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    • 7. 发明授权
    • Temperature sensing device and method
    • 温度传感装置及方法
    • US3982218A
    • 1976-09-21
    • US507284
    • 1974-09-19
    • Meryle D. W. AdlerJohn T. Brown
    • Meryle D. W. AdlerJohn T. Brown
    • G01K7/18H01C1/14H01C7/02H01C7/22H01C17/075B05D5/12H01C7/04
    • H01C17/075H01C1/1406H01C7/021H01C7/22Y10S205/917
    • A temperature sensing device and a method of forming it is disclosed. A first film or coating of an adherent electro-conductive metallic oxide is applied over the exterior surface of a dielectric substrate. The metal oxide coating is thereafter thoroughly cleansed and a second coating or layer of a metal having a relatively high temperature coefficient of resistance is applied over the metallic oxide film so as to form a strong physical bond as well as a chemical bond therebetween. The composite so formed is fired at a temperature up to about 750.degree.C. If desired, the metal layer is thereafter suitably spiralled to provide the desired resistance and terminal leads are attached to the element. Also, if desired, the element is then coated with a dielectric protective coating.
    • 公开了一种温度感测装置及其形成方法。 将粘附的导电金属氧化物的第一膜或涂层施加在电介质基板的外表面上。 此后,金属氧化物涂层被彻底清洗,并且在金属氧化物膜上施加具有相对较高的电阻温度系数的第二涂层或金属层,以形成强的物理键以及它们之间的化学键。 所形成的复合体在高达约750℃的温度下焙烧。如果需要,金属层之后适当地螺旋化以提供所需的电阻,并且端子引线附接到元件上。 此外,如果需要,然后用绝缘保护涂层涂覆该元件。