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61. 发明申请

US20130269984A1 SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD 有权
标题翻译：焊接装置，焊接方法以及由焊接装置产生的基板和电子部件或焊接方法
公开(公告)号：US20130269984A1
公开(公告)日：2013-10-17
申请号：US13819555
申请日：2012-04-14
申请人： Katsumori Taniguro
发明人： Katsumori Taniguro
IPC分类号： B23K3/06 , H05K1/02
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/20 , B23K1/206 , B23K3/0692 , H01L2924/14 , H05K1/0296 , H01L2924/00
摘要： Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.
摘要翻译：提供了一种能够以低成本，高产率和高可靠性进行焊接的焊接装置和焊接方法。焊接装置具有：将具有铜电极的工件10浸渍在含有有机脂肪酸的溶液31a中的第一含有机脂肪酸的溶液浴21; 具有含有机脂肪酸溶液31b的蒸汽气氛的空间部分24，空间部分水平地具有喷射单元33，以将熔融焊料的喷射流喷射到设置在工件10上的铜电极和喷射单元34上以喷射液体超过熔融焊料去除; 和第二有机脂肪酸溶液槽23，其中在空间部分24中除去过量的熔融焊料的工件10再次浸渍在含有机脂肪酸的溶液31c中。

62. 发明授权

US08448838B2 Solder ball loading mask, apparatus and associated methodology 有权
标题翻译：焊球加载掩模，仪器和相关方法
公开(公告)号：US08448838B2
公开(公告)日：2013-05-28
申请号：US13315972
申请日：2011-12-09
申请人： Shigeki Sawa , Katsuhiko Tanno , Osamu Kimura , Koji Kuribayashi
发明人： Shigeki Sawa , Katsuhiko Tanno , Osamu Kimura , Koji Kuribayashi
IPC分类号： B23K1/00 , B23K1/20
CPC分类号： H05K3/3478 , B23K3/0623 , B23K3/0692 , B23K2101/36 , H05K3/3489 , H05K2203/041 , H05K2203/0485 , H05K2203/0557
摘要： A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.
摘要翻译：能够将焊球牢固地装载在连接焊盘上的焊球加载方法包括在印刷电路板的每个连接焊盘组上施加焊剂，焊剂不会施加到间隔件和印刷电路板之间的接触部分，以保持焊剂附着到间隔物。由于焊剂没有附着到间隔物上，当掩模与印刷电路板分离时，印刷电路板不需要颠倒，并且使阻焊层70的损坏最小化。此外，通过使用间隔件使焊球的高度和掩模的上表面相等，使得可以将焊球牢固地加载在电极焊盘上，每个连接焊盘用一个焊球，并且降低概率该焊球没有被加载，或者多个焊球被加载到单个连接焊盘上。

63. 发明申请

US20030097941A1 Method and apparatus for dispensing material in a printer 有权
公开(公告)号：US20030097941A1
公开(公告)日：2003-05-29
申请号：US10254348
申请日：2002-09-24
发明人： Mark Rossmeisl , Gary T. Freeman
IPC分类号： B41L013/18 , B05C017/04
CPC分类号： B23K3/0607 , B23K3/0692 , B23K2101/36 , H05K3/1233 , H05K3/3484 , H05K2203/0126 , H05K2203/0783 , H05K2203/1105
摘要： A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system to maintain the temperature of the viscous material contained in the chamber. The material dispenser also includes a closed-loop pressure control system to provide in-process control of the pressure of the chamber which permits uniform application of the viscous material to the substrate.

64. 发明授权

US6162661A Spacer plate solder ball placement fixture and methods therefor 失效
标题翻译：隔板焊球放置夹具及其方法
公开(公告)号：US6162661A
公开(公告)日：2000-12-19
申请号：US86808
申请日：1998-05-29
申请人： Joseph Link
发明人： Joseph Link
IPC分类号： B23K3/06 , H01L21/48 , H01L21/60 , H05K3/34 , H01L21/44 , H01L21/50
CPC分类号： H05K3/3478 , B23K3/0692 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/11334 , H01L2224/13099 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/12033 , H05K2201/2036 , H05K2203/041 , H05K2203/0557 , Y10T29/41 , H01L2924/00
摘要： A method placing conductive elements, such as solder balls, over terminals on a microelectronic assembly includes providing a microelectronic element having a first surface and one or more terminals accessible at the first surface, and securing a spacer plate having a top surface, a bottom surface and at least one opening extending therethrough over the first surface of the microelectronic element so that the at least one opening is in substantial alignment with the terminals. After the spacer plate has been secured over the first surface of the microelectronic element, a stencil for placing conductive elements is then secured over the spacer plate. The stencil has a top surface and a bottom surface and a plurality of openings extending therethrough. When the stencil is secured over the spacer plate, the plurality of openings in the stencil are in substantial alignment with the terminals. As a result, the spacer plate maintains the stencil remote from the terminals. The conductive elements, such as solder balls, are then deposited through the plurality of openings in the stencil so that each deposited conductive element is affixed atop one of the terminals of the microelectronic assembly.
摘要翻译：将诸如焊球的导电元件（例如焊球）放置在微电子组件上的方法包括提供具有第一表面的微电子元件和在第一表面可访问的一个或多个端子，以及固定具有顶表面的间隔板，底表面以及在微电子元件的第一表面上延伸穿过其中的至少一个开口，使得至少一个开口与端子基本上对准。在隔离板已经固定在微电子元件的第一表面上之后，用于放置导电元件的模板然后被固定在隔离板上。模板具有顶表面和底表面以及延伸穿过其中的多个开口。当模板固定在间隔板上时，模板中的多个开口与端子基本对准。结果，间隔板将模板保持远离端子。导电元件，例如焊球，然后通过模板中的多个开口沉积，使得每个沉积的导电元件固定在微电子组件的一个端子上。

65. 发明授权

US5662262A Tape withh solder forms and methods for transferring solder forms to chip assemblies 失效
标题翻译：带有焊料形式的胶带和将焊料形式转移到芯片组件的方法
公开(公告)号：US5662262A
公开(公告)日：1997-09-02
申请号：US412292
申请日：1995-03-28
申请人： John Francis McMahon , George Chiu
发明人： John Francis McMahon , George Chiu
IPC分类号： B23K3/06 , B23K35/02 , H01L21/48 , H01L21/60 , H01L21/68 , H05K3/30 , H05K3/34 , B23K35/00
CPC分类号： H01L24/16 , B23K3/0623 , B23K3/0692 , B23K35/0222 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/81 , H05K3/3436 , H05K3/3478 , B23K2201/36 , B23K2201/40 , H01L2224/11003 , H01L2224/11013 , H01L2224/11334 , H01L2224/13099 , H01L2224/27438 , H01L2224/48091 , H01L2224/48227 , H01L2224/81101 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H05K2201/10378 , H05K2201/10424 , H05K2201/10977 , H05K2203/0113 , H05K2203/0156 , H05K2203/0338 , H05K2203/041 , H05K3/303 , Y02P70/613
摘要： A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a "bed of nails". In addition, the solder forms maybe shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.
摘要翻译：公开了一卷带有焊料形式的胶带以及用于仅将焊料形成或将两种焊料形式和带的部分两者转移到电子部件的方法。电子元件可以是集成电路芯片，芯片封装和印刷电路板中的任何一种。将焊料形式转移到电子部件是一个两步的过程：（a）焊料形式定位并离线放置在一卷胶带上，（b）胶带上的焊料形式被转移到电子部件中一条装配线。焊料形式可能暂时或永久性地附着在磁带上。首先，仅传送焊料形式。在后一种情况下，带部分被转移到具有焊料形式的电子部件。焊料形式可以使用UV敏感粘合剂或冷粘合剂（例如助焊剂）附接到带的一侧或带中的通孔中。可以通过将焊料形式压在电子部件上，将UV敏感粘合剂暴露于UV光或使用“指甲床”来消除焊料形式。此外，焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。胶带是导热和耐热的，并且可以具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。

66. 发明授权

US5545465A Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits 失效
标题翻译：具有限定体积的焊料或导电粘合剂的电路板沉积在用于电路的互连位置处
公开(公告)号：US5545465A
公开(公告)日：1996-08-13
申请号：US449029
申请日：1995-05-24
申请人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
发明人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
IPC分类号： B05C5/02 , B23K3/06 , H01L21/48 , H01L21/60 , H05K3/12 , H05K3/32 , H05K3/34 , B32B9/00
CPC分类号： H01L24/27 , B23K3/0692 , H01L21/4853 , H01L21/4867 , H01L24/83 , H05K3/1233 , H05K3/3484 , B23K2201/36 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3025 , H05K2201/0989 , H05K2203/0126 , H05K2203/043 , H05K2203/0568 , H05K2203/0577 , H05K3/321 , H05K3/3452 , Y10T29/49165 , Y10T428/24917
摘要： A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.
摘要翻译：在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。导电垫对应于芯片附接位置。使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。然后将注射头从掩模的表面去除。如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

67. 发明授权

US5287806A Apparatus and system for screen printing of solder paste onto printed circuit boards 失效
标题翻译：焊膏丝网印刷到印刷电路板上的装置和系统
公开(公告)号：US5287806A
公开(公告)日：1994-02-22
申请号：US902963
申请日：1992-06-23
申请人： Takashi Nanzai
发明人： Takashi Nanzai
IPC分类号： B41F15/08 , B23K3/06 , B23K3/08 , B41F15/40 , H05K3/12 , H05K3/26 , H05K3/34 , B41L13/18
CPC分类号： H05K3/1233 , B23K3/06 , B23K3/0692 , B23K3/08 , H05K2203/0126 , H05K2203/0783 , H05K2203/082 , H05K3/26 , H05K3/3484
摘要： A screen printing apparatus for printing solder paste onto a surface of a printed circuit board through the medium of a screen having openings. The apparatus includes a solder paste automatic supply dispenser of a nonflexible box-like structure which is arranged to be displased along a pair of guide rails back and forth and to be raised and lowered relative to the guide rails. The dispenser has a chamber for containing solder paste to be printed on the surface of the circuit board and an adjusting device attached to the dispenser for adjusting the temperature of the solder paste contained in the chamber so as to be capable of maintaining the temperature at a predetermined degree. The chamber is provided, at a bottom potion thereof, with a slit-like aperture extending normal to the direction of travel of the dispenser and arranged to be normally closed and to be kept open to automatically supply a predetemined amount of the solder paste contained in the chamber onto an upper surface of the screen during printing. The aperture is provided, at its rear edge portion, with a squeegee blade extending along the entire length of the aperture and being adapted to be kept in contact with the upper surface of the screen at its lower end during printing.
摘要翻译：一种丝网印刷装置，用于通过具有开口的筛网的介质将焊膏印刷到印刷电路板的表面上。该装置包括：非柔性盒状结构的焊膏自动供给分配器，其布置成沿着一对导轨前后移动并相对于导轨升高和降低。分配器具有用于容纳要印刷在电路板表面上的焊膏的室，以及附着在分配器上的调节装置，用于调节容纳在室中的焊膏的温度，从而能够将温度维持在预定程度。在其底部部分处设有狭缝状孔，其垂直于分配器的行进方向延伸，并且布置成通常关闭并保持打开以自动提供预定量的包含在其中的焊膏在打印期间将该腔室放置在屏幕的上表面上。该孔在其后边缘部分处设置有沿着孔的整个长度延伸的刮刀，并且适于在打印期间在其下端保持与屏幕的上表面接触。

68. 发明授权

US5222650A Solder leveller 失效
标题翻译：焊锡机
公开(公告)号：US5222650A
公开(公告)日：1993-06-29
申请号：US854657
申请日：1992-04-30
申请人： Peter P. A. Lymn
发明人： Peter P. A. Lymn
IPC分类号： B23K1/08 , B23K3/06 , B23K101/42 , H05K3/24 , H05K3/34
CPC分类号： B23K3/0692 , B23K3/0646 , H05K3/3468
摘要： A horizontal solder leveller for applying solder to a board comprises: means 15.sub.u,15.sub.1, 16.sub.u ; 16.sub.1 ; 17.sub.u,17.sub.1 including a solder bath 1 for applying molten solder 2 to a board. means 47 for levelling solder applied to the board, including nozzles for directing solder-levelling air jets at the board, and means 19.sub.u,19.sub.1,48 for creating a dispersion of oil in an air stream from the levelling means, the oil dispersion means being provided between the solder applying means and the levelling means.
摘要翻译： PCT No.PCT / GB90 / 01685 Sec。一九九二年四月三十日 102（e）日期1992年4月30日PCT 1990年11月2日PCT PCT。公开号WO91 / 06390 日期：1991年5月16日。用于将焊料施加到板的卧式焊锡矫直机包括：装置15u，151,16u; 161; 17u，171，其包括用于将熔融焊料2施加到板的焊料槽1。用于使焊接到板上的焊料平整的装置47，包括用于在焊盘上引导焊料平整空气喷嘴的喷嘴，以及用于在来自平整装置的空气流中产生油分散的装置19u，191,48，油分散装置设置在焊料施加装置和调平装置之间。

69. 发明授权

US5139822A Method for coating solder on selective areas of a metal strip 失效
标题翻译：在金属条的选择区域上涂覆焊料的方法
公开(公告)号：US5139822A
公开(公告)日：1992-08-18
申请号：US570255
申请日：1990-08-20
申请人： Don R. Hepler , Jacques J. Hilhorst
发明人： Don R. Hepler , Jacques J. Hilhorst
IPC分类号： B23K3/06
CPC分类号： B23K3/0692
摘要： A method for applying solder (S) to selective areas of a metal strip (24), wherein the strip (24) is passed between rollers (36, 38) driven through a source of molten solder (40, 42) to transfer a coating a solder (S) to the strip (24). The rollers include discontinuous surfaces (37, 39) suitably shaped to provide selective areas of solder coating (S) on the strip (24).
摘要翻译：一种将焊料（S）施加到金属条（24）的选择区域的方法，其中所述条带（24）在驱动通过熔融焊料源（40,42）的辊（36,38）之间通过以转移涂层焊料（S）到条带（24）。辊包括不连续表面（37,39），其适当地成形以在条带（24）上提供焊料涂层（S）的选择性区域。

70. 发明授权

US5057337A Method and apparatus for solder coating of leads 失效
标题翻译：焊接涂料的方法和装置
公开(公告)号：US5057337A
公开(公告)日：1991-10-15
申请号：US525219
申请日：1990-05-16
申请人： Shinichi Makino , Naokatsu Kojima
发明人： Shinichi Makino , Naokatsu Kojima
IPC分类号： B23K3/06 , H01L21/00 , H01R43/02
CPC分类号： H01L21/67144 , B23K3/0692 , H01R43/0235
摘要： A pair of solder coating rolls are disposed horizontally adjacent one another for rotation about parallel horizontal axes, and are spaced apart to define a narrow vertically-oriented nip therebetween for accommodating a lead frame therein. Lower parts of the rolls contact a solder bath, and counter rotation of the rolls carries the solder upwardly on the periphery of the rolls to create a small pool of solder at the upper end of the nip. The lead frame is driven vertically upwardly through the nip, which nip has a minimal dimension greater than the lead frame thickness. The lead frame is driven vertically upwardly at a linear speed which is different from, and preferably slower than, the peripheral speed fo the solder coating rolls. This enables preheating of the surface of the lead frame due to its longer exposure to and contact with the hot solder which coats the periphery of the rolls, thereby improving the wetability of the lead frame surface. At the same time, this upward movement of the lead frame through the nip and through the pool of liquid solder permits a solder coating of high quality and uniformity to be applied to the lead frame.

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