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51. 发明授权

US4563974A Apparatus for the application of solder to workpieces 失效
标题翻译：用于将焊料应用于工件的装置
公开(公告)号：US4563974A
公开(公告)日：1986-01-14
申请号：US532787
申请日：1983-09-16
申请人： Robert G. Price
发明人： Robert G. Price
IPC分类号： H05K3/24 , B23K1/08 , B23K3/06 , C23C2/08 , H05K3/34 , B05C3/10
CPC分类号： B23K3/0692 , B23K1/085 , H05K3/3468 , B23K2201/42 , H05K2203/044 , H05K2203/0776 , H05K2203/1509 , H05K2203/1518 , H05K3/3494
摘要： A soldering technique is provided especially for printed circuit boards wherein a bath of solder assisting fluid such as non-ionic surface active agent is superposed on a bath of solder. In one form, the workpiece is passed through the bath of solder assisting fluid and solder is pumped from the bath of solder to a trough whereat the solder is cascaded onto the workpiece. In another form, the workpiece is passed downwardly through the bath of solder assisting fluid into the bath of solder for the application of solder to the workpiece. Thereafter, the workpiece is withdrawn from the bath of solder through the bath of solder assisting fluid. In both instances, while the workpiece is still within the bath of solder assisting fluid, jets of this fluid are played against the workpiece to control the thickness of the solder which is allowed to remain on the workpiece. This is accomplished by immersion of fluid levelling knives in the bath of solder assisting fluid with jets being played by these knives onto the workpiece. In addition, provision is made for air blowing the workpiece to remove the solder assisting fluid therefrom. Thereafter, the workpiece is cooled, rinsed and dried.
摘要翻译：为印刷电路板提供焊接技术，其中焊料辅助流体如非离子表面活性剂的浴叠加在焊料槽上。在一种形式中，工件通过焊料辅助流体浴，并且焊料从焊料槽泵送到槽，其中焊料级联到工件上。在另一种形式中，工件向下通过焊料助焊剂液体进入焊料槽，以将焊料施加到工件上。此后，通过焊剂助焊剂液体从焊料槽中取出工件。在这两种情况下，当工件仍然在辅助辅助流体的槽中时，该流体的喷嘴与工件相撞，以控制允许保留在工件上的焊料的厚度。这是通过将液体调平刀浸入焊剂辅助流体的浴中来实现的，其中这些刀被喷射到工件上。此外，还提供了吹送工件的空气以从其中除去助焊剂。此后，将工件冷却，漂洗并干燥。

52. 发明授权

US3006318A Apparatus for applying solder coatings to surfaces 失效
标题翻译：用于将焊料涂层施加到表面的装置
公开(公告)号：US3006318A
公开(公告)日：1961-10-31
申请号：US72406258
申请日：1958-03-26
申请人： WESTERN ELECTRIC CO
发明人： MONROE JR RAYMOND , MOORE TOM E
IPC分类号： B23K3/06
CPC分类号： B23K3/0692

53. 发明授权

US2968091A Method of applying solder to a joint 失效
标题翻译：将焊料焊接到接头上的方法
公开(公告)号：US2968091A
公开(公告)日：1961-01-17
申请号：US40696654
申请日：1954-01-29
申请人： AMERICAN CAN CO
发明人： SCHOENFELD JR WILLIAM H
IPC分类号： B23K3/06 , B23K35/26
CPC分类号： B23K35/268 , B23K3/0692

54. 发明授权

US2918028A Apparatus for soldering printed circuits 失效
标题翻译：用于焊接印刷电路的装置
公开(公告)号：US2918028A
公开(公告)日：1959-12-22
申请号：US47908954
申请日：1954-12-31
申请人： RCA CORP
发明人： WRIGHT THEODORE M
IPC分类号： B23K3/06
CPC分类号： B23K3/0692

55. 发明授权

US2771852A Soldering machine 失效
公开(公告)号：US2771852A
公开(公告)日：1956-11-27
申请号：US54422955
申请日：1955-11-01
申请人： RCA CORP
发明人： ILES FRANK B
IPC分类号： B23K3/06
CPC分类号： B23K3/0692

56. 发明申请

US20130269984A1 SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD 有权
标题翻译：焊接装置，焊接方法以及由焊接装置产生的基板和电子部件或焊接方法
公开(公告)号：US20130269984A1
公开(公告)日：2013-10-17
申请号：US13819555
申请日：2012-04-14
申请人： Katsumori Taniguro
发明人： Katsumori Taniguro
IPC分类号： B23K3/06 , H05K1/02
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/20 , B23K1/206 , B23K3/0692 , H01L2924/14 , H05K1/0296 , H01L2924/00
摘要： Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.
摘要翻译：提供了一种能够以低成本，高产率和高可靠性进行焊接的焊接装置和焊接方法。焊接装置具有：将具有铜电极的工件10浸渍在含有有机脂肪酸的溶液31a中的第一含有机脂肪酸的溶液浴21; 具有含有机脂肪酸溶液31b的蒸汽气氛的空间部分24，空间部分水平地具有喷射单元33，以将熔融焊料的喷射流喷射到设置在工件10上的铜电极和喷射单元34上以喷射液体超过熔融焊料去除; 和第二有机脂肪酸溶液槽23，其中在空间部分24中除去过量的熔融焊料的工件10再次浸渍在含有机脂肪酸的溶液31c中。

57. 发明授权

US08448838B2 Solder ball loading mask, apparatus and associated methodology 有权
标题翻译：焊球加载掩模，仪器和相关方法
公开(公告)号：US08448838B2
公开(公告)日：2013-05-28
申请号：US13315972
申请日：2011-12-09
申请人： Shigeki Sawa , Katsuhiko Tanno , Osamu Kimura , Koji Kuribayashi
发明人： Shigeki Sawa , Katsuhiko Tanno , Osamu Kimura , Koji Kuribayashi
IPC分类号： B23K1/00 , B23K1/20
CPC分类号： H05K3/3478 , B23K3/0623 , B23K3/0692 , B23K2101/36 , H05K3/3489 , H05K2203/041 , H05K2203/0485 , H05K2203/0557
摘要： A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.
摘要翻译：能够将焊球牢固地装载在连接焊盘上的焊球加载方法包括在印刷电路板的每个连接焊盘组上施加焊剂，焊剂不会施加到间隔件和印刷电路板之间的接触部分，以保持焊剂附着到间隔物。由于焊剂没有附着到间隔物上，当掩模与印刷电路板分离时，印刷电路板不需要颠倒，并且使阻焊层70的损坏最小化。此外，通过使用间隔件使焊球的高度和掩模的上表面相等，使得可以将焊球牢固地加载在电极焊盘上，每个连接焊盘用一个焊球，并且降低概率该焊球没有被加载，或者多个焊球被加载到单个连接焊盘上。

58. 发明申请

US20030097941A1 Method and apparatus for dispensing material in a printer 有权
公开(公告)号：US20030097941A1
公开(公告)日：2003-05-29
申请号：US10254348
申请日：2002-09-24
发明人： Mark Rossmeisl , Gary T. Freeman
IPC分类号： B41L013/18 , B05C017/04
CPC分类号： B23K3/0607 , B23K3/0692 , B23K2101/36 , H05K3/1233 , H05K3/3484 , H05K2203/0126 , H05K2203/0783 , H05K2203/1105
摘要： A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system to maintain the temperature of the viscous material contained in the chamber. The material dispenser also includes a closed-loop pressure control system to provide in-process control of the pressure of the chamber which permits uniform application of the viscous material to the substrate.

59. 发明授权

US6162661A Spacer plate solder ball placement fixture and methods therefor 失效
标题翻译：隔板焊球放置夹具及其方法
公开(公告)号：US6162661A
公开(公告)日：2000-12-19
申请号：US86808
申请日：1998-05-29
申请人： Joseph Link
发明人： Joseph Link
IPC分类号： B23K3/06 , H01L21/48 , H01L21/60 , H05K3/34 , H01L21/44 , H01L21/50
CPC分类号： H05K3/3478 , B23K3/0692 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/11334 , H01L2224/13099 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H05K2201/2036 , H05K2203/041 , H05K2203/0557 , Y10T29/41 , H01L2924/00
摘要： A method placing conductive elements, such as solder balls, over terminals on a microelectronic assembly includes providing a microelectronic element having a first surface and one or more terminals accessible at the first surface, and securing a spacer plate having a top surface, a bottom surface and at least one opening extending therethrough over the first surface of the microelectronic element so that the at least one opening is in substantial alignment with the terminals. After the spacer plate has been secured over the first surface of the microelectronic element, a stencil for placing conductive elements is then secured over the spacer plate. The stencil has a top surface and a bottom surface and a plurality of openings extending therethrough. When the stencil is secured over the spacer plate, the plurality of openings in the stencil are in substantial alignment with the terminals. As a result, the spacer plate maintains the stencil remote from the terminals. The conductive elements, such as solder balls, are then deposited through the plurality of openings in the stencil so that each deposited conductive element is affixed atop one of the terminals of the microelectronic assembly.
摘要翻译：将诸如焊球的导电元件（例如焊球）放置在微电子组件上的方法包括提供具有第一表面的微电子元件和在第一表面可访问的一个或多个端子，以及固定具有顶表面的间隔板，底表面以及在微电子元件的第一表面上延伸穿过其中的至少一个开口，使得至少一个开口与端子基本上对准。在隔离板已经固定在微电子元件的第一表面上之后，用于放置导电元件的模板然后被固定在隔离板上。模板具有顶表面和底表面以及延伸穿过其中的多个开口。当模板固定在间隔板上时，模板中的多个开口与端子基本对准。结果，间隔板将模板保持远离端子。导电元件，例如焊球，然后通过模板中的多个开口沉积，使得每个沉积的导电元件固定在微电子组件的一个端子上。

60. 发明授权

US5662262A Tape withh solder forms and methods for transferring solder forms to chip assemblies 失效
标题翻译：带有焊料形式的胶带和将焊料形式转移到芯片组件的方法
公开(公告)号：US5662262A
公开(公告)日：1997-09-02
申请号：US412292
申请日：1995-03-28
申请人： John Francis McMahon , George Chiu
发明人： John Francis McMahon , George Chiu
IPC分类号： B23K3/06 , B23K35/02 , H01L21/48 , H01L21/60 , H01L21/68 , H05K3/30 , H05K3/34 , B23K35/00
CPC分类号： H01L24/16 , B23K3/0623 , B23K3/0692 , B23K35/0222 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/81 , H05K3/3436 , H05K3/3478 , B23K2201/36 , B23K2201/40 , H01L2224/11003 , H01L2224/11013 , H01L2224/11334 , H01L2224/13099 , H01L2224/27438 , H01L2224/48091 , H01L2224/48227 , H01L2224/81101 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H05K2201/10378 , H05K2201/10424 , H05K2201/10977 , H05K2203/0113 , H05K2203/0156 , H05K2203/0338 , H05K2203/041 , H05K3/303 , Y02P70/613
摘要： A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a "bed of nails". In addition, the solder forms maybe shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.
摘要翻译：公开了一卷带有焊料形式的胶带以及用于仅将焊料形成或将两种焊料形式和带的部分两者转移到电子部件的方法。电子元件可以是集成电路芯片，芯片封装和印刷电路板中的任何一种。将焊料形式转移到电子部件是一个两步的过程：（a）焊料形式定位并离线放置在一卷胶带上，（b）胶带上的焊料形式被转移到电子部件中一条装配线。焊料形式可能暂时或永久性地附着在磁带上。首先，仅传送焊料形式。在后一种情况下，带部分被转移到具有焊料形式的电子部件。焊料形式可以使用UV敏感粘合剂或冷粘合剂（例如助焊剂）附接到带的一侧或带中的通孔中。可以通过将焊料形式压在电子部件上，将UV敏感粘合剂暴露于UV光或使用“指甲床”来消除焊料形式。此外，焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。胶带是导热和耐热的，并且可以具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。

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