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1. 发明授权

US08929074B2 Electronic device assemblies and vehicles employing dual phase change materials 有权
标题翻译：使用双相变材料的电子设备组件和车辆
公开(公告)号：US08929074B2
公开(公告)日：2015-01-06
申请号：US13561229
申请日：2012-07-30
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H02K7/006 , H02K9/005 , H02K9/19 , H02K9/20 , H02K2209/00 , H05K7/20345 , H05K7/20936 , H01L2924/00
摘要： Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.
摘要翻译：公开了使用双相变材料的电子装置组件和结合其的车辆。在一个实施例中，电子设备组件包括具有表面的半导体器件，其中半导体器件在瞬态热通量状态和正常热通量状态下工作，热耦合到半导体器件的表面的冷却剂流体，改变材料热耦合到半导体器件的表面。相变材料具有相变材料从第一相变为第二相的相变温度。至少当半导体器件在瞬态热通量状态下工作时，相变材料吸收热通量。

2. 发明授权

US08842435B2 Two-phase heat transfer assemblies and power electronics incorporating the same 有权
标题翻译：两相传热组件和并入其中的电力电子装置
公开(公告)号：US08842435B2
公开(公告)日：2014-09-23
申请号：US13471699
申请日：2012-05-15
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20 , F28D15/00 , H01B9/06
CPC分类号： H05K7/209 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.
摘要翻译：两相传热组件包括具有冲击表面的冷板，联接到冷板的发热装置阵列和一组喷嘴。冲击表面具有中心亲水区域的阵列。每个单独的中心亲水区被疏水周边包围。冲击表面的润湿性在每个疏水性周边处逐渐从亲水性逐渐发展到疏水性。发热装置的阵列耦合到冷板的加热表面，使得中心亲水区域的阵列与发热装置阵列对准。喷嘴阵列被配置成将冷却剂液滴引向冲击表面。冷板的冲击表面的润湿性能导致冷却剂液滴从每个疏水性周边向内朝各个中心亲水区域移动。

3. 发明授权

US08305755B2 Power modules, cooling devices and methods thereof 有权
标题翻译：电源模块，冷却装置及其方法
公开(公告)号：US08305755B2
公开(公告)日：2012-11-06
申请号：US12717595
申请日：2010-03-04
申请人： Ercan Mehmet Dede
发明人： Ercan Mehmet Dede
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： F28F7/00 , H05K7/20
摘要： A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be coupled to a heat generating device and a jet impingement target surface. The jet impingement target surface may further include at least one target structure having a wavy-fin topology with a fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device.
摘要翻译：喷射冲击冷却装置可以包括喷射结构和目标层。射流结构可以包括至少一个可操作以产生冷却流体的冲击射流的流体射流。目标层还可以包括被配置为耦合到发热装置和喷射冲击目标表面的受热表面。喷射冲击目标表面可以进一步包括至少一个目标结构，其具有带翅片峰值的波浪翅片拓扑结构，其中流体射流和目标结构被布置成使得目标结构的鳍峰与中心线对准在喷射冲击冷却装置运行期间的冷却流体的冲击射流。

4. 发明申请

US20120267077A1 COOLING APPARATUSES AND POWER ELECTRONICS MODULES COMPRISING THE SAME 审中-公开
标题翻译：冷却装置和包含该装置的电力电子模块
公开(公告)号：US20120267077A1
公开(公告)日：2012-10-25
申请号：US13091393
申请日：2011-04-21
申请人： Ercan Mehmet Dede
发明人： Ercan Mehmet Dede
IPC分类号： F28D15/00
CPC分类号： F28D15/0233 , F28D15/0266 , F28F13/187 , H01L23/427 , H01L23/4735 , H01L2924/0002 , H05K7/20936 , H01L2924/00
摘要： Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.
摘要翻译：公开了具有冷却装置的冷却装置和电力电子模块。在一个实施例中，冷却装置包括具有形成在热输出表面中的热输出表面和周期性分形图案的传热板。周期性分形模式增加了热输出表面的表面积，并提供了蒸气泡成核位点。外壳包围传热板，并在外壳和传热板之间形成流体室。流体源流体耦合到流体室，并向流体室提供冷却流体。当传热板热耦合到热源时，热源加热转移板，其使流体室中的冷却流体蒸发，从而消散热源的热量。

5. 发明申请

US20120170222A1 COLD PLATE ASSEMBLIES AND POWER ELECTRONICS MODULES 有权
标题翻译：冷板组件和电力电子模块
公开(公告)号：US20120170222A1
公开(公告)日：2012-07-05
申请号：US12984905
申请日：2011-01-05
申请人： Ercan Mehmet Dede , Yan Liu
发明人： Ercan Mehmet Dede , Yan Liu
IPC分类号： H05K7/20 , F28F9/02
CPC分类号： F28F3/083 , F28F9/0221 , H01L2924/0002 , H05K7/20254 , H01L2924/00
摘要： A cold plate assembly includes an inlet manifold layer, a target heat transfer layer, a second-pass heat transfer layer, and an outlet manifold layer. The inlet manifold layer includes a coolant fluid outlet and an inlet channel. The inlet channel includes a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles. The target heat transfer layer includes a plurality of target heat transfer cells having a plurality of target heat transfer layer microchannels extending in a radial direction from a central impingement region. The second-pass heat transfer layer includes a plurality of second-pass heat transfer cells having a plurality of second-pass heat transfer layer microchannels extending in a radial direction toward a central fluid outlet region, and one or more transition channels. The impingement jet nozzles are positioned through the central fluid outlet region. The outlet manifold layer includes an outlet channel having a plurality of fluid outlet holes.
摘要翻译：冷板组件包括入口歧管层，靶传热层，二次传热层和出口歧管层。入口歧管层包括冷却剂流体出口和入口通道。入口通道包括流体地联接到多个冲击喷嘴的多个流体入口孔。目标传热层包括多个目标传热单元，其具有从中心冲击区域沿径向延伸的多个目标传热层微通道。第二通道传热层包括多个第二通道传热单元，其具有沿径向向中心流体出口区域延伸的多个第二通过传热层微通道，以及一个或多个过渡通道。冲击喷嘴位于中心流体出口区域。出口歧管层包括具有多个流体出口孔的出口通道。

6. 发明授权

US08203839B2 Cooling devices, power modules, and vehicles incorporating the same 有权
标题翻译：冷却装置，电源模块和并入其的车辆
公开(公告)号：US08203839B2
公开(公告)日：2012-06-19
申请号：US12721174
申请日：2010-03-10
申请人： Ercan Mehmet Dede
发明人： Ercan Mehmet Dede
IPC分类号： H05K7/20
CPC分类号： F28F7/02 , F28D2021/0029 , F28F9/02 , F28F21/06 , F28F2255/14 , H05K7/2089
摘要： A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.
摘要翻译：冷却装置可以包括由模制的聚合物复合材料形成的流体入口歧管，壳体和流体出口歧管。流体入口歧管可以包括流体入口通道和流体入口容器。壳体可以包括从壳体的第一表面延伸到壳体的第二表面的多个冷却通道。冷却通道可以将壳体的第一表面流体地联接到流体入口容器。流体出口歧管还可包括流体出口通道和流体出口储存器。冷却通道可以将壳体的第二表面流体地联接到流体出口储存器。流体入口通道，冷却通道和流体出口通道可以包括横截面拓扑。

7. 发明申请

US20120063091A1 Cooling Apparatuses and Power Electronics Modules 有权
标题翻译：冷却设备和电力电子模块
公开(公告)号：US20120063091A1
公开(公告)日：2012-03-15
申请号：US12880422
申请日：2010-09-13
申请人： Ercan Mehmet Dede , Yan Liu
发明人： Ercan Mehmet Dede , Yan Liu
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/20927 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device.
摘要翻译：用于电力电子系统的冷却装置包括喷射板，目标板，多个流体收集通道和流体出口。喷射板包括具有喷射体和冲击射流通道的冲击射流阵列。靶板包括具有多个径向延伸的波状翅片微通道的微通道单元的阵列。冷却剂流体通过冲击射流阵列指向冲击位置，并且穿过波浪翅片微通道。多个流体收集通道布置成格栅图案，使得冷却剂流体离开波浪翅片微通道并流入多个流体通道。冷却剂流体通过流体出口离开冷却装置。冷却装置可以结合到具有电力电子设备的电力电子模块中，以冷却电力电子设备。

8. 发明申请

US20110299244A1 COOLING MEMBER FOR HEAT CONTAINING DEVICE 有权
标题翻译：用于加热装置的冷却部件
公开(公告)号：US20110299244A1
公开(公告)日：2011-12-08
申请号：US12796382
申请日：2010-06-08
申请人： Ercan Mehmet Dede , Brian Joseph Robert , Serdar H. Yonak
发明人： Ercan Mehmet Dede , Brian Joseph Robert , Serdar H. Yonak
IPC分类号： H05K7/20 , H01L29/739 , F28F7/00
CPC分类号： H05K7/20254 , F28F3/046 , F28F13/08 , F28F2215/04 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.
摘要翻译：公开了一种用于从含热装置中取出热量的冷却构件。冷却构件可以具有壳体，其具有流体入口，流体出口和至少部分地位于其中的多个不规则形状的翅片。此外，多个不规则形状和分层的分支流体路径可以位于多个翅片与壳体之间和/或多个翅片可以与加热容器物理接触。

9. 发明授权

US09062688B2 Diaphragm pump 有权
标题翻译：隔膜泵
公开(公告)号：US09062688B2
公开(公告)日：2015-06-23
申请号：US13528358
申请日：2012-06-20
申请人： Shailesh N. Joshi , Jaewook Lee , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Jaewook Lee , Ercan Mehmet Dede
IPC分类号： F04D33/00 , F04B19/00 , F04B43/04
CPC分类号： F04D33/00 , F04B19/006 , F04B43/043
摘要： An apparatus that includes a chamber. The chamber includes an inlet via which process fluid enters the chamber and an outlet via which the process fluid exits the chamber. A diaphragm is fixed in position in the chamber at a periphery of the diaphragm. The diaphragm includes a magnetic fluid therein.
摘要翻译：一种包括腔室的装置。该室包括入口，工艺流体通过该入口进入腔室，出口通过该出口流出腔室。隔膜在隔膜的周边处固定在腔室中的适当位置。隔膜在其中包括磁性流体。

10. 发明申请

US20130308277A1 TWO-PHASE HEAT TRANSFER ASSEMBLIES AND POWER ELECTRONICS MODULES INCORPORATING THE SAME 有权
标题翻译：两相热交换器和功率电子模块
公开(公告)号：US20130308277A1
公开(公告)日：2013-11-21
申请号：US13471699
申请日：2012-05-15
申请人： Shailesh N. Joshi , Ercan Mehmet Dede
发明人： Shailesh N. Joshi , Ercan Mehmet Dede
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/209 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.
摘要翻译：两相传热组件包括具有冲击表面的冷板，联接到冷板的发热装置阵列和一组喷嘴。冲击表面具有中心亲水区域的阵列。每个单独的中心亲水区被疏水周边包围。冲击表面的润湿性在每个疏水性周边处逐渐从亲水性逐渐发展到疏水性。发热装置的阵列耦合到冷板的加热表面，使得中心亲水区域的阵列与发热装置阵列对准。喷嘴阵列被配置成将冷却剂液滴引向冲击表面。冷板的冲击表面的润湿性能导致冷却剂液滴从每个疏水性周边向内朝各个中心亲水区域移动。

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