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    • 4. 发明申请
    • Dual Gas Flow Device Provided with Cooling Functionality
    • US20220090277A1
    • 2022-03-24
    • US17593221
    • 2019-03-21
    • Hymeth ApS
    • Sumon Bishwas
    • C25B9/73C25B1/04C25B9/05C25B9/67
    • A dual gas flow device including: a first cooling plate structure, a second cooling plate structure, a plurality of electrode plates, wherein the first cooling plate structure, the second cooling plate structure and the plurality of electrode plates are arranged in a stacked configuration, wherein the first cooling plate structure forms a first end of the stack and the second cooling plate structure forms a second end of the stack, wherein the plurality of electrode plates are arranged between the first cooling plate structure and the second cooling plate structure, wherein each electrode plate includes a plurality of cooling channels extending through the electrode plate, distributed along a peripheral portion of the electrode plate, each cooling channel being aligned with the corresponding cooling channel of the other electrode plates in the stack, wherein each of the first cooling plate structure and the second cooling plate structure is provided with a plurality of connecting channels, each connecting channel being configured to connect adjacent pairs of cooling channels of the electrode plates, whereby the first cooling plate structure forms a return path for cooling fluid at the first end of the stack and the second cooling plate structure forms a return path for cooling fluid at the second end of the stack enabling cooling fluid to flow through all of the cooling channels.
    • 7. 发明申请
    • ELECTRODE SYSTEM
    • US20220127732A1
    • 2022-04-28
    • US17427706
    • 2020-02-20
    • Hymeth ApS
    • Sumon Bishwas
    • C25B9/77C25B1/04C25B9/65
    • An electrode system comprising: a plurality of first electrode plates (3) and a plurality of second electrode plates (5′) arranged alternatingly to form an electrode stack, each first electrode plate having a first electrode plate first busbar opening and a first electrode plate second busbar opening extending through the first electrode plate, the first electrode plate second busbar opening being larger than the first electrode plate first busbar opening, each second electrode plate (5′) having a second electrode plate first busbar opening (27a′) extending through the second electrode plate (5′), the second electrode plate first busbar opening (27a′) being dimensioned larger than each of the first electrode plate first busbar openings and aligned with the first electrode plate first busbar openings, and a second electrode plate second busbar opening (27b′) extending through the second electrode plate (5′), the second electrode plate second busbar opening (27b′) being dimensioned smaller than each of the first electrode plate second busbar openings and aligned with the first electrode plate second busbar openings, a first busbar extending through the first electrode plate first busbar openings and the second electrode plate first busbar openings (27b′), the first busbar being configured to be in mechanical contact with an inner first busbar surface of the first electrode plate first busbar openings only, and a second busbar extending through the first electrode plate second busbar openings and the second electrode plate second busbar openings (27b′), the second busbar being configured to be in mechanical contact with an inner second busbar surface of the second electrode plate second busbar openings (27b′) only.
    • 8. 发明申请
    • RACK-MOUNT BOX FOR A HEAT-EMITTING DEVICE
    • US20220056598A1
    • 2022-02-24
    • US17415177
    • 2019-09-23
    • Hymeth ApS
    • Sumon Bishwas
    • C25B9/67C25B9/73C25B1/04F24H3/04
    • A rack-mount box (1″) for a heat-emitting device, wherein the rack-mount box (1″) comprises: a housing (3′) forming a heat-emitting device chamber, and a heat-emitting device holding structure (77) arranged in the heat-emitting device chamber and configured to support a heat-emitting device, a cool air inlet (71) arranged vertically below the heat-emitting device holding structure (77), configured to enable cool air to flow into the heat-emitting device chamber, the heat-emitting device holding structure (77) being configured to enable cool air to flow vertically past the heat-emitting device holding structure (77), wherein the housing (3) has a wall (3d) provided with a hot air outlet (73) arranged vertically above the heat-emitting device holding structure (77) to enable heated air received into the heat-emitting device chamber as cool air via the cool air inlet (71) to exit the heat-emitting device chamber, wherein the housing (3) has a roof structure (79) extending inwards in the heat-emitting chamber, the roof structure (79) being configured to direct heated air in the heat-emitting device chamber towards the hot air outlet (73).
    • 10. 发明授权
    • Dual gas flow device provided with cooling functionality
    • US11492714B2
    • 2022-11-08
    • US17593221
    • 2019-03-21
    • Hymeth ApS
    • Sumon Bishwas
    • C25B9/73C25B9/67C25B9/05C25B1/04
    • A dual gas flow device including: a first cooling plate structure, a second cooling plate structure, a plurality of electrode plates, wherein the first cooling plate structure, the second cooling plate structure and the plurality of electrode plates are arranged in a stacked configuration, wherein the first cooling plate structure forms a first end of the stack and the second cooling plate structure forms a second end of the stack, wherein the plurality of electrode plates are arranged between the first cooling plate structure and the second cooling plate structure, wherein each electrode plate includes a plurality of cooling channels extending through the electrode plate, distributed along a peripheral portion of the electrode plate, each cooling channel being aligned with the corresponding cooling channel of the other electrode plates in the stack, wherein each of the first cooling plate structure and the second cooling plate structure is provided with a plurality of connecting channels, each connecting channel being configured to connect adjacent pairs of cooling channels of the electrode plates, whereby the first cooling plate structure forms a return path for cooling fluid at the first end of the stack and the second cooling plate structure forms a return path for cooling fluid at the second end of the stack enabling cooling fluid to flow through all of the cooling channels.