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    • 5. 发明授权
    • Bonding method
    • 粘合方法
    • US5040293A
    • 1991-08-20
    • US523398
    • 1990-05-14
    • Nobuto YamazakiAkihiro Nishimura
    • Nobuto YamazakiAkihiro Nishimura
    • H01L21/60H01L21/00
    • H01L21/67138Y10T29/49121Y10T29/49131Y10T29/49149
    • A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting a combination of one inner lead and one electrode which are positionally shifted relative to each other; correcting relative position of the inner lead and electrode which are positionally shifted so that the inner lead and electrode are aligned; the inner lead and electrode are bonded; relative positions of remaining inner leads and elctrodes are aligned; and the inner leads and elctrodes are individually connected by bonding.
    • 通过以下步骤进行将膜上的内引线与半导体元件的电极接合的接合方法:将膜和半导体元件分别定位在预定的接合位置; 分别识别内部引线和电极的位置; 选择相对于彼此位置偏移的一个内引线和一个电极的组合; 校正位置偏移的内部引线和电极的相对位置,使得内部引线和电极对齐; 内引线和电极接合; 剩余内引线和电极的相对位置对齐; 并且内引线和电极通过接合单独连接。
    • 7. 发明授权
    • Inner lead bonder
    • 内部引线键合机
    • US4526646A
    • 1985-07-02
    • US558207
    • 1983-12-05
    • Yasunobu SuzukiSeiichi ChibaAkihiro Nishimura
    • Yasunobu SuzukiSeiichi ChibaAkihiro Nishimura
    • H01L21/60H01L21/00B65G25/00B23P19/00B32B31/00B44C1/00
    • H01L21/67138Y10T156/171Y10T156/1771Y10T29/53178
    • An inner lead bonder for bonding dies to leads of carrier tape with improved positional accuracy and improved work efficiency. In the inner lead bonder, dies are fed to a die positioning spot one at a time and positioned. Then, said positioned die is carried to a bonding position. On the other hand, leads of a carrier tape are fed to the bonding position and positioned at the spot above the aforesaid die. Thereafter, the leads of the carrier tape are pressed onto the die and bonded by using a bonding tool. This inner lead bonder is characterized in that it includes a rotary table with the size covering the die positioning point and the bonding position, and after positioning the die on the rotary table, the rotary table is rotated in order to bring the die positioned as mentioned above to the bonding position to place the die at a proper position for bonding.
    • 一种用于将模具接合到载带的引线的内引线接合器,具有改进的位置精度和提高的工作效率。 在内引线焊接机中,将模具一次一个地送入模具定位点并定位。 然后,将所述定位的模具运送到结合位置。 另一方面,载带的引线被馈送到接合位置并且位于上述模具上方的位置处。 此后,将载带的引线按压到模具上并通过使用接合工具粘接。 该内引线接合机的特征在于,其包括具有覆盖芯片定位点和接合位置的尺寸的旋转台,并且在将模具定位在旋转台上之后,旋转台旋转以使模具定位成如上所述 上方到结合位置以将模具放置在用于结合的适当位置。
    • 8. 发明授权
    • Continuous glass filaments manufacturing equipment
    • 连续玻璃丝制造设备
    • US08720232B2
    • 2014-05-13
    • US10333732
    • 2002-05-23
    • Akihiro Nishimura
    • Akihiro Nishimura
    • C03B37/02
    • C03B37/0209Y02P40/57
    • An apparatus is provided for producing continuous glass filaments by spinning molten glass through nozzles of a bushing and cooling the thus-spun filaments with fins joined to one or more cooled manifolds and arranged in a proximity of the nozzles. Each manifold is provided at at least three locations thereof with at least one inlet port and at least one outlet port for coolant, respectively, with a proviso that the total number of the inlet and outlet ports is the same as the number of the locations of the manifold. Without using a complex construction, this invention makes it possible to provide the fins with improved durability and to produce the glass filaments with improved quality. In particular, the present invention can be applied to large bushings each of which is equipped with a number of nozzles.
    • 提供了一种用于通过将衬套的喷嘴旋转熔融玻璃并将如此纺丝的长丝与连接到一个或多个冷却歧管并布置在喷嘴附近并布置的翅片进行冷却来生产连续玻璃丝的装置。 每个歧管在其至少三个位置处分别设置有至少一个入口端口和至少一个用于冷却剂的出口端口,条件是入口端口和出口端口的总数量与 歧管。 本发明不需要使用复杂的结构,可以提供具有改善的耐久性的翅片,并且可以提高品质的玻璃丝。 特别地,本发明可以应用于各自配备有多个喷嘴的大型衬套。