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61. 外观设计

USD654193S1 LED lamp 有权
公开(公告)号：USD654193S1
公开(公告)日：2012-02-14
申请号：US29375645
申请日：2010-09-24
申请人： Tao Tong , Ronan Letoquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, Jr. , Antony Van De Ven , Gerald Negley , Zongjie Yuan
设计人： Tao Tong , Ronan Letoquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, Jr. , Antony Van De Ven , Gerald Negley , Zongjie Yuan

62. 发明申请

US20110317093A1 LED BACKLIGHT SYSTEM FOR LCD DISPLAYS 有权
公开(公告)号：US20110317093A1
公开(公告)日：2011-12-29
申请号：US13228580
申请日：2011-09-09
申请人： Nicholas W. Medendorp, JR. , Norbert Hiller , Russell G. Villard
发明人： Nicholas W. Medendorp, JR. , Norbert Hiller , Russell G. Villard
IPC分类号： G02F1/13357
CPC分类号： G02F1/133615 , G02B6/0028 , G02B6/0038 , G02B6/0068 , G02B6/0076 , G02F1/133524 , G02F1/133603
摘要： A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

63. 发明授权

US08042971B2 Light emitting device (LED) lighting systems for emitting light in multiple directions and related methods 有权
标题翻译：用于多方向发光的发光装置（LED）照明系统及相关方法
公开(公告)号：US08042971B2
公开(公告)日：2011-10-25
申请号：US12046549
申请日：2008-03-12
申请人： Nicholas W. Medendorp, Jr. , Norbert Hiller
发明人： Nicholas W. Medendorp, Jr. , Norbert Hiller
IPC分类号： F21V21/00
CPC分类号： F21V7/0016 , F21K9/64 , F21S8/06 , F21V3/04 , F21Y2103/33 , F21Y2107/90 , F21Y2115/10
摘要： Lighting systems for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs are provided. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.
摘要翻译：提供了用于在多个方向发射光的照明系统，包括一个或多个发光器件（LED）和被配置为接收一个或多个LED的外壳。一个或多个LED被配置为在第一方向上产生光以照亮靠近照明系统的第一区域。壳体被配置为反射所产生的光的一部分，以便允许所生成的光的剩余部分沿与第一方向不同的第二方向穿过壳体，并且照亮靠近照明系统的第二区域。本文还提供了相关方法。

64. 发明申请

US20110233579A1 LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES AND METHODS OF FORMING LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES 有权
标题翻译：用于固态发光装置的基于LEADFRAME的封装以及形成用于固态发光装置的基于引线框架的封装的方法
公开(公告)号：US20110233579A1
公开(公告)日：2011-09-29
申请号：US13153930
申请日：2011-06-06
申请人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp, JR.
发明人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp, JR.
IPC分类号： H01L33/62
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。引线框还可以包括远离中心区延伸的电引线。电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。第二厚度可以小于第一厚度。所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。还公开了形成模块化封装和引线框架的方法。

65. 发明申请

US20110215699A1 SOLID STATE LAMP AND BULB 有权
标题翻译：固态灯和灯泡
公开(公告)号：US20110215699A1
公开(公告)日：2011-09-08
申请号：US13028946
申请日：2011-02-16
申请人： Long Larry Le , Paul Pickard , James Michael Lay , Tao Tong , Ronan Letoquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, JR. , Antony Van De Ven , Gerald Negley
发明人： Long Larry Le , Paul Pickard , James Michael Lay , Tao Tong , Ronan Letoquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, JR. , Antony Van De Ven , Gerald Negley
IPC分类号： H01J61/52 , H01J5/02 , H01J1/62
CPC分类号： F21K9/135 , F21K9/232 , F21K9/64 , F21V3/00 , F21V29/773 , F21Y2115/10 , H01J5/02 , H01J61/52 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/0002 , H01L2924/00 , H01L2924/00014
摘要： Solid state lamps and bulbs comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffuser. These are arranged on a heat sink in a manner that allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs. Embodiments of the invention can be arranged to fit recognized standard size profiles such as those ascribed to commonly used lamps such as incandescent light bulbs, while still providing emission patterns that comply with ENERGY STAR® standards.
摘要翻译：固态灯和灯泡包括不同的组合和布置的光源，一个或多个波长转换材料，相对于光源单独地或远程定位的区域或层，以及单独的扩散器。这些以允许制造有效，可靠和成本有效的灯泡的方式布置在散热器上，并且可以提供基本上全方位的发射图案，即使由包括共面布置的光源的LED。此外，当灯不被照亮时，这种布置允许对转换区域或层的外观的美观掩蔽或隐藏。可以使用本发明的各种实施例来解决在制造适于直接替代传统白炽灯泡的灯泡或灯泡中利用有效的固态光源（例如LED）所涉及的许多困难。本发明的实施例可以被布置成适合公认的标准尺寸轮廓，例如归因于常用灯（例如白炽灯泡）的标准尺寸轮廓，同时仍然提供符合ENERGYSTAR®标准的排放模式。

66. 发明授权

US07943952B2 Method of uniform phosphor chip coating and LED package fabricated using method 有权
标题翻译：使用方法制造均匀荧光粉芯片涂层和LED封装的方法
公开(公告)号：US07943952B2
公开(公告)日：2011-05-17
申请号：US11881683
申请日：2007-07-27
申请人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Peter Andrews , Yankun Fu , Michael Laughner , Ronan Letoquin
发明人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Peter Andrews , Yankun Fu , Michael Laughner , Ronan Letoquin
IPC分类号： H01L33/52
CPC分类号： H01L33/58 , H01L33/505 , H01L33/54 , H01L2224/48091 , H01L2924/19107 , H01L2933/0041 , H01L2933/005 , H01L2924/00014
摘要： Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.
摘要翻译：制造LED封装的方法包括提供LED芯片并用液体介质覆盖其至少一部分。提供光学元件并放置在液体介质上。允许光学元件沉降至所需水平并且液体介质固化。还公开了使用所公开的方法制造的LED封装。

67. 发明申请

US20100133578A1 SOLID STATE LIGHTING DEVICE WITH IMPROVED HEATSINK 有权
标题翻译：具有改进的HEATSINK的固态照明装置
公开(公告)号：US20100133578A1
公开(公告)日：2010-06-03
申请号：US12535353
申请日：2009-08-04
申请人： Paul Kenneth Pickard , Nicholas W. Medendorp, JR.
发明人： Paul Kenneth Pickard , Nicholas W. Medendorp, JR.
IPC分类号： H01L33/00 , H01L21/00 , F21V29/00
CPC分类号： F21V29/004 , F21K9/23 , F21V7/0025 , F21V23/006 , F21V29/505 , F21V29/677 , F21V29/70 , F21V29/83 , F21V29/85 , F21Y2115/10
摘要： A solid state lighting device includes a device-scale stamped heatsink with a base portion and multiple segments or sidewalls projecting outward from the base portion, and dissipates all steady state thermal load of a solid state emitter to an ambient air environment. The heatsink is in thermal communication with one or more solid state emitters, and may define a cup-like cavity containing a reflector. At least a portion of each one sidewall portion or segment extends in a direction non-parallel to the base portion. A dielectric layer and at least one electrical trace may be deposited over a metallic sheet to form a composite sheet, and the composite sheet may be processed by stamping and/or progressive die shaping to form a heatsink with integral circuitry. At least some segments of a heatsink may be arranged to structurally support a lens and/or reflector associated with a solid state lighting device.
摘要翻译：固态照明装置包括具有基部的装置级冲压散热器和从基部向外突出的多个段或侧壁，并且将固态发射器的所有稳态热负载耗散到环境空气环境中。散热器与一个或多个固态发射器热连通，并且可以限定包含反射器的杯状空腔。每个侧壁部分或部分的至少一部分在不平行于基部的方向上延伸。电介质层和至少一个电迹线可以沉积在金属片上以形成复合片材，并且复合片材可以通过冲压和/或渐进的模具成型来加工，以形成具有集成电路的散热器。散热器的至少一些段可以布置成在结构上支撑与固态照明装置相关联的透镜和/或反射器。

68. 发明申请

US20090225543A1 Optical system for batwing distribution 有权
标题翻译：蝙蝠分配光学系统
公开(公告)号：US20090225543A1
公开(公告)日：2009-09-10
申请号：US12074762
申请日：2008-03-05
申请人： Benjamin A. Jacobson , Robert D. Gengelbach , Nicholas W. Medendorp, JR. , Lawrence Roberts , John Perry
发明人： Benjamin A. Jacobson , Robert D. Gengelbach , Nicholas W. Medendorp, JR. , Lawrence Roberts , John Perry
IPC分类号： F21V7/00 , G02B17/00 , G21G4/00 , A61N5/06
CPC分类号： F21V13/04 , F21S4/28 , F21V5/007 , F21V5/04 , F21V29/004 , F21V29/505 , F21V29/71 , F21V29/763 , F21W2131/103 , F21Y2101/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G02B27/095 , H01L33/54
摘要： A radiation distribution system designed to produce a batwing distribution. The system may be used with radiative sources emitting in the visible spectrum or in other spectra. The system comprises a specially shaped lens disposed over a radiative source, such as an LED, for example. The lens and source are arranged between two reflector bodies, both of which have an elongated reflective surface that faces the source. The reflector bodies each have two different reflective surfaces that face outward and away from each other. The lens and both reflective surfaces work in concert to redirect a portion of the emitted radiation to create the desired batwing distribution. Several sources may be arranged linearly between a single pair of reflector bodies on a common surface to create a linear array of sources. Likewise, multiple linear arrays may be combined to form a two-dimensional array. In the two-dimensional configuration, linear arrays of sources are disposed on both sides of a reflector body, so that both of the reflective surfaces are utilized.
摘要翻译：设计用于产生蝙蝠分布的辐射分布系统。该系统可以与在可见光谱或其它光谱中发射的辐射源一起使用。该系统包括例如设置在辐射源（例如LED）上的特殊形状的透镜。透镜和光源布置在两个反射体之间，两个反射体具有面向光源的细长反射表面。反射体各自具有面向外且彼此远离的两个不同的反射表面。透镜和两个反射表面一起工作以重定向发射的辐射的一部分以产生所需的蝙蝠分布。可以在公共表面上的单对反射体之间线性布置若干源，以产生线阵列的源。同样，可以组合多个线性阵列以形成二维阵列。在二维构造中，源极的线性阵列设置在反射体的两侧，从而利用两个反射表面。

69. 发明授权

US09151457B2 Lighting device and method of installing light emitter 有权
标题翻译：照明装置及安装光源的方法
公开(公告)号：US09151457B2
公开(公告)日：2015-10-06
申请号：US13365844
申请日：2012-02-03
申请人： Paul Kenneth Pickard , Nicholas W. Medendorp, Jr. , Mark D. Edmond , Dong Lu , Curt Progl , Mark Dixon
发明人： Paul Kenneth Pickard , Nicholas W. Medendorp, Jr. , Mark D. Edmond , Dong Lu , Curt Progl , Mark Dixon
IPC分类号： F21V15/00 , F21V17/00 , F21S8/02 , F21V15/01 , F21V3/00 , F21Y101/02
CPC分类号： F21S8/026 , F21V3/00 , F21V15/01 , F21Y2115/10 , Y10T29/49002
摘要： A lighting device comprising a junction box, a trim element and a solid state light emitter, at least a portion of a space defined by regions of the trim element within a space defined by regions of the junction box, the light emitter within the trim element space. A lighting device comprising a trim element (with at least two regions) and a solid state light emitter, in which at least a first part of the first region can be positioned in a first space with the second region outside the first space, the light emitter within the first part. A lighting device, comprising a trim element (which comprises at least two regions), part of an exterior of which defines a first space, at least a first part of the first region within the first space, a solid state light emitter within the first part. Methods of installing a light emitter.
摘要翻译：一种照明装置，包括接线盒，装饰元件和固态光发射器，在由接线盒的区域限定的空间内的修剪元件的区域限定的空间的至少一部分，修剪元件内的光发射器空间。一种照明装置，包括具有至少两个区域的装饰元件和固态光发射器，其中第一区域的至少第一部分可以位于第一空间中，第二区域在第一空间外部，光发射器在第一部分。一种照明装置，包括装饰元件（其包括至少两个区域），其外部的一部分限定第一空间，第一空间内的第一区域的至少第一部分，第一空间内的固态光发射器部分。安装光发射器的方法。

70. 发明授权

US08941134B2 Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging 有权
标题翻译：用于在封装中具有散热区域的固态发光器件的基于引线框的封装
公开(公告)号：US08941134B2
公开(公告)日：2015-01-27
申请号：US13242103
申请日：2011-09-23
申请人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Eric Tarsa , Bernd Keller
发明人： Ban P. Loh , Nicholas W. Medendorp, Jr. , Eric Tarsa , Bernd Keller
IPC分类号： H01L33/62 , H01L23/495 , H01L33/48 , H01L33/64 , H01L23/498 , H01L25/075
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域。引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。热固性封装体可以在第二区域的顶表面和底表面上。泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

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