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1. 发明授权

US10352547B2 Lighting devices, fixture structures and components for use therein 有权
公开(公告)号：US10352547B2
公开(公告)日：2019-07-16
申请号：US13026495
申请日：2011-02-14
申请人： Paul Kenneth Pickard , Gerald H. Negley , Antony Paul Van De Ven , Nicholas W. Medendorp, Jr.
发明人： Paul Kenneth Pickard , Gerald H. Negley , Antony Paul Van De Ven , Nicholas W. Medendorp, Jr.
IPC分类号： F21V29/70 , F21S8/02 , F21V3/04 , F21V3/06 , F21Y115/10 , F21Y113/13
摘要： In some embodiments, a lighting device comprising two or more light sources and an optical device configured to enhance uniformity of light emitted from the light sources and emerging from a surface of the optical device, an average distance between light sources less than one half of the square root of the area of the surface divided by the number of light sources. In some embodiments, a fixture structure comprising a reflective structure and a heat conductor in contact with the reflective structure and covering not more than 30 percent of the surface area of the reflective structure. In some embodiments, a lighting device comprising a fixture structure, at least one light source mounted on one substrate, and at least one light source mounted on another substrate. Other fixture structures and lighting devices.

2. 发明授权

US09316361B2 LED lamp with remote phosphor and diffuser configuration 有权
标题翻译： LED灯带有远程荧光粉和扩散器配置
公开(公告)号：US09316361B2
公开(公告)日：2016-04-19
申请号：US13018245
申请日：2011-01-31
申请人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, Jr. , Antony Van De Ven , Gerald Negley
发明人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas W. Medendorp, Jr. , Antony Van De Ven , Gerald Negley
IPC分类号： F21K99/00 , F21V3/02 , F21V3/04 , F21Y101/02 , F21V29/505 , F21V29/76 , F21V29/77
CPC分类号： F21K9/135 , F21K9/232 , F21K9/64 , F21V3/02 , F21V3/12 , F21V29/505 , F21V29/767 , F21V29/773 , F21Y2115/10
摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The diffuser dome can disperse the light passing through it into the desired emission pattern, such as omnidirection. In one embodiment, the light source can be blue emitting LED and the phosphor carrier can include a yellow phosphor, with the LED lamp or bulb emitting a white light combination of LED and phosphor light.
摘要翻译：公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。荧光体载体包括导热透明材料并且热耦合到散热器结构。基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。扩散器圆顶可以将通过它的光分散成所需的发射图案，例如全方向。在一个实施例中，光源可以是蓝色LED，并且荧光体载体可以包括黄色磷光体，LED灯或灯泡发出LED和磷光体的白光组合。

3. 发明授权

US08835952B2 Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants 有权
标题翻译：用于半导体发光器件的底座和形成包括分配的密封剂的封装发光器件的方法
公开(公告)号：US08835952B2
公开(公告)日：2014-09-16
申请号：US13149197
申请日：2011-05-31
申请人： Peter S. Andrews , Ban P. Loh , Nicholas W. Medendorp, Jr. , Bernd P. Keller
发明人： Peter S. Andrews , Ban P. Loh , Nicholas W. Medendorp, Jr. , Bernd P. Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L33/486 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/10253 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
摘要翻译：用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。第一和第二弯液面控制特征可以与管芯附接垫基本共面。封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂。还公开了方法实施例。

4. 发明授权

US08500305B2 Active thermal management systems for enclosed lighting and modular lighting systems incorporating the same 有权
标题翻译：用于封闭式照明的主动式热管理系统和包含该系统的模块化照明系统
公开(公告)号：US08500305B2
公开(公告)日：2013-08-06
申请号：US12245458
申请日：2008-10-03
申请人： Timothy J. O'Sullivan , Nicholas W. Medendorp, Jr. , Paul Kenneth Pickard
发明人： Timothy J. O'Sullivan , Nicholas W. Medendorp, Jr. , Paul Kenneth Pickard
IPC分类号： F21V29/00 , F21V33/00
CPC分类号： G05D23/19 , F21V23/0442 , F21V29/67 , F21Y2115/10
摘要： A thermal management apparatus includes a lighting assembly and a cooling module that is removably coupled to the lighting assembly. A recessed downlight fixture includes a housing having an open end, an electrical power access port, a cooling module in the housing that is removably coupled to the electrical power access port, and a light source in the housing that is removably coupled to the electrical power access port. The light source is operable to project light through the open end of the housing. A cooling device is provided that includes a male Edison or GU24 port interface and a female Edison or GU 24 port interface.
摘要翻译：热管理装置包括照明组件和可拆卸地联接到照明组件的冷却模块。嵌入式筒灯具包括具有开口端的壳体，电力接入端口，壳体中可拆卸地耦合到电力接入端口的冷却模块，以及壳体中可拆卸地耦合到电力的光源访问端口光源可操作以将光投射穿过壳体的开口端。提供一种冷却装置，其包括男性爱迪生或GU24端口接口以及女性爱迪生或GU24端口接口。

5. 发明申请

US20130100658A1 SOLID STATE LIGHTING DEVICE 有权
标题翻译：固态照明设备
公开(公告)号：US20130100658A1
公开(公告)日：2013-04-25
申请号：US13276681
申请日：2011-10-19
申请人： PAUL KENNETH PICKARD , NICHOLAS W. MEDENDORP, JR. , MICHAEL JAMES HARRIS , JAMES MICHAEL LAY
发明人： PAUL KENNETH PICKARD , NICHOLAS W. MEDENDORP, JR. , MICHAEL JAMES HARRIS , JAMES MICHAEL LAY
IPC分类号： F21V9/00 , F21V7/00 , F21V29/00 , F21V21/00
CPC分类号： F21V29/70 , F21K9/238 , F21K9/60 , F21S8/02 , F21V7/22 , F21V23/003 , F21V23/006 , F21V29/74 , F21V29/85 , F21Y2115/10
摘要： A lighting device is disclosed comprising a plurality of light emitters and a heat spreader plate thermally coupled to the plurality of light emitters, wherein the plurality of solid state emitters provides a thermal load upon application of an operating current and voltage, the heat spreader plate dissipating substantially all of the thermal load to an ambient air environment.
摘要翻译：公开了一种照明装置，其包括热耦合到多个发光体的多个发光器和散热板，其中多个固态发射器在施加工作电流和电压时提供热负载，散热板散热基本上所有的热负荷都到环境空气环境。

6. 发明授权

US08408739B2 LED lighting fixture 有权
标题翻译： LED照明灯具
公开(公告)号：US08408739B2
公开(公告)日：2013-04-02
申请号：US12848884
申请日：2010-08-02
申请人： Russell George Villard , Yuming Chen , Lawrence Maurice Roberts, Jr. , Nicholas W. Medendorp, Jr.
发明人： Russell George Villard , Yuming Chen , Lawrence Maurice Roberts, Jr. , Nicholas W. Medendorp, Jr.
IPC分类号： F21S4/00
CPC分类号： F21V14/02 , F21S4/20 , F21S8/08 , F21V19/02 , F21W2131/103 , F21Y2105/10 , F21Y2115/10
摘要： A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.
摘要翻译：用于实现所需照明图案的发光二极管（LED）照明器具包括面板和附接到面板表面的一个或多个LED。一个或多个LED可以以一定角度安装在表面上。

7. 发明申请

US20120327664A1 Retroreflective, Multi-Element Design for a Solid State Directional Lamp 有权
标题翻译：固态定向灯的回射，多元素设计
公开(公告)号：US20120327664A1
公开(公告)日：2012-12-27
申请号：US13167351
申请日：2011-06-23
申请人： Paul Pickard , Nicholas W. Medendorp, JR.
发明人： Paul Pickard , Nicholas W. Medendorp, JR.
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21K9/233 , F21V7/0008 , F21V29/504 , F21V29/505 , F21V29/507 , F21V29/51 , F21V29/83
摘要： A solid state directional lamp is disclosed. The lamp includes a housing and a solid state light emitter. The housing defines an interior region and an air passageway, the air passageway passing through the housing and the interior region. The solid state light emitter is positioned adjacent to a perimeter of the air passageway. The air passageway is configured to provide cooling to the lamp when the sold state light emitter is energized.
摘要翻译：公开了一种固态定向灯。该灯包括外壳和固态光发射器。壳体限定内部区域和空气通道，空气通道穿过壳体和内部区域。固态光发射器邻近空气通道的周边定位。空气通道被配置为当销售状态光发射器通电时向灯提供冷却。

8. 发明授权

US08193547B2 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权
标题翻译：用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法
公开(公告)号：US08193547B2
公开(公告)日：2012-06-05
申请号：US13153930
申请日：2011-06-06
申请人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp, Jr.
发明人： Ban P. Loh , Bernd Keller , Nicholas W. Medendorp, Jr.
IPC分类号： H01L23/495 , H01L33/62
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。引线框还可以包括远离中心区延伸的电引线。电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。第二厚度可以小于第一厚度。所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。还公开了形成模块化封装和引线框架的方法。

9. 发明申请

US20120012879A1 LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES AND METHODS OF FORMING LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES 有权
标题翻译：用于固态发光装置的基于LEADFRAME的封装以及形成用于固态发光装置的基于引线框架的封装的方法
公开(公告)号：US20120012879A1
公开(公告)日：2012-01-19
申请号：US13242103
申请日：2011-09-23
申请人： Ban P. Loh , Nicholas W. Medendorp, JR. , Eric Tarsa , Bernd Keller
发明人： Ban P. Loh , Nicholas W. Medendorp, JR. , Eric Tarsa , Bernd Keller
IPC分类号： H01L33/60 , H01L21/56 , H01L23/495
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域。引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。热固性封装体可以在第二区域的顶表面和底表面上。泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

10. 发明申请

US20110305001A1 LED Lighting Systems Including Luminescent Layers On Remote Reflectors 有权
标题翻译：包括发光层在内的LED照明系统在远程反射器上
公开(公告)号：US20110305001A1
公开(公告)日：2011-12-15
申请号：US13216434
申请日：2011-08-24
申请人： Nicholas W. Medendorp, JR.
发明人： Nicholas W. Medendorp, JR.
IPC分类号： F21V9/16
CPC分类号： F21V7/0008 , F21S8/086 , F21V7/22 , F21V9/30 , F21W2131/103 , F21Y2115/10
摘要： A lighting system may include a substrate and a light emitting device (LED) on the substrate, and the light emitting device may be configured to transmit light having a first wavelength along a path away from the substrate. A remote reflector may be spaced apart from the light emitting device, and the light emitting device may be between the substrate and the remote reflector. The remote reflector may also be in the path of the light having the first wavelength transmitted by light emitting device. A luminescent layer may be on a surface of the remote reflector, and the luminescent layer may be configured to convert a portion of the light having the first wavelength to light having a second wavelength different than the first wavelength. Moreover, the remote reflector may be configured to reflect light having the first and second wavelengths.
摘要翻译：照明系统可以在衬底上包括衬底和发光器件（LED），并且发光器件可以被配置为透射远离衬底的路径具有第一波长的光。远程反射器可以与发光器件间隔开，并且发光器件可以在衬底和远程反射器之间。远程反射器也可以在具有由发光器件传输的第一波长的光的路径中。发光层可以在远端反射体的表面上，并且发光层可以被配置为将具有第一波长的光的一部分转换成具有不同于第一波长的第二波长的光。此外，远程反射器可以被配置为反射具有第一和第二波长的光。

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