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11. 发明专利

JP2006245570A Heat dissipation conduit structure for cooling device such as semiconductor chip and its production process 审中-公开
标题翻译：用于冷却装置的散热管结构如半导体芯片及其生产工艺
公开(公告)号：JP2006245570A
公开(公告)日：2006-09-14
申请号：JP2006047852
申请日：2006-02-24
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/427
CPC分类号： F28D15/046 , B23P2700/10 , C23C14/0611 , C23C14/3442 , C23C14/46 , C23C16/274 , C25D7/00 , C25D15/02 , F28F13/06 , F28F13/18 , F28F21/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation conduit structure for cooling a device such as a semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure comprises a hollow blocked tube 31, and a column 314 wherein the hollow blocked tube consists of a molding of mixture material of metal and carbon of diamond structure, or a molding obtained by coating that molding or a metal molding with carbon of diamond structure. The hollow blocked tube has a heat source end 14 touching a device heat source on one end side, and a heat dissipation end touching a low temperature heat sink on the other end side. The column has one end connected with the heat source end 14 of the hollow blocked tube, and a second end touching the heat dissipation end of the hollow blocked tube. A capillary texture structure having capillary action is formed on the inner wall face of the hollow blocked tube and the surface of the column, the blocked tube is filled with cooling fluid, the fluid is vaporized by heat conduction and evaporated. The vaporized fluid is condensed at the low temperature heat dissipation end and returned through capillary action of the capillary texture structure. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于冷却诸如半导体芯片的器件的散热管道结构，并提供其制造工艺。解决方案：散热管道结构包括中空封闭管31和塔314，其中中空封闭管由金属和金刚石结构的混合材料的模制件或通过涂覆该模制件获得的模制件具有金刚石结构的碳的金属模制品。中空封闭管具有在一端侧接触设备热源的热源端14和在另一端侧接触低温散热器的散热端。该柱的一端与中空阻塞管的热源端14连接，第二端接触中空阻塞管的散热端。在中空阻塞管的内壁面和塔的表面上形成具有毛细作用的毛细管结构结构，阻塞管填充有冷却流体，通过热传导蒸发流体并蒸发。蒸发的液体在低温散热端冷凝，并通过毛细管结构的毛细管作用返回。版权所有（C）2006，JPO＆NCIPI

12. 发明专利

JP2006245569A Heat dissipation conduit structure for semiconductor chip and its production process 审中-公开
标题翻译：半导体芯片的散热管结构及其生产工艺
公开(公告)号：JP2006245569A
公开(公告)日：2006-09-14
申请号：JP2006047851
申请日：2006-02-24
申请人： Mitac Technology Corp , 神基科技股▲ふん▼有限公司
发明人： HWANG MING-HANG , CHENG YU-CHIANG , CHEN CHAO-YI , LEE PING-FENG , KUO HSIN-LUNG , LEE BIN-WEI , HSIAO WEI-CHUNG
IPC分类号： H01L23/427
CPC分类号： F28D15/046 , H01L23/373 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink heat dissipation conduit structure for cooling semiconductor chip, and to provide its production process. SOLUTION: The heat dissipation conduit structure 31 is a hollow blocked tube arrangement in tight contact with a semiconductor chip at the heat source end 14 and being conducted with heat generated therefrom. The heat dissipation conduit structure 31 has a heat exchange surface 314 provided with fine irregularities on the inner wall surface and filled with cooling medium. In the heat dissipation conduit, surface of a metal molding is coated with carbon having a diamond structure or composed of a heat conduction material, i.e. a mixture material of a metal and fine carbon powder having a diamond structure. Carbon of a diamond structure has high thermal conductivity characteristics and can enhance heat conduction effect of the heat conduction material. Coating method of carbon having a diamond structure includes chemical vapor deposition, physical vapor deposition such as ion sputtering, electrodeposition, and other well known methods. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于冷却半导体芯片的散热片散热导管结构，并提供其制造工艺。解决方案：散热管道结构31是与热源端14处的半导体芯片紧密接触并且由其产生的热量传导的空心阻塞管装置。散热导管结构31具有热交换面314，该热交换面314在内壁面上设置有细小的凹凸，并填充有冷却介质。在散热导管中，金属模制品的表面涂覆有具有金刚石结构的碳或由导热材料构成的碳，即具有金刚石结构的金属和细小碳粉的混合材料。金刚石结构的碳具有很高的导热性能，可以提高导热材料的导热效果。具有金刚石结构的碳的涂覆方法包括化学气相沉积，诸如离子溅射的物理气相沉积，电沉积以及其它众所周知的方法。版权所有（C）2006，JPO＆NCIPI

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