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1. 发明授权

US08829155B2 Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the same 有权
标题翻译：具有低介电常数和低损耗特性和绝缘材料的聚（对二甲苯基）基聚合物，印刷电路板和使用其的功能元件
公开(公告)号：US08829155B2
公开(公告)日：2014-09-09
申请号：US12370313
申请日：2009-02-12
申请人： Jae-Choon Cho , Andreas Greiner , Do-Yeung Yoon , Jun-Rok Oh , Keun-Yong Lee , Moon-Soo Park
发明人： Jae-Choon Cho , Andreas Greiner , Do-Yeung Yoon , Jun-Rok Oh , Keun-Yong Lee , Moon-Soo Park
IPC分类号： C08G61/02
CPC分类号： C08G61/025 , C08G61/02 , C08G2261/148 , C08G2261/3424 , H05K3/4676
摘要： The present invention relates to a poly(p-xylylene)-based polymer having a low dielectric constant suitable for low loss dielectrics (LLD), and an insulating material, a printed circuit board and a functional element using the same. More particularly, the poly(p-xylylene)-based polymer includes at least one repeat unit expressed by the following formula (1): wherein, at least one of R1, R2, R7 and R8 is independently substituted or unsubstituted C6-C20 aryl; the rest of R1 to R8 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 400 to 900.
摘要翻译：本发明涉及适用于低损耗电介质（LLD）的低介电常数的聚（对二甲苯基）基聚合物，以及绝缘材料，印刷电路板和使用其的功能元件。更具体地，聚（对二甲苯）基聚合物包括由下式（1）表示的至少一个重复单元：其中，R 1，R 2，R 7和R 8中的至少一个独立地为取代或未取代的C 6 -C 20芳基 ; R 1至R 8的其余部分各自独立地为H，取代或未取代的直链C 1 -C 3烷基或取代或未取代的支链C 1 -C 3烷基; n为400〜900的整数。

2. 发明授权

US08053673B2 Capacitor embedded printed circuit board 有权
标题翻译：电容器嵌入式印刷电路板
公开(公告)号：US08053673B2
公开(公告)日：2011-11-08
申请号：US12068790
申请日：2008-02-12
申请人： Jin Cheol Kim , Tae Kyoung Kim , Jun Rok Oh
发明人： Jin Cheol Kim , Tae Kyoung Kim , Jun Rok Oh
IPC分类号： H05K1/00
CPC分类号： H05K1/162 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K2201/09672 , H05K2203/061
摘要： A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are alternately disposed to form a pair. A plurality of first extended electrodes and second extended electrodes protrude from the first inner electrodes and second inner electrodes, respectively. One or more insulating layers are laminated on one or both surfaces of the multilayer polymer capacitor. A plurality of first via holes for capacitor, and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer are connected to the first extended electrodes and the second extended electrodes, respectively. The plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.
摘要翻译：电容器嵌入式印刷电路板（PCB）包括具有多个聚合物片的多层聚合物电容层。由多个聚合物片中的一个或多个隔开的一个或多个第一内部电极和第二内部电极交替地设置成一对。多个第一延伸电极和第二延伸电极分别从第一内部电极和第二内部电极突出。在多层聚合物电容器的一个或两个表面上层压一个或多个绝缘层。多个用于电容器的第一通孔和多个穿过多层聚合物电容器层的电容器用第二通孔分别连接到第一延伸电极和第二延伸电极。多个第一和第二延伸电极交替地设置成彼此相对。

3. 发明授权

US07913368B2 Method of manufacturing chip capacitor including ceramic/polymer composite 有权
标题翻译：包括陶瓷/聚合物复合材料的片式电容器的制造方法
公开(公告)号：US07913368B2
公开(公告)日：2011-03-29
申请号：US12421873
申请日：2009-04-10
申请人： Jin Cheol Kim , Jun Rok Oh
发明人： Jin Cheol Kim , Jun Rok Oh
IPC分类号： H01R43/00
CPC分类号： H01G2/065 , H01G13/00 , Y10T29/417 , Y10T29/435 , Y10T29/49165
摘要： A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.
摘要翻译：根据一个方面的制造片状电容器的方法可以包括：制备包括由具有陶瓷粉末和彼此混合的聚合物的复合材料形成的电介质片的电容器层叠体，以及形成在电介质的两个表面上的第一和第二内部电极片材以预定间隔; 在所述电容器层叠体的两个表面上形成由绝缘材料形成的覆盖层; 在其上形成有覆盖层的电容器层叠中分别形成第一开口和第二开口以暴露第一和第二内部电极; 在所述第一和第二开口中形成镀层，所述镀层连接到所述第一和第二内部电极; 并且基于第一和第二开口将电容器层压切割成芯片，使得形成在第一和第二开口中的镀层被设置为第一和第二外部端子。

4. 发明申请

US20100048858A1 POLY(P-XYLYLENE)-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTY AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTIONAL ELEMENT USING THE SAME 有权
标题翻译：具有低介电常数和低损耗物质和绝缘材料的聚（对 - 甲苯）共聚物聚合物，印刷电路板和使用其的功能元件
公开(公告)号：US20100048858A1
公开(公告)日：2010-02-25
申请号：US12370313
申请日：2009-02-12
申请人： Jae-Choon CHO , Andreas Greiner , Do-Yeung Yoon , Jun-Rok Oh , Keun-Yong Lee , Moon-Soo Park
发明人： Jae-Choon CHO , Andreas Greiner , Do-Yeung Yoon , Jun-Rok Oh , Keun-Yong Lee , Moon-Soo Park
IPC分类号： C08G10/02 , C08G10/00
CPC分类号： C08G61/025 , C08G61/02 , C08G2261/148 , C08G2261/3424 , H05K3/4676
摘要： The present invention relates to a poly(p-xylylene)-based polymer having a low dielectric constant suitable for low loss dielectrics (LLD), and an insulating material, a printed circuit board and a functional element using the same. More particularly, the poly(p-xylylene)-based polymer includes at least one repeat unit expressed by the following formula (1): wherein, at least one of R1, R2, R7 and R8 is independently substituted or unsubstituted C6-C20 aryl; the rest of R1 to R8 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 400 to 900.
摘要翻译：本发明涉及适用于低损耗电介质（LLD）的低介电常数的聚（对二甲苯基）基聚合物，以及绝缘材料，印刷电路板和使用其的功能元件。更具体地，聚（对二甲苯）基聚合物包括由下式（1）表示的至少一个重复单元：其中，R 1，R 2，R 7和R 8中的至少一个独立地为取代或未取代的C 6 -C 20芳基 ; R 1至R 8的其余部分各自独立地为H，取代或未取代的直链C 1 -C 3烷基或取代或未取代的支链C 1 -C 3烷基; n为400〜900的整数。

5. 发明授权

US07281321B2 Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same 失效
标题翻译：使用混合材料的嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US07281321B2
公开(公告)日：2007-10-16
申请号：US11361078
申请日：2006-02-22
申请人： Tae Kyoung Kim , Jun Rok Oh , Jin Cheol Kim
发明人： Tae Kyoung Kim , Jun Rok Oh , Jin Cheol Kim
IPC分类号： H05K3/30
CPC分类号： H05K1/162 , H05K3/4611 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0141 , H05K2201/0209 , H05K2201/09309 , H05K2201/09509 , H05K2201/09518 , H05K2201/09672 , Y10T29/43 , Y10T29/435 , Y10T29/4913
摘要： The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
摘要翻译：本发明涉及具有使用混合材料的嵌入式电容器的印刷电路板及其制造方法。本发明提供了一种具有嵌入式电容器的印刷电路板，以及使用包括液晶聚合物和陶瓷粉末的混合电介质层的材料，以及制造这种印刷电路板的方法。

6. 发明申请

US20110121233A1 COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME 有权
标题翻译：用于形成基材的组合物，以及使用其的预浸料和底物
公开(公告)号：US20110121233A1
公开(公告)日：2011-05-26
申请号：US12692439
申请日：2010-01-22
申请人： Geum Hee Yun , Jun Rok Oh , Keun Yong Lee
发明人： Geum Hee Yun , Jun Rok Oh , Keun Yong Lee
IPC分类号： C09K19/34 , C08G69/26 , C08G73/10
CPC分类号： C08G69/44 , C08J5/24 , C08J2377/12 , C08L77/12 , H05K1/034 , Y10S428/901 , Y10T428/1086
摘要： Disclosed herein is a composition for forming a substrate, including: a compound prepared by polymerizing a liquid crystal thermosetting oligomer having one or more soluble structural units in a main chain thereof and having a thermosetting group at one or more of two ends of the main chain thereof with a fluorine compound having a functional group which can react with the main chain of the liquid crystal thermosetting oligomer.
摘要翻译：本文公开了一种用于形成基材的组合物，其包括：通过在主链中的一个或多个的两个末端的主链中聚合具有一个或多个可溶性结构单元并具有热固性基团的液晶热固性低聚物制备的化合物具有可与液晶热固性低聚物的主链反应的官能团的氟化合物。

7. 发明授权

US07676921B2 Method of manufacturing printed circuit board including embedded capacitors 失效
标题翻译：包括嵌入式电容器的印刷电路板的制造方法
公开(公告)号：US07676921B2
公开(公告)日：2010-03-16
申请号：US11670463
申请日：2007-02-02
申请人： Jin Cheol Kim , Min Soo Kim , Jun Rok Oh , Tae Kyoung Kim
发明人： Jin Cheol Kim , Min Soo Kim , Jun Rok Oh , Tae Kyoung Kim
IPC分类号： H01K3/10
CPC分类号： H05K1/162 , H05K1/0373 , H05K3/4602 , H05K3/4623 , H05K3/4688 , H05K2201/0209 , H05K2201/09536 , H05K2201/09672 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.
摘要翻译：一种制造包括嵌入式电容器的印刷电路板的方法，该电容器由包括多个聚合物聚合物层的聚合物冷凝层压板组成，每个聚合物层压板具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔以及形成在聚合物冷凝层叠体的任一表面或两个表面上并具有电路图案和用于通过其进行层间连接的通孔的电路层。通过本发明的方法制造的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路而不是安装在其上。

8. 发明申请

US20090168449A1 Light emitting diode unit 审中-公开
标题翻译：发光二极管单元
公开(公告)号：US20090168449A1
公开(公告)日：2009-07-02
申请号：US12155931
申请日：2008-06-11
申请人： Ho-Joon Park , Jun-Rok Oh , Jin-Cheol Kim , Sang-Jun Yoon , Hwa-Young Lee
发明人： Ho-Joon Park , Jun-Rok Oh , Jin-Cheol Kim , Sang-Jun Yoon , Hwa-Young Lee
IPC分类号： F21V7/04
CPC分类号： F21V29/89 , F21V29/74 , F21V29/86 , F21V29/87 , F21Y2115/10 , H05K1/0366 , H05K1/056 , H05K2201/0129 , H05K2201/0209 , H05K2201/0251 , H05K2201/029 , H05K2201/10106
摘要： Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate.
摘要翻译：公开了一种发光二极管单元，更具体地，包括直接粘附到热塑性基材的另一表面上的热塑性基材，安装在热塑性基材的一个表面上的发光二极管和散热器的发光二极管单元。通过本发明，可以通过使散热片（由发光二极管产生的热量排出）直接粘附到发光二极管单元的基板上，从而可以降低发光二极管单元的制造成本和制造时间被安装。此外，通过使用散热片直接粘附到热塑性基材上的发光二极管单元的散热能力。

9. 发明授权

US07186919B2 Printed circuit board including embedded capacitors and method of manufacturing the same 有权
标题翻译：印刷电路板包括嵌入式电容器及其制造方法
公开(公告)号：US07186919B2
公开(公告)日：2007-03-06
申请号：US11031508
申请日：2005-01-06
申请人： Jin Cheol Kim , Min Soo Kim , Jun Rok Oh , Tae Kyoung Kim
发明人： Jin Cheol Kim , Min Soo Kim , Jun Rok Oh , Tae Kyoung Kim
IPC分类号： H05K1/00
CPC分类号： H05K1/162 , H05K1/0373 , H05K3/4602 , H05K3/4623 , H05K3/4688 , H05K2201/0209 , H05K2201/09536 , H05K2201/09672 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.
摘要翻译：本发明公开了一种印刷电路板，其包括嵌入式电容器，其由聚合物冷凝器层压体构成，聚合物冷凝层压板包括多个聚合物聚合物层，每个聚合物聚合物层具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔以及形成在聚合物冷凝层叠体的任一表面或两个表面上的电路层，并且具有电路图案和用于通过其进行层间连接的通孔。本发明的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路板中，而不是安装在其上。此外，提供了一种制造包括嵌入式电容器的印刷电路板的方法。

10. 发明申请

US20100283004A1 Composition For Forming Substrate, and Prepreg and Substrate Using The Same 有权
标题翻译：用于形成基材的组合物，以及使用其的预浸料和基材
公开(公告)号：US20100283004A1
公开(公告)日：2010-11-11
申请号：US12507647
申请日：2009-07-22
申请人： Keun Yong LEE , Jun Rok Oh , Seong Hyun Yoo
发明人： Keun Yong LEE , Jun Rok Oh , Seong Hyun Yoo
IPC分类号： C09K19/22
CPC分类号： H05K1/032 , C08F283/045 , C08F290/065 , C08J5/24 , C08J2379/08 , C08L77/10 , C08L79/02 , H05K2201/0141 , Y10S428/901 , Y10T428/1086 , C08F230/08
摘要： Disclosed herein is a composition for forming a substrate, comprising: a liquid crystal thermosetting oligomer having one or more soluble structural units in the main chain thereof and having thermosetting groups at one or more ends of the main chain thereof; and a metal alkoxide compound having reaction groups which can be covalently bonded with the thermosetting groups.
摘要翻译：本文公开了一种用于形成基材的组合物，其包含：在主链中具有一个或多个可溶性结构单元并在其主链的一个或多个末端具有热固性基团的液晶热固性低聚物; 和具有可以与热固性基团共价键合的反应基团的金属醇盐化合物。

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