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    • 2. 发明专利
    • Device, method and system for module-type light emitting diode circuit assembly
    • 用于模块型发光二极管电路组件的装置,方法和系统
    • JP2014093300A
    • 2014-05-19
    • JP2013228426
    • 2013-11-01
    • Led Lenser Corp Ltdエルイーディー レンザー コーポレイション リミテッド
    • SVEN HANSEN
    • F21V19/00F21L4/00F21V23/00F21V23/06F21V29/00F21Y101/02H01L33/00
    • F21K9/20F21V19/0015F21V19/0045F21V23/005F21V23/006F21Y2101/00F21Y2115/10
    • PROBLEM TO BE SOLVED: To solve such a problem that an LED is susceptible to overheat leading to an early failure.SOLUTION: The present invention provides improved device, method and system for providing a module-type LED circuit assembly. In particular, an exemplary embodiment according to the present invention includes a module-type LED circuit that can be scaled to various outer shape dimensions. One embodiment of the present invention provides a device for supporting a light emitting diode, comprising an LED circuit board including a first principal plane and a second principal plane. The first principal plane can include a first contact pad and a second contact pad, and the first contact pad and the second contact part are respectively constituted to receive respective connectors from the LED. The second principal plane of the LED circuit board can include a first region, a second region and a third region, and a substrate is mounted to the LED circuit board in the entire third region.
    • 要解决的问题:解决LED易于过热导致早期故障的问题。解决方案:本发明提供了一种用于提供模块型LED电路组件的改进的装置,方法和系统。 特别地,根据本发明的示例性实施例包括可以缩放到各种外形尺寸的模块型LED电路。 本发明的一个实施例提供了一种用于支撑发光二极管的装置,包括包括第一主平面和第二主平面的LED电路板。 第一主平面可以包括第一接触焊盘和第二接触焊盘,并且第一接触焊盘和第二接触部分别被构造成从LED接收相应的连接器。 LED电路板的第二主平面可以包括第一区域,第二区域和第三区域,并且在整个第三区域中将衬底安装到LED电路板。