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1. 发明专利

IL278962D0 Anti-human tlr7 antibody 未知
公开(公告)号：IL278962D0
公开(公告)日：2021-01-31
申请号：IL27896220
申请日：2020-11-24
申请人： DAIICHI SANKYO CO LTD , UNIV TOKYO , KENSUKE MIYAKE , YUSUKE MURAKAMI , YUJI MOTOI , ATSUO KANNO , TOSHIYUKI SHIMIZU , UMEHARU OHTO , TAKAICHI SHIMOZATO , ATSUSHI MANNO , TAKASHI KAGARI , JUN ISHIGURO , KENSUKE NAKAMURA , TAKASHI ISOBE
发明人： KENSUKE MIYAKE , YUSUKE MURAKAMI , YUJI MOTOI , ATSUO KANNO , TOSHIYUKI SHIMIZU , UMEHARU OHTO , TAKAICHI SHIMOZATO , ATSUSHI MANNO , TAKASHI KAGARI , JUN ISHIGURO , KENSUKE NAKAMURA , TAKASHI ISOBE
IPC分类号： A61K39/395 , A61P29/00 , A61P31/00 , A61P35/00 , A61P37/00 , C07K16/28 , C07K16/46 , C12N5/10 , C12N15/63
摘要： The present invention provides a pharmaceutical composition comprising an antibody which binds specifically to human TLR7 or monkey TLR7 and does not bind to mouse TLR7 or rat TLR7, and has an activity of inhibiting a function of human TLR7 or monkey TLR7, and the like.

2. 发明申请

US20140183758A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, AND SEQUENTIAL STACKED BODY 有权
标题翻译：制造半导体器件，块状堆叠体和顺序堆叠体的方法
公开(公告)号：US20140183758A1
公开(公告)日：2014-07-03
申请号：US14239960
申请日：2012-08-24
申请人： Kensuke Nakamura , Toru Meura , Yoji Ishimura
发明人： Kensuke Nakamura , Toru Meura , Yoji Ishimura
IPC分类号： H01L25/00 , H01L25/065
CPC分类号： H01L25/50 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/05025 , H01L2224/05568 , H01L2224/05655 , H01L2224/06181 , H01L2224/13007 , H01L2224/13023 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16238 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/7598 , H01L2224/81191 , H01L2224/81203 , H01L2224/81209 , H01L2224/81815 , H01L2224/83191 , H01L2224/83193 , H01L2224/83203 , H01L2224/83209 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2224/83 , H01L2924/0665 , H01L2224/05552
摘要： A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.
摘要翻译：提供一种制造半导体器件的方法，其能够提高生产率和可靠性。制造本发明的半导体器件（1）的方法包括顺序堆叠工艺，单独的层叠体获得工艺和基材粘合工艺。在顺序堆叠处理中，获得块堆叠体。块状堆叠体是在未焊接的状态下层叠有半导体块（10B，12B，14B，16B）的块状堆叠体（2B）。在半导体块（10B，12B，14B，16B）中，配置有多个半导体元件。在各个层叠体取得工序中，获得堆叠的半导体部件的端子被焊接并且从堆叠的半导体部件单元中的块状堆叠体（2B）切断的单个层叠体（2）。

3. 发明授权

US07859110B2 Solder resist material, wiring board using the solder resist material, and semiconductor package 有权
标题翻译：阻焊材料，使用阻焊材料的接线板和半导体封装
公开(公告)号：US07859110B2
公开(公告)日：2010-12-28
申请号：US12298706
申请日：2007-04-26
申请人： Kensuke Nakamura , Hiroshi Hirose
发明人： Kensuke Nakamura , Hiroshi Hirose
IPC分类号： H01L21/00
CPC分类号： H05K3/281 , B32B3/263 , B32B5/022 , B32B5/024 , B32B27/10 , B32B27/12 , B32B27/18 , B32B27/20 , B32B27/28 , B32B27/38 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/0238 , B32B2262/0246 , B32B2262/0253 , B32B2262/0261 , B32B2262/0276 , B32B2262/0292 , B32B2262/101 , B32B2307/30 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2307/402 , B32B2307/50 , B32B2307/718 , B32B2457/08 , C08G2650/56 , C08L63/00 , C08L65/00 , C08L71/00 , H05K1/0269 , H05K2201/0191 , H05K2201/0195 , H05K2203/161 , Y10T428/24612 , Y10T428/2495 , Y10T428/31504 , Y10T428/31511 , Y10T428/31525 , C08L2666/14
摘要： The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.
摘要翻译：本发明提供一种阻焊材料，其即使在薄的布线板中使用也能够抑制暴露于热或冲击时的半导体封装的翘曲，并且满足电子器件的尺寸减小和更高的集成度的需求，以及包括阻焊材料和半导体封装的布线板。本发明的阻焊材料能够有效地抑制通过设置在树脂层之间的含有纤维基材的层的半导体封装的翘曲。含有纤维基材的层优选在阻焊材料的厚度方向上不均匀地分布。

4. 发明授权

US07331502B2 Method of manufacturing electronic part and electronic part obtained by the method 有权
标题翻译：通过该方法获得的制造电子部件和电子部件的方法
公开(公告)号：US07331502B2
公开(公告)日：2008-02-19
申请号：US10472311
申请日：2001-03-19
申请人： Ryoichi Okada , Hitoshi Aoki , Yoshitaka Okugawa , Kensuke Nakamura , Shinichiro Itoh
发明人： Ryoichi Okada , Hitoshi Aoki , Yoshitaka Okugawa , Kensuke Nakamura , Shinichiro Itoh
IPC分类号： B23K31/02
CPC分类号： H05K3/3436 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L23/293 , H01L23/49827 , H01L24/29 , H01L24/81 , H01L2221/68345 , H01L2224/05571 , H01L2224/05573 , H01L2224/1147 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01059 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/1579 , H05K3/20 , H05K3/305 , H05K3/3489 , H05K3/386 , H05K3/4617 , H05K2201/0195 , H05K2201/0394 , H05K2201/10977 , H05K2203/0475 , H05K2203/1189 , Y02P70/613 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2224/05599
摘要： In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.
摘要翻译：在制造电子部件的方法中，包括将具有焊料层或焊料凸块（焊料部分）的电连接用导体部分I的电子部件（A）焊接到电极部件的表面上，（B）电子部件通过粘合剂层在加热下通过按压（A）至（B）而将具有用于电连接的导体部分II布置在与导体部分I的位置相对应的位置处，焊料部分与粘合剂层接触，焊料通过在焊料的熔点以上的温度加热来熔融部分，通过挤压熔化的焊料部分进行焊接，并且使粘合剂层固化。根据该过程获得电子部件。可靠地实现电连接，并且可以以优异的生产率获得高可靠性的电子部件。

5. 发明申请

US20070102804A1 Multilayered printed wiring board and manufacturing method thereof 失效
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20070102804A1
公开(公告)日：2007-05-10
申请号：US10580198
申请日：2004-12-09
申请人： Kensuke Nakamura , Tetsuro Sato
发明人： Kensuke Nakamura , Tetsuro Sato
IPC分类号： B05D5/12
CPC分类号： H05K3/4655 , H05K3/386 , H05K3/4652 , H05K2201/0195 , H05K2203/066 , Y10T428/12556 , Y10T428/12569 , Y10T428/12708 , Y10T428/24917
摘要： An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board. The multi-layered printed wiring board is manufactured by taking the steps such as (a) a steps for producing a primer resin sheet with a carrier film including a 2 micron m to 12 micron m thick primer resin layer; (b) a steps for placing the primer resin sheet on the inner-layer circuit board in which the primer resin layer of the primer resin sheet with a carrier film is placed on the inner layer circuit board and then the carrier film is removed; (c) a steps for pressing in which a pre-preg and a metal foil for forming a conductive layer are superposed on the primer resin sheet, and pressed to form the multi-layered metal clad laminate; and (d) a steps for forming an outer layer circuit wherein the outer layer circuit is formed by etching the outer layer metal foil of the multi-layered metal clad laminate to make the multi-layered printed wiring board.
摘要翻译：本发明的目的是提供一种在内层电路上不需要诸如黑色氧化物处理等的粗糙化的多层印刷线路板。为了实现该目的，采用了一种多层印刷电路板，其特征在于包括仅在不粗化形成的每个内层电路Ci和多层绝缘树脂层5之间仅包含树脂的底漆树脂层P 印刷线路板。通过以下步骤制造多层印刷线路板：（a）用包含2微米至12微米厚的底漆树脂层的载体膜制备底漆树脂片的步骤; （b）将底漆树脂片放置在内层电路基板上的步骤，在该内层电路板上，将具有载体膜的底漆树脂片的底漆树脂层放置在内层电路板上，然后除去载体膜; （c）用于压制的步骤，其中用于形成导电层的预浸料和金属箔叠加在底漆树脂片上，并压制以形成多层金属包覆层压板; 以及（d）形成外层电路的步骤，其中通过蚀刻多层金属包覆层压板的外层金属箔形成外层电路以制造多层印刷电路板。

6. 发明授权

US06483195B1 Transfer bump street, semiconductor flip chip and method of producing same 失效
标题翻译：转移凸起街道，半导体倒装芯片及其制造方法
公开(公告)号：US06483195B1
公开(公告)日：2002-11-19
申请号：US09523063
申请日：2000-03-09
申请人： Hitoshi Aoki , Takeshi Hosomi , Kensuke Nakamura , Hideki Hara , Masaaki Kato
发明人： Hitoshi Aoki , Takeshi Hosomi , Kensuke Nakamura , Hideki Hara , Masaaki Kato
IPC分类号： H01L2940
CPC分类号： H01L24/11 , H01L21/6835 , H01L2221/68377 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/11822 , H01L2224/13099 , H01L2224/136 , H01L2224/45144 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K3/062 , H05K3/3473 , H05K3/4015 , H01L2924/00 , H01L2224/05599
摘要： The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention also relates to a low-cost semiconductor flip chip in which copper-cored solder bumps with high reliability of bonding are mounted on a semiconductor chip through the use of the transfer bump sheet. In the transfer bump sheet, metal posts of two or more layers are formed on a base sheet. The invention also relates to a method of manufacturing this semiconductor flip chip, which comprises the steps of forming the base sheet on a metal foil, forming a plating mask on the metal foil, forming a first solder layer (solder coating) on the metal foil by electrolytic plating or electroless plating, removing the plating mask, and forming a metal layer (metal core) of metal posts by the etching of the metal foil through the use of the formed first solder layer (solder coating) as an etching mask.
摘要翻译：本发明涉及一种低成本转移凸块，其能够将具有高可靠性的铜芯焊料凸块转移到半导体芯片，并且能够转移各种结构的凸块。本发明还涉及一种低成本半导体倒装芯片，其中通过使用转移凸块来将具有高可接合性的铜芯焊料凸块安装在半导体芯片上。在转印凸块中，在基片上形成两层以上的金属柱。本发明还涉及一种制造该半导体倒装芯片的方法，该方法包括以下步骤：在金属箔上形成基片，在金属箔上形成电镀掩模，在金属箔上形成第一焊料层（焊料涂层）通过电镀或化学镀，除去电镀掩模，并且通过使用所形成的第一焊料层（焊料涂层）作为蚀刻掩模，通过金属箔的蚀刻来形成金属柱的金属层（金属芯）。

7. 发明授权

US06364796B1 Blade chain tensioner 有权
标题翻译：刀片链张紧器
公开(公告)号：US06364796B1
公开(公告)日：2002-04-02
申请号：US09482223
申请日：2000-01-13
申请人： Kensuke Nakamura , Ryohei Adachi , Naosumi Tada , Shinji Tsuruta
发明人： Kensuke Nakamura , Ryohei Adachi , Naosumi Tada , Shinji Tsuruta
IPC分类号： F16H700
CPC分类号： F16H7/08 , F16H2007/0804 , F16H2007/0872
摘要： A blade-type tensioner for chain drives which is suitable for use as a tensioner on the timing chain of a motor vehicle engine. The present invention is a chain tensioner particularly suited for use in confined spaces having a blade spring element mechanically interlocked with a plastic shoe. The shoe may be of rigid filled nylon and engages the chain to be tensioned. The spring element is interlocked to the plastic shoe by having ends inserted into grooves formed in the opposite ends of the shoe. The shoe is rotatably fixed to a base by way of a pin. The groove at the fixed end of the shoe extends towards the tip of the fixed end of the shoe past the pin attachment point. The groove at the free end of the shoe extends toward the tip of the free end of the shoe past the point at which the free end of the shoe bears upon a sliding surface formed on the base.
摘要翻译：一种用于链条驱动器的叶片式张紧器，其适合用作机动车辆发动机的正时链条上的张紧器。本发明是一种特别适用于具有与塑料鞋机械联锁的叶片弹簧元件的密闭空间中的链条张紧器。该鞋可以是刚性填充的尼龙并且与待张紧的链接合。弹簧元件通过将端部插入形成在鞋的相对端中的槽中而与塑料鞋互锁。鞋通过销可转动地固定在基座上。鞋的固定端处的凹槽朝着穿过销连接点的鞋的固定端的尖端延伸。鞋的自由端处的槽朝着鞋的自由端的尖端延伸穿过鞋的自由端承载在形成在底座上的滑动表面上的点。

8. 发明授权

US06332441B1 Assembling arrangement for tensioner and hydraulic control valve 失效
标题翻译：张紧器和液压控制阀的组装布置
公开(公告)号：US06332441B1
公开(公告)日：2001-12-25
申请号：US09507462
申请日：2000-02-22
申请人： Izumi Sugiyama , Toshiyuki Satou , Kensuke Nakamura
发明人： Izumi Sugiyama , Toshiyuki Satou , Kensuke Nakamura
IPC分类号： F01L102
CPC分类号： F01L1/022 , F01L1/02 , F01L1/026 , F01L2001/0537 , F01M2001/0276 , F02B2275/18 , F16H7/08 , F16H2007/0806 , F16H2007/0812
摘要： A tensioner for a camshaft driving chain (a plunger device 17 shown in the first embodiment of the invention) and a hydraulic control valve 21 are disposed close to each other. An oil passage 31 for supplying an oil pressure to the tensioner is caused to branch off from a downstream side of an oil filter 27 provided at an inlet port 28 of the hydraulic control valve. With this construction, the arrangement of the oil passage can be simplified, and therefore not only can man hours required for forming the oil passage be reduced, but also the number of components required can also be reduced by commonizing the oil filter. Accordingly, it is possible to provide an improved assembling arrangement for a tensioner and a hydraulic control valve in an internal combustion engine without involving an increase in production costs.
摘要翻译：用于凸轮轴驱动链的张紧器（本发明的第一实施例中的柱塞装置17）和液压控制阀21彼此靠近地设置。使得用于向张紧器供给油压的油路31从设置在液压控制阀的入口28处的滤油器27的下游侧分支。通过这种结构，可以简化油路的布置，因此不仅可以减少油路形成所需的工时，而且还可以通过油过滤器的通风来减少所需的部件数量。因此，可以提供一种用于内燃机中的张紧器和液压控制阀的改进的组装装置，而不需要增加生产成本。

9. 发明授权

US5803854A Silent chain having a sheared link bearing surface 失效
标题翻译：具有剪切链接承载面的静音链
公开(公告)号：US5803854A
公开(公告)日：1998-09-08
申请号：US813240
申请日：1997-03-07
申请人： Naosumi Tada , Kensuke Nakamura , Kazushige Yakubo , Yoshiyuki Ohtaka
发明人： Naosumi Tada , Kensuke Nakamura , Kazushige Yakubo , Yoshiyuki Ohtaka
IPC分类号： F16G13/02 , F16G13/04 , F16G13/06
CPC分类号： F16G13/04
摘要： A silent chain having multiple links each having a pair of teeth and apertures, which are connected by connecting pins inserted into the apertures. The links have an sheared link bearing surface which further reduces the wear of the sprocket tooth surface and further prevents defective bending of the silent chain. The bearing surface of the link tooth has a shear surface which may be formed by shaving or fine-blanking. The shear surface length may be at least approximately 70% or at least approximately 90% of the link thickness.
摘要翻译：具有多个链节的无声链路，每个链路具有一对齿和孔，它们通过插入孔中的连接销连接。连杆具有剪切的链节承载面，其进一步减小链轮齿面的磨损，并进一步防止无声链的有缺陷的弯曲。连杆齿的轴承表面具有剪切面，该剪切表面可以通过剃刮或精细冲裁而形成。剪切表面长度可以为链节厚度的至少约70％或至少约90％。

10. 发明授权

US5743230A Balancer shaft supporting structure in engine 失效
标题翻译：发动机平衡轴支撑结构
公开(公告)号：US5743230A
公开(公告)日：1998-04-28
申请号：US795302
申请日：1997-02-04
申请人： Masakazu Yamazaki , Kensuke Nakamura , Fuminori Kawashima , Nobuyoshi Takamatsu , Toru Kano , Tomoki Okita , Hideo Ueshima
发明人： Masakazu Yamazaki , Kensuke Nakamura , Fuminori Kawashima , Nobuyoshi Takamatsu , Toru Kano , Tomoki Okita , Hideo Ueshima
IPC分类号： F01M1/02 , F02B67/00 , F16F15/26 , F02F7/00 , F02B75/06
CPC分类号： F01M1/02 , F02B67/00 , F16F15/264 , F01M2001/0276
摘要： An engine having a lower block made of an aluminum-based material and having a bearing cap mounted therein in a cast-in manner abutting against front and rear sidewalls of a cylinder block of the engine and coupled to the cylinder block by a bolt, and a pump body is coupled to a lower surface of the lower block by bolts. The pump body also serves as a balancer shaft supporting member, and a journal portion of a balancer shaft is supported on the balancer shaft supporting member. Thus, the rigidity of supporting of the balancer shaft on the balancer shaft supporting member can be enhanced without an increase in size of the balancer shaft supporting member of the engine.
摘要翻译：一种发动机，其具有由铝基材料制成的下部块，并且具有安装在其中的轴承盖，其以铸造方式抵靠在发动机的气缸体的前侧壁和后侧壁上，并通过螺栓联接到气缸体;以及泵体通过螺栓联接到下部块的下表面。泵体还用作平衡轴支撑构件，并且平衡器轴的轴颈部分被支撑在平衡轴支撑构件上。因此，可以在不增加发动机的平衡轴支撑构件的尺寸的情况下增强平衡轴在平衡轴支撑构件上的支撑的刚性。

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