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71. 发明申请

WO2014058601A1 ADVANCED HANDLER WAFER DEBONDING METHOD 审中-公开
标题翻译：先进的手工抛光方法
公开(公告)号：WO2014058601A1
公开(公告)日：2014-04-17
申请号：PCT/US2013/060949
申请日：2013-09-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： ANDRY, Paul S. , BUDD, Russell A. , KNICKERBOCKER, John U. , TRZCINSKI, Robert E. , LA TULIPE, Jr., Douglas C.
IPC分类号： H01L21/30 , H01L21/46 , H01L33/40
CPC分类号： H01L23/49827 , H01L21/02 , H01L21/2007 , H01L21/6835 , H01L29/00 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： A method for processing a semiconductor wafer includes applying a release layer to a transparent handler (S11). An adhesive layer, that is distinct from the release layer, is applied between a semiconductor wafer and the transparent handler having the release layer applied thereon (S12). The semiconductor wafer is bonded to the transparent handler using the adhesive layer (S13). The semiconductor wafer is processed while it is bonded to the transparent handler (S14). The release layer is ablated by irradiating the release layer through the transparent handler with a laser (S16). The semiconductor wafer is removed from the transparent handler (S17).
摘要翻译：一种用于处理半导体晶片的方法包括将释放层应用于透明处理器（S11）。将不同于剥离层的粘合剂层施加在半导体晶片和其上施加有剥离层的透明处理器之间（S12）。使用粘合剂层将半导体晶片接合到透明处理器（S13）。半导体晶片在与透明处理器接合时被处理（S14）。通过用激光器通过透明处理器照射释放层来消除释放层（S16）。从透明处理器移除半导体晶片（S17）。

72. 发明申请

WO2013112691A2 LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS 审中-公开
标题翻译：发光波长转换材料及相关方法
公开(公告)号：WO2013112691A2
公开(公告)日：2013-08-01
申请号：PCT/US2013/022899
申请日：2013-01-24
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael, Albert
发明人： TISCHLER, Michael, Albert
IPC分类号： H01L25/075
CPC分类号： H01L33/501 , H01L21/00 , H01L24/96 , H01L24/97 , H01L25/00 , H01L25/0753 , H01L27/14 , H01L27/15 , H01L27/156 , H01L29/00 , H01L31/0203 , H01L31/022425 , H01L31/02322 , H01L31/02327 , H01L31/048 , H01L31/055 , H01L33/00 , H01L33/005 , H01L33/10 , H01L33/44 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/73259 , H01L2924/01005 , H01L2924/07802 , H01L2924/07811 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H05B33/02 , H05B33/12 , Y02E10/52 , H01L2924/00
摘要： In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
摘要翻译：根据某些实施例，半导体管芯被嵌入在聚合物粘合剂中以形成例如独立的白色发光管芯和/或包含嵌入单体积粘合剂中的多个发光模具的复合晶片。

73. 发明申请

WO2012092691A1 半导序体审中-公开
公开(公告)号：WO2012092691A1
公开(公告)日：2012-07-12
申请号：PCT/CN2011/000701
申请日：2011-04-21
申请人：刘文祥 , 刘智和
发明人：刘文祥 , 刘智和
IPC分类号： H01L29/861 , C30B15/00
CPC分类号： H01L29/861 , H01L29/00 , H01L29/808

74. 发明授权

EP3345209B1 METHOD OF ENCAPSULATING A SUBSTRATE 有权
公开(公告)号：EP3345209B1
公开(公告)日：2024-07-17
申请号：EP16842434.9
申请日：2016-08-31
IPC分类号： H01L23/31 , H01L21/8258
CPC分类号： H01L23/3185 , H01L29/00 , H01L21/8258

75. 发明授权

EP2195865B1 STRAHLUNGSEMITTIERENDES HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES STRAHLUNGSEMITTIERENDEN HALBLEITERBAUELEMENTS 失效
标题翻译：辐射发射半导体元件及制造辐射发射半导体元件的方法
公开(公告)号：EP2195865B1
公开(公告)日：2018-03-14
申请号：EP08801325.5
申请日：2008-09-12
申请人： OSRAM Opto Semiconductors GmbH
发明人： SORG, Jörg , GRUBER, Stefan
IPC分类号： H01L33/48 , H01L33/50 , H01L33/58
CPC分类号： H01L33/486 , H01L21/00 , H01L27/00 , H01L29/00 , H01L33/505 , H01L33/58 , H01L2924/0002 , H01L2924/00

76. 发明公开

EP3143651A4 CAPACITOR AND METHOD OF PRODUCTION THEREOF 有权
公开(公告)号：EP3143651A4
公开(公告)日：2017-12-13
申请号：EP15792405
申请日：2015-05-12
申请人： CAPACITOR SCIENCES INC
发明人： LAZAREV PAVEL IVAN
IPC分类号： H01G4/14 , H01L49/02
CPC分类号： H01G4/14 , H01G4/008 , H01L28/40 , H01L29/00
摘要： The present invention relates generally to the fields of electrical engineering and electronics. More specifically, the present invention relates to passive components of electrical circuit and more particularly to a capacitor intended for energy storage and method of production thereof.

77. 发明公开

EP2755314A4 SWITCH DRIVING CIRCUIT, INVERTER APPARATUS AND POWER STEERING APPARATUS 有权转让
标题翻译：开关驱动电路，逆变器和动力转向装置
公开(公告)号：EP2755314A4
公开(公告)日：2016-06-01
申请号：EP12830399
申请日：2012-08-10
申请人： TOSHIBA KK , NSK LTD
发明人： MAEKAWA SARI , FUKINUKI SHIGERU , KUMAGAI SHIN
IPC分类号： H02M7/48 , H02J7/00 , H02P27/06 , H02P29/024
CPC分类号： H01L29/00 , H02J7/0034 , H02M7/48 , H02M7/53871 , H02P27/06 , H02P29/027 , Y10T307/76
摘要： A switch driving circuit electrically opens and closes a switch circuit (5) including two N-channel type semiconductor switching elements (6a, 6b) series connected in opposite directions, thereby electrically opening and closing an electrical path between a DC power supply (4) and an inverter circuit (1). The switch driving circuit (38) has a reference potential point in common with the inverter circuit (1) and supplies an opening/closing control signal to the switch circuit (5). The switch driving circuit (38) includes a half bridge circuit including two semiconductor switching elements (10, 11) series connected between a driving power supply and the reference potential point. Two protection diodes (13, 14) are connected in parallel to the semiconductor switching elements (10, 11) respectively. At least one current blocking diode (39, 42, 43) is configured to block current from flowing from the reference potential point through the diode (39, 42, 43) to the switch circuit (5) side when the DC power supply (4) is connected to the inverter circuit (1) in reverse polarity.

78. 发明公开

EP2807673A2 LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS 审中-公开
标题翻译：发光具有集成的光波长转换材料及相关手续DIES
公开(公告)号：EP2807673A2
公开(公告)日：2014-12-03
申请号：EP13711756.0
申请日：2013-01-24
申请人： Cooledge Lighting, Inc.
发明人： TISCHLER, Michael, Albert
IPC分类号： H01L25/075
CPC分类号： H01L33/501 , H01L21/00 , H01L24/96 , H01L24/97 , H01L25/00 , H01L25/0753 , H01L27/14 , H01L27/15 , H01L27/156 , H01L29/00 , H01L31/0203 , H01L31/022425 , H01L31/02322 , H01L31/02327 , H01L31/048 , H01L31/055 , H01L33/00 , H01L33/005 , H01L33/10 , H01L33/44 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/73259 , H01L2924/01005 , H01L2924/07802 , H01L2924/07811 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H05B33/02 , H05B33/12 , Y02E10/52 , H01L2924/00
摘要： In accordance with certain embodiments, phosphor chips are formed and subsequently attached to light-emitting elements.
摘要翻译：在某些实施例雅舞蹈，磷芯片被形成并随后附接至发光元件。

79. 发明公开

EP2755314A1 SWITCH DRIVING CIRCUIT, INVERTER APPARATUS AND POWER STEERING APPARATUS 有权转让
标题翻译： SCHALTERTREIBERSCHALTUNG，WECHSELRICHTER UND SERVOLENKUNGSVORRICHTUNG
公开(公告)号：EP2755314A1
公开(公告)日：2014-07-16
申请号：EP12830399.7
申请日：2012-08-10
申请人： Kabushiki Kaisha Toshiba , NSK Ltd.
发明人： MAEKAWA, Sari , FUKINUKI, Shigeru , KUMAGAI, Shin
IPC分类号： H02M7/48
CPC分类号： H01L29/00 , H02J7/0034 , H02M7/48 , H02M7/53871 , H02P27/06 , H02P29/027 , Y10T307/76
摘要： A switch driving circuit electrically opens and closes a switch circuit (5) including two N-channel type semiconductor switching elements (6a, 6b) series connected in opposite directions, thereby electrically opening and closing an electrical path between a DC power supply (4) and an inverter circuit (1). The switch driving circuit (38) has a reference potential point in common with the inverter circuit (1) and supplies an opening/closing control signal to the switch circuit (5). The switch driving circuit (38) includes a half bridge circuit including two semiconductor switching elements (10, 11) series connected between a driving power supply and the reference potential point. Two protection diodes (13, 14) are connected in parallel to the semiconductor switching elements (10, 11) respectively. At least one current blocking diode (39, 42, 43) is configured to block current from flowing from the reference potential point through the diode (39, 42, 43) to the switch circuit (5) side when the DC power supply (4) is connected to the inverter circuit (1) in reverse polarity.
摘要翻译：开关驱动电路使开关电路（5）电开并闭合，所述开关电路（5）包括以相反方向连接的两个N沟道型半导体开关元件（6a，6b），从而电连接DC电源（4）和逆变器电路（1）。开关驱动电路（38）具有与逆变器电路（1）共同的基准电位点，并向开关电路（5）供给开闭控制信号。开关驱动电路（38）包括半桥电路，其包括串联连接在驱动电源和参考电位点之间的两个半导体开关元件（10,11）。两个保护二极管（13,14）分别与半导体开关元件（10,11）并联连接。至少一个电流阻塞二极管（39,42,43）被配置为当直流电源（4）（4）处于阻抗电流时，阻止电流从基准电位点流过二极管（39,42,43）到开关电路）以相反极性连接到逆变器电路（1）。

80. 发明公开

EP2195865A1 STRAHLUNGSEMITTIERENDES HALBLEITERBAUELEMENT, AUFNAHME FÜR EIN STRAHLUNGSEMITTIERENDES HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES STRAHLUNGSEMITTIERENDEN HALBLEITERBAUELEMENTS 失效
标题翻译：辐射半导体部件，记录辐射半导体部件和方法用于产生辐射半导体元器件
公开(公告)号：EP2195865A1
公开(公告)日：2010-06-16
申请号：EP08801325.5
申请日：2008-09-12
申请人： OSRAM Opto Semiconductors GmbH
发明人： SORG, Jörg , GRUBER, Stefan
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L21/00 , H01L27/00 , H01L29/00 , H01L33/505 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a semiconductor-based component having radiation-emitting properties. A glass substrate (1) is provided comprising a first surface (2) and a second surface (1), wherein a semiconductor element (5) having radiation-emitting properties is accommodated on the first surface (2). The invention further relates to a method for producing a semiconductor-based component having the following steps: - providing a glass substrate (1), - applying a semiconductor element (5) to the first surface (2) of the glass substrate. The invention further relates to a receptacle for a semiconductor-based component in which two electrical contact surfaces (13) are provided that may be connected in an electrically conductive manner to contact surfaces (7) of the semiconductor-based component.
摘要翻译：基于半导体的组分与发射辐射的性质。（1）提供了一种玻璃基板，其具有第一表面（2）和第二表面（1），其中，（5）与发射辐射的特性的半导体元件容纳在所述第一表面（2）上。所以圆盘游离缺失是一种用于制造基于半导体组件，具有以下步骤的方法：提供一个玻璃基板（1），应用程序中的半导体元件（5）的所述第一表面（2）的玻璃基板。所以圆盘游离缺失是用于基于其中半导体元件设置有两个电气接触区域（13），其可电连接到接触容器的区域（7），基于半导体的组分。

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