会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Systems and method of a carrier device for placement of thermal interface materials
    • 用于放置热界面材料的载体装置的系统和方法
    • US08576566B2
    • 2013-11-05
    • US13140832
    • 2008-12-29
    • Jeffrey A. LevMark S. Tracy
    • Jeffrey A. LevMark S. Tracy
    • H05K7/20
    • G06F1/20
    • Carrier device for placement of thermal interface materials. At least some embodiments are systems including a first electrical component that defines a first surface at a first elevation relative to an underlying structure, a second electrical component that defines a second surface at a second elevation relative to the underlying structure, a metallic member configured to conduct heat from the electrical components, and a carrier between the electrical components and the metallic member. The carrier includes a third and fourth surface configured to mate with the first and second surfaces, respectively, a first aperture through the third surface, and a second aperture through the fourth surface. The system further includes a first thermal interface material coupled between the first electrical component and the metallic member through the first aperture, and a second thermal interface material coupled between the second electrical component and the metallic member through the second aperture.
    • 用于放置热界面材料的载体装置。 至少一些实施例是包括第一电气部件的系统,所述第一电气部件相对于下面的结构在第一高度处限定第一表面;第二电气部件,其在相对于下方结构的第二高度处限定第二表面;金属部件, 从电气部件传导热量,以及电气部件和金属部件之间的载体。 载体包括第三和第四表面,其被配置为分别与第一和第二表面配合穿过第三表面的第一孔和穿过第四表面的第二孔。 该系统还包括通过第一孔耦合在第一电气部件和金属部件之间的第一热界面材料,以及通过第二孔连接在第二电气部件和金属部件之间的第二热界面材料。