会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 42. 发明申请
    • METHOD, SYSTEM AND APPLICATION SERVER FOR ROUTING CS DOMAIN CALLS TO PS DOMAIN
    • 用于路由CS域名到PS域的方法,系统和应用程序服务器
    • US20090129318A1
    • 2009-05-21
    • US12356986
    • 2009-01-21
    • Jie XuYan Li
    • Jie XuYan Li
    • H04W8/02H04L12/66H04W4/00H04W40/00
    • H04W36/0022H04L65/1016H04Q3/0045H04W80/10
    • A method and system for routing a Circuit Switched (CS) domain call to a Packet Switched (PS) domain are disclosed. The method includes a Voice Call Continuity Application Server (VCC AS) in the PS domain interacts with a Home Location Register (HLR) in the CS domain to obtain an original called number, allocates a PS domain routing number to a CS domain call, and originates a corresponding PS domain call according to the obtained original called number after the PS domain call, which uses the PS domain routing number as a called party identifier, arrives at the VCC AS in the PS domain. The VCC AS obtains the call information through the interaction with the HLR rather than the interaction with a Service Control Point (SCP). Therefore, a Mobile Switching Center (MSC) needs to communicate with the HLR only, without the requirement to communicate with the SCP, and the MSC in the present disclosure does not need to support intelligent processing.
    • 公开了一种将电路交换(CS)域呼叫路由到分组交换(PS)域的方法和系统。 该方法包括PS域中的语音呼叫连续性应用服务器(VCC AS)与CS域中的归属位置寄存器(HLR)进行交互以获得原始被叫号码,为CS域呼叫分配PS域路由号码,以及 在PS域呼叫之后根据获得的原始被叫号码发起对应的PS域呼叫,其使用PS域路由号码作为被叫方标识符,到达PS域中的VCC AS。 VCC AS通过与HLR的交互而不是与服务控制点(SCP)的交互来获得呼叫信息。 因此,移动交换中心(MSC)仅需要与HLR通信,而不需要与SCP通信,本公开的MSC不需要支持智能处理。
    • 43. 发明申请
    • Specimen optical information recognizing device and its recognizing method
    • 标本光信息识别装置及其识别方法
    • US20090021722A1
    • 2009-01-22
    • US11659132
    • 2005-08-01
    • Ken TsukiiJie XuKenichi KimuraSatoshi Sugiyama
    • Ken TsukiiJie XuKenichi KimuraSatoshi Sugiyama
    • G01N21/00G01M7/00G01F23/00A61N5/00
    • G01N21/6452G01N21/253G01N2201/08
    • A specimen optical information recognizing device comprises a specimen containing section (14) containing a specimen (12) to be measured, a specimen measuring section (20) having a light source (16) for outputting light for observing the specimen (12) and a photodetecting section (18) for collecting optical information from the specimen (12), and an optical waveguide (22) for propagating light between the specimen containing section (14) and the specimen measuring section (20). The optical information on the specimen is recognized by using the measurement values acquired under at least two measurement conditions. The specimen optical information recognizing device may further comprises a measurement auxiliary liquid interposed between the end of the optical waveguide and the specimen. Further, the specimen containing section may have a feature that the longitudinal cross section is of a recessed shape, and the aperture depth of the recessed portion is greater than the aperture diameter. The specimen containing section may further have a feature that a through hole is provided at least in a part near the bottom of the specimen containing section.
    • 样本光学信息识别装置包括:样本容纳部(14),其包含待测试样本(12);样本测量部(20),具有用于输出用于观察样本(12)的光的光源(16);以及 用于从样本(12)收集光学信息的光电检测部分(18)和用于在样本容纳部分(14)和样本测量部分(20)之间传播光的光波导(22)。 通过使用在至少两个测量条件下获取的测量值来识别样品上的光学信息。 样本光学信息识别装置还可以包括插入在光波导的端部和样本之间的测量辅助液体。 此外,试样容纳部可以具有纵向截面为凹状的特征,凹部的开口深度大于孔径。 样品容纳部还可以具有至少在样本容纳部的底部附近的部分设置通孔的特征。
    • 44. 发明申请
    • Methods of Separating, Identifying and Dispensing Specimen and Device Therefor, and Analyzing Device Method
    • 分离,鉴定和分配样品及其装置的方法和分析装置方法
    • US20080257072A1
    • 2008-10-23
    • US11587210
    • 2005-04-25
    • Toru TakahashiKen TsukiiJie Xu
    • Toru TakahashiKen TsukiiJie Xu
    • B01L3/02A61L2/20G01N23/00G01P3/36
    • G01N15/1459B01F5/0057B01F11/0074B07C5/00G01N1/286G01N15/1427G01N15/1436G01N2015/1075G01N2035/1062
    • [PROBLEMS] A (a) (b) separation unit can confirms a separation state, a detection unit enhances a lighting efficiency and a light reception sensitivity, and a dispensing unit ensures the normal state of a specimen. [MEANS FOR SOLVING PROBLEMS] A specimen separation device characterized by comprising a container for storing a specimen, a nozzle for sucking and ejecting the specimen from the container, a nozzle operating means for moving the nozzle vertically and laterally, and a nozzle controlling means for controlling the suction force and ejection force of the nozzle. A specimen identification device comprising a nozzle for sucking a specimen from a container storing the specimen, a flow path for allowing the specimen to flow therethrough, and a measuring unit having a monitoring light lighting unit and a light receiving unit for observing (monitoring) the specimen that are installed in a flow path, characterized in that the above nozzle, the flow path and the measuring unit are formed in an integrated structure.
    • (问题)A(a)(b)分离单元可以确认分离状态,检测单元提高照明效率和光接收灵敏度,并且分配单元确保样本的正常状态。 用于解决问题的手段一种试样分离装置,其特征在于,包括容纳容器的容器,用于从容器吸取和喷射试样的喷嘴,用于使喷嘴垂直和侧向移动的喷嘴操作装置,以及用于 控制喷嘴的吸力和喷射力。 一种样本识别装置,包括:用于从容纳所述样本的容器吸取试样的喷嘴,用于使所述试样流过的流路;以及具有监视用光照射单元的测量单元和观察(监视) 试样,其安装在流路中,其特征在于,上述喷嘴,流路和测量单元形成为一体的结构。
    • 47. 发明授权
    • Semiconductor wafer cleaving method and apparatus
    • 半导体晶片切割方法和装置
    • US06171933B2
    • 2001-01-09
    • US09403732
    • 1999-10-26
    • Jie XuKenji Suzuki
    • Jie XuKenji Suzuki
    • H01L21301
    • H01L21/67092B28D5/0011B28D5/0023B28D5/0052H01L21/78Y10T225/18Y10T225/325Y10T225/357
    • The invention provides a semiconductor wafer cleaving method and apparatus which are used to obtain an ideal vertical cleaved plane of semiconductor wafers. A semiconductor wafer (1) having a scribing mark (2) inscribed on the surface is set on fulcrum members (6a and 6b). The fulcrum members (6a and 6b) are left-right symmetrical centering around the scribing mark (2) and parallel to the scribing mark (2). Fulcrum members (4a and 4b) are disposed left-right symmetrically centering around the scribing mark (2) and in parallel to the scribing mark (2) on the upper side of the semiconductor wafer (1). The fulcrum members (4a and 4b) are disposed outside the fulcrum members (6a and 6b). Load is applied from the fulcrum members (4a and 4b) side, wherein fulcrum forces are caused to operate from the respective fulcrum members (4a, 4b, 6a and 6b) onto the semiconductor wafer (1). A shearing force becomes zero in an area of the semiconductor wafer (1) between the fulcrum members (6a and 6b), wherein the maximum main stress of bending tension is actuated in a direction orthogonal to the perpendicular plane of the scribing mark (2), thereby cleaving the semiconductor wafer (1).
    • 本发明提供半导体晶片切割方法和装置,其用于获得半导体晶片的理想垂直切割平面。 将具有刻印在表面上的划刻标记(2)的半导体晶片(1)设置在支点(6a和6b)上。 支点构件(6a和6b)以划线标记(2)为中心并平行于划线标记(2)左右对称。 支点构件(4a和4b)以划线标记(2)为中心并与半导体晶片(1)的上侧上的划线标记(2)平行地左右对称地布置。 支点构件(4a和4b)设置在支点构件(6a和6b)的外侧。 从支点构件(4a和4b)侧施加载荷,其中使支点从相应的支点构件(4a,4b,6a和6b)操作到半导体晶片(1)上。 在支点构件(6a和6b)之间的半导体晶片(1)的区域中的剪切力变为零,其中弯曲张力的最大主应力在与划线标记(2)的垂直平面垂直的方向上被致动, ,从而切割半导体晶片(1)。