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    • 10. 发明专利
    • JP2992408B2
    • 1999-12-20
    • JP20523292
    • 1992-07-31
    • HITACHI SEISAKUSHO KK
    • SAKAGUCHI MASARUSERIZAWA KOJI
    • H01L23/28H01L23/50
    • PURPOSE:To obtain a multi-pin narrow pitch IC package and a loading structure, in which such IC package is loaded on a printed circuit board, having realized reliability and high yield of connection by eliminating defective connection such as bridging of solder or the like. CONSTITUTION:Under the condition that electrodes of an LSI chip 2 in the bare chip condition are connected to an inner part 10 of a lead frame 8, these elements are resin-sealed with a resin 14. At the time of resin sealing, the surface of outer lead 16 is exposed and this part is formed lower than the main surface resulting in a stepped portion to structure an IC package 1. At the time of loading, the IC package 1 is fixed to the printed circuit board, the outer lead 16 is connected with a connection terminal provided on the printed circuit board with a wire bonding and moreover at least the outer wire bonding part and the exposed connecting part are coated with resin to complete the loading structure.