robin L. Tiner
IPC分类号： C23C16/455 , C23C16/34 , C23C16/509 , H01J37/32
CPC分类号： H01J37/3244 , C23C16/345 , C23C16/455 , C23C16/45565 , C23C16/5096 , H01J37/32082 , H01J37/32091 , H01J37/32541 , H01J37/32596 , H01J2237/327 , H01J2237/3321 , H01J2237/3323 , H01J2237/3325 , Y10T29/49885 , Y10T29/49996
摘要： Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.
摘要翻译：提供了用于在处理室中分配气体的气体扩散板的实施例。气体分配板包括具有上游侧和下游侧的扩散板，以及在扩散板的上游侧和下游侧之间通过的多个气体通路。气体通道包括在下游侧的中空阴极腔，以增强等离子体电离。延伸到下游端的气体通道的空心阴极腔的深度，直径，表面积和密度可以从扩散板的中心到边缘逐渐增加，以改善衬底上的膜厚度和性能均匀性。从扩散板的中心到边缘的直径，深度和表面积的增加可以通过向下游侧弯曲扩散板，然后在凸出的下游侧加工出来。扩散板的弯曲可以通过热处理或真空工艺来实现。从扩散板的中心到边缘的直径，深度和表面积的增加也可以用计算机数字控制加工。具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加，深度和表面积逐渐增大的扩散板已被证明可以产生改善的膜厚度和膜性质的均匀性。

18. 外观设计

USD713200S1 Susceptor with heater 有权
公开(公告)号：USD713200S1
公开(公告)日：2014-09-16
申请号：US29430967
申请日：2012-08-31
申请人： Gaku Furuta , John M. White , Robin L. Tiner , Suhail Anwar , Soo Young Choi
设计人： Gaku Furuta , John M. White , Robin L. Tiner , Suhail Anwar , Soo Young Choi

19. 发明申请

US20140246521A1 SHOWERHEAD SUPPORT STRUCTURE FOR IMPROVED GAS FLOW 审中-公开
标题翻译：改善气体流量的淋浴支撑结构
公开(公告)号：US20140246521A1
公开(公告)日：2014-09-04
申请号：US14275835
申请日：2014-05-12
申请人： Robin L. TINER , Soo Young CHOI , Qunhua WANG , Jrjyan Jerry CHEN
发明人： Robin L. TINER , Soo Young CHOI , Qunhua WANG , Jrjyan Jerry CHEN
IPC分类号： B05B1/00
CPC分类号： B05B1/005 , C23C16/45565 , H01J37/3244
摘要： Embodiments of the present invention generally provide apparatus and methods for supporting a gas distribution showerhead in a processing chamber. In one embodiment, a gas distribution showerhead for a vacuum chamber is provided. The gas distribution showerhead comprises a body having a first side and a second side opposite the first side, and a plurality of gas passages formed through the body, the gas passages comprising a first bore formed in the first side that is fluidly coupled to a second bore formed in the second side by a restricting orifice, and a suspension feature formed in the first bore of at least one of the gas passages.
摘要翻译：本发明的实施例通常提供用于在处理室中支撑气体分配喷头的装置和方法。在一个实施例中，提供了一种用于真空室的气体分配喷头。所述气体分配喷头包括具有第一侧和与所述第一侧相对的第二侧的主体和穿过所述主体形成的多个气体通道，所述气体通道包括形成在所述第一侧中的第一孔，所述第一孔流体地联接到第二侧通过限制孔形成在第二侧中的孔，以及形成在至少一个气体通道的第一孔中的悬挂特征。

20. 发明授权

US08721791B2 Showerhead support structure for improved gas flow 有权
标题翻译：喷头支撑结构，用于改善气流
公开(公告)号：US08721791B2
公开(公告)日：2014-05-13
申请号：US13163241
申请日：2011-06-17
申请人： Robin L. Tiner , Soo Young Choi , Qunhua Wang , Jrjyan Jerry Chen
发明人： Robin L. Tiner , Soo Young Choi , Qunhua Wang , Jrjyan Jerry Chen
IPC分类号： C23C16/455 , H01J37/32
CPC分类号： B05B1/005 , C23C16/45565 , H01J37/3244
摘要： Embodiments of the present invention generally provide apparatus and methods for supporting a gas distribution showerhead in a processing chamber. In one embodiment, a gas distribution showerhead for a vacuum chamber is provided. The gas distribution showerhead comprises a body having a first side and a second side opposite the first side, and a plurality of gas passages formed through the body, the gas passages comprising a first bore formed in the first side that is fluidly coupled to a second bore formed in the second side by a restricting orifice, and a suspension feature formed in the first bore of at least one of the gas passages.
摘要翻译：本发明的实施例通常提供用于在处理室中支撑气体分配喷头的装置和方法。在一个实施例中，提供了一种用于真空室的气体分配喷头。所述气体分配喷头包括具有第一侧和与所述第一侧相对的第二侧的主体和穿过所述主体形成的多个气体通道，所述气体通道包括形成在所述第一侧中的第一孔，所述第一孔流体地联接到第二侧通过限制孔形成在第二侧中的孔，以及形成在至少一个气体通道的第一孔中的悬挂特征。

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