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42. 发明专利

JP4184973B2 Cabinet cooling 有权
公开(公告)号：JP4184973B2
公开(公告)日：2008-11-19
申请号：JP2003565219
申请日：2002-01-29
申请人：テレフオンアクチーボラゲットエルエムエリクソン(パブル)
发明人：ヴァディムツソイ，
IPC分类号： H05K7/20 , F25B1/06 , F25B23/00 , G05D19/00 , G05D23/19
CPC分类号： H05K7/20381 , F25B1/06 , F25B23/006 , F25B2700/2106 , F25B2700/2116 , F25B2700/2117 , G05D23/1931

43. 发明专利

KR20210038458A KR20210038458A - Refrigeration system 审中-公开
公开(公告)号：KR20210038458A
公开(公告)日：2021-04-07
申请号：KR1020210034552A
申请日：2021-03-17
申请人： 베이징 바이두 넷컴 사이언스 앤 테크놀로지 코., 엘티디.
发明人： 지밍 루오 , 이이 듀안 , 빈 이 , 시아오종 리
IPC分类号： H05K7/20
CPC分类号： H05K7/20827 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20381
摘要： 본 개시는 데이터 센터의 냉각 기술 분야에 관한 냉각 시스템을 공개한다. 상기 시스템은 증발식 응축기, 펌프 캐비닛 및 열교환 말단을 포함하고, 상기 펌프 캐비닛은 제1 브랜치 및 제2 브랜치를 포함하며; 여기서, 상기 제1 브랜치는 액체 저장 탱크 및 불소 펌프를 포함하고, 상기 액체 저장 탱크의 입력단은 상기 증발식 응축기의 출력단에 연결되며, 상기 액체 저장 탱크의 출력단은 상기 불소 펌프의 입력단에 연결되고, 상기 불소 펌프의 출력단은 상기 열교환 말단의 입력단에 연결되며; 상기 제2 브랜치는 압축기를 포함하고, 상기 압축기의 입력단은 상기 열교환 말단의 출력단에 연결되며, 상기 압축기의 출력단은 상기 증발식 응축기의 입력단에 연결된다. 본 개시에 따른 기술은 냉각 시스템의 열교환 단계를 감소시킬 수 있음으로써, 냉각 시스템의 에너지 소모를 감소시키고, 냉각 시스템의 에너지 절약성을 향상시킬 수 있다.

44. 发明专利

JP6380563B2 冷却装置及び電子機器审中-公开
公开(公告)号：JP6380563B2
公开(公告)日：2018-08-29
申请号：JP2016574547
申请日：2015-02-09
申请人：富士通株式会社
发明人：林信幸 , 中西輝 , 木村孝浩
IPC分类号： F28D15/06 , H05K7/20 , H01L23/427 , F28D15/02
CPC分类号： H05K7/20381 , F28D15/0266 , F28D15/06 , F28F27/00 , F28F2265/12 , H01L23/34 , H01L23/427 , H01L23/467 , H05K7/20309 , H05K7/20318 , H05K7/20727 , H05K7/20809

45. 发明专利

JP2018501772A 構造フレーム冷却マニホルド审中-公开
公开(公告)号：JP2018501772A
公开(公告)日：2018-01-18
申请号：JP2017549171
申请日：2015-12-08
申请人：ジョンソンコントロールズテクノロジーカンパニー , Johnson Controls Technology Company
发明人：ボリソフ,コンスタンティン , ニールセン,マーク・エイ , マルティネリ,ジェフリー・エイ , ストーファー,ブライアン・エル , グラッドフェルター,セス・ケイ , トッド,マイケル・エス , ジャドリック,アイヴァン , シュライバー,ジェブ・ダブリュー , ベックリー,ティム
IPC分类号： H02M7/48 , H01L23/473 , H05K7/20
CPC分类号： H05K7/20936 , F25B31/006 , H02M5/40 , H02P27/06 , H05K7/20327 , H05K7/20354 , H05K7/20381 , H05K7/20927
摘要：変速駆動装置は、AC電力源に接続されたコンバータと、コンバータに接続されたDCリンクと、DCリンクに接続されたインバータとを含む。インバータは、DC電圧を可変性の電圧及び周波数を有する出力AC電力に変換する。インバータは、少なくとも1つのパワーエレクトロニクスモジュール及び関連する制御回路と、パワーエレクトロニクスモジュールと熱的に連通し、マニホルドと流体連通するヒートシンクと、を含む。マニホルドは、流体連通する少なくとも1つの垂直部材部及び少なくとも1つの水平部材部を有する管状部材を含む。複数のポートは、冷却流体をマニホルド内に及びマニホルドから外へ導く。ブラケットは、マニホルドを構造フレームに取り付ける。複数のブラケットが、マニホルドへのパワーエレクトロニクスモジュールの取り付けのために設けられる。【選択図】図5

46. 发明公开

EP3364735A1 KÜHLVORRICHTUNG, UMRICHTER MIT EINER KÜHLVORRICHTUNG UND VERFAHREN ZUR KÜHLUNG EINES UMRICHTERS 审中-公开
公开(公告)号：EP3364735A1
公开(公告)日：2018-08-22
申请号：EP17156233.3
申请日：2017-02-15
申请人： Siemens Aktiengesellschaft
发明人： Danov, Vladimir , Müller, Volker
IPC分类号： H05K7/20
CPC分类号： H05K7/20936 , H05K7/20336 , H05K7/20381
摘要： Es wird eine Kühlvorrichtung (1) zur Kühlung elektrischer Komponenten eines Umrichters (2) vorgeschlagen, die wenigstens eine Kühlplatte (4) mit einem ersten und zweiten Kühlbereich (410, 420), wobei die Kühlbereiche (410, 420) mit einer Siedekühlvorrichtung (6) thermisch gekoppelt sind, umfasst. Erfindungsgemäß weist die Kühlvorrichtung (1) wenigstens ein erstes Steuerelement (41) auf, mittels welchem die Kühlleistung der Siedekühlvorrichtung(6) wenigstens eines der Kühlbereiche (410) steuerbar ist.

47. 发明公开

EP3159908A1 IMPROVEMENT OF HEAT DISSIPATION FROM ACB TOES 有权
标题翻译： ACB TOES散热的改进
公开(公告)号：EP3159908A1
公开(公告)日：2017-04-26
申请号：EP16194918.5
申请日：2016-10-20
申请人： Anord Control Systems Limited
发明人： Kennelly, Patrick
IPC分类号： H01H9/52 , H02G5/10 , H02B1/56 , H01H1/62 , H01H71/08
CPC分类号： H01H1/62 , H01H9/52 , H01H71/08 , H01H2009/523 , H05K7/20127 , H05K7/20309 , H05K7/20318 , H05K7/20336 , H05K7/20381 , H05K7/20409
摘要： A heat dissipation apparatus (300) for an air circuit breaker (ACB) switchgear has at least one pair of primary contact toes (200) constructed and arranged to connect to a terminal of the circuit breaker. A bus bar (250) joint is connected to the primary contact toes (200). The heat dissipation apparatus (300) comprises an evaporator (110) clamped to the primary contact toes (200). A condenser (330) is located at a higher elevation than the evaporator (110) and at least two electrically isolating pipes (112,114) fluidly connect the evaporator (110) with the condenser (330). A dielectric fluid in the evaporator (110) can be heated to a vapour state, with one of the pipes (112) transferring the vapour to the condenser (330) and the second pipe (114) returning the condensed dielectric fluid back to the evaporator (110) for cooling the at least one pair of primary contact toes (200).
摘要翻译：一种用于空气断路器（ACB）开关装置的散热设备（300）具有至少一对主触头脚（200），其被构造和布置为连接到断路器的端子。母线（250）接头连接到主触头脚趾（200）。散热装置（300）包括夹紧到主触头脚趾（200）的蒸发器（110）。冷凝器（330）位于比蒸发器（110）更高的高度处，并且至少两个电隔离管（112,114）将蒸发器（110）与冷凝器（330）流体连接。蒸发器（110）中的介电流体可以被加热到蒸气状态，其中一个管道（112）将蒸汽传送到冷凝器（330），并且第二管道（114）将冷凝的介电流体返回到蒸发器（110），用于冷却所述至少一对主接触脚趾（200）。

48. 发明公开

EP2844050A4 COOLER, ELECTRICAL COMPONENT UNIT, AND REFRIGERATION DEVICE 有权
标题翻译： COOL电气元件单元和COOLER
公开(公告)号：EP2844050A4
公开(公告)日：2015-12-30
申请号：EP13782260
申请日：2013-04-26
申请人： DAIKIN IND LTD
发明人： TERAKI JUNICHI , OGURI AKIHIKO , KITA MASANOBU
IPC分类号： H05K7/20 , F24F1/24 , H01L23/473
CPC分类号： H05K7/20381 , F24F1/24 , F25B31/006 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H05K1/0203 , H05K7/20254 , H05K7/20354 , H05K7/20936 , H01L2924/00
摘要： A cooler (60) is placed on a power module (53) to cool the power module (53) with refrigerant through a refrigerant pipe (15), and includes a heat transfer plate (62) having a groove (61) into which a cooling pipe (15) is fitted, and a presser plate (64) configured to press the cooling pipe (15) against the groove (61). The cooler (60) includes a hinge mechanism (77) configured to rotatably attach the presser plate (64) to the heat transfer plate (62) such that the presser plate (64) is switched between an open position at which the groove (61) is exposed and a closed position at which the presser plate (64) covers the groove (61).

49. 发明公开

EP2420116A1 HEAT TRANSFER ARRANGEMENT AND ELECTRONIC HOUSING COMPRISING A HEAT TRANSFER ARRANGEMENT AND METHOD OF CONTROLLING HEAT TRANSFER 有权
标题翻译：传热整理与电子元件外壳，用于控制传热换热系统和方法
公开(公告)号：EP2420116A1
公开(公告)日：2012-02-22
申请号：EP09788523.0
申请日：2009-04-16
申请人： Telefonaktiebolaget LM Ericsson (publ)
发明人： JONSSON, Fredrik , KÄLLMARK, Magnus , HEDBERG, Klas
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： H05K7/20681 , F28D15/0266 , F28D15/06 , H05K7/20381
摘要： A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self- circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102). A control device associated with the reservoir (124) is operable such that liquid refrigerant is collected in the reservoir (124) from the refrigerant circuit (102) to reduce heat exchange from the inside of the electronic component housing (112) to the ambient environment and such that liquid refrigerant is introduced from the reservoir (124) to the refrigerant circuit to increase heat exchange from the inside of the electronic component housing (112) to ambient environment.

50. 发明公开

EP0736161A1 AN AIR COOLING SYSTEM 失效
标题翻译：空冷系统
公开(公告)号：EP0736161A1
公开(公告)日：1996-10-09
申请号：EP95904727.0
申请日：1994-12-19
申请人： TELEFONAKTIEBOLAGET LM ERICSSON
发明人： FORSMAN, Bertil
IPC分类号： F25B25 , F25D1 , F25D16 , H05K7 , F24F1
CPC分类号： H05K7/20381 , F24F1/02 , F24F2203/021 , F24F2203/026 , F25D16/00 , H05K7/20354
摘要： To obtain a cooling system of compact design and with redundancy and free cold, heat exchangers in a cooling system are combined such that by said cooling system the inside air is cooled by means of cold liquid or boiling cooling medium in a combined evaporator-air cooler (2) and the outside air cools warm liquid or condensing cooling medium in a combined condensor-liquid cooler (1). Free cold may be utilized when the difference in temperature between inside air and outside air is big enough and the outside air is sufficiently cold. Liquid cooled by the outside air in the combined condenser-liquid cooler (1) and then heated by the warm inside air in the combined evaporator-air cooler (2) will then take care of the entire heat load alone. In other cases, the compressor system can provide the cooling. The free-cooling system can serve as a redundant system for the compressor system when the latter is out of order.

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