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    • 9. 发明授权
    • Nanoporous dielectric thin film surface modification
    • 纳米介电薄膜表面改性
    • US6063714A
    • 2000-05-16
    • US749186
    • 1996-11-14
    • Douglas M. SmithGregory P. JohnstonWilliam C. AckermanShin-Puu Jeng
    • Douglas M. SmithGregory P. JohnstonWilliam C. AckermanShin-Puu Jeng
    • H01L21/314H01L21/316H01L21/768H01L21/00B05D3/04
    • H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02337H01L21/02343H01L21/31695H01L21/76801
    • This pertains generally to precursors and deposition methods suited to aerogel thin film fabrication of nanoporous dielectrics. A method of forming a nanoporous dielectric on a semiconductor substrate is disclosed. By a method according to the present invention, a precursor sol is applied as a nongelling thin film 14 to a semiconductor substrate 10. This substrate may contain patterned conductors 12, gaps 13, and/or other structures. A portion of the solvent is evaporated from the thin film 14 to produce a reduced thickness film 18. Film 18 is gelled and may be aged. A surface modification agent is introduced to the reaction atmosphere in a vaporish form, e.g., a vapor, mist, aerosol, or similar form. The surface modifier can then diffuse into, condense onto, and/or settle onto the wet gel and then diffuse throughout the thin film. This vaporish introduction of the surface modification agent ensures that there are no strong fluid flows across the wafer that might damage the wet gel. It can also be compatible with standard processing equipment and can potentially be used with other reaction atmosphere controls that reduce premature drying of the gel.
    • 这通常涉及适用于纳米多孔电介质的气凝胶薄膜制造的前体和沉积方法。 公开了一种在半导体衬底上形成纳米多孔电介质的方法。 通过根据本发明的方法,将前体溶胶作为不合格薄膜14施加到半导体衬底10.该衬底可以包含图案化导体12,间隙13和/或其它结构。 溶剂的一部分从薄膜14蒸发以产生厚度减薄的薄膜18.薄膜18胶凝并且可以老化。 将表面改性剂以蒸气形式,例如蒸汽,雾,气溶胶或类似形式引入反应气氛中。 然后,表面改性剂可以扩散进入,冷凝到和/或沉降到湿凝胶上,然后在整个薄膜中扩散。 表面改性剂的蒸发引入确保了晶片上没有强大的流体流动,这可能会损坏湿凝胶。 它也可以与标准的加工设备兼容,并且可以与其他反应气氛控制器一起使用,以减少凝胶的过早干燥。