专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11638667B2 Transmission device of hospital bed 有权
公开(公告)号：US11638667B2
公开(公告)日：2023-05-02
申请号：US17128188
申请日：2020-12-20
申请人： Pei-Yu Hsu
发明人： Pei-Yu Hsu
IPC分类号： A61G7/018 , A61G7/012 , A47C19/04 , H02K7/06
摘要： A transmission device of a hospital bed, the hospital bed includes a body, a head, and a bed end. The transmission device contains: a main motor, a connection rod unit, and a driver. The main motor is disposed on a bottom of the body and includes a socket. The connection rod unit includes a first fixing rod connected to the head and a second fixing rod connected to the bed end. The driver is mounted on the main motor and includes an accommodation space, a driving motor, a reducer, a power cable, and a drive shaft. The first case has a first coupling orifice, and the second case has a second coupling orifice. The power cable is connected between the socket and the driving motor so as to supply a power to the driving motor and to lift or descend the head and the bed end synchronously.

2. 发明申请

US20090145010A1 INNER SCATTERING BILLBOARD 审中-公开
标题翻译：内部散射板
公开(公告)号：US20090145010A1
公开(公告)日：2009-06-11
申请号：US11951020
申请日：2007-12-05
申请人： Chao-Fang CHUNG , Yu-Nan Liu , Chung-Ying Yu , Cheng Hsu , Ming-Chun Lin , Yung-Liang Chang , Pei-Yu Hsu
发明人： Chao-Fang CHUNG , Yu-Nan Liu , Chung-Ying Yu , Cheng Hsu , Ming-Chun Lin , Yung-Liang Chang , Pei-Yu Hsu
IPC分类号： G09F13/00
CPC分类号： G09F13/18
摘要： An inner scattering billboard includes a light directing body, an advertising membrane and a light source. The light directing body contains a plurality of light directing particles inside to diffuse and direct light. Thus light rays emitted from the light source into the light directing body are scattered to allow the light directing body to become a planar light source of even luminosity. The advertising membrane has an advertising symbol located on the surface to be evenly illuminated. The billboard can be made thinner. An LED may be adopted as the light source to save electric power and reduce user's operation cost.
摘要翻译：内部散射广告牌包括导光体，广告膜和光源。导光体在内部包含多个导光颗粒以使光线扩散和引导。因此，从光源发射到光导体中的光线被散射，以使得光导体成为均匀亮度的平面光源。广告膜具有位于表面上的均匀照明的广告符号。广告牌可以变薄。可以采用LED作为光源来节省电力，降低用户的运营成本。

3. 发明申请

US20220402111A1 TRANSMISSION DEVICE FOR LIFTING SICKBED 有权
公开(公告)号：US20220402111A1
公开(公告)日：2022-12-22
申请号：US17351060
申请日：2021-06-17
申请人： Pei-Yu Hsu
发明人： Pei-Yu Hsu
IPC分类号： B25G1/10 , A61G7/05 , A61G7/012 , B66F3/16
摘要： A transmission device for lifting a sickbed contains a first casing, a second casing, a power input assembly, a power output assembly, and multiple screw elements. The first casing includes a first rotatable connection portion, a second rotatable connection portion, a first space, and multiple locking orifices. The second casing includes a third rotatable connection portion, a fourth rotatable connection portion, a second space, and multiple coupling orifices. The power input assembly includes an input shaft and a first bevel gear. The power output assembly includes an output shaft and a second bevel gear. The multiple screw elements are inserted through the multiple coupling orifices of the second casing to screw with the multiple locking orifices of the first casing.

4. 发明授权

US08076765B2 Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors 有权
标题翻译：可堆叠的半导体器件封装包括部分地暴露连接元件，导电凸块或导电导体的开口
公开(公告)号：US08076765B2
公开(公告)日：2011-12-13
申请号：US12507305
申请日：2009-07-22
申请人： Kuang-Hsiung Chen , Chi-Chih Shen , Jen-Chuan Chen , Wen-Hsiung Chang , Hui-Shan Chang , Pei-Yu Hsu , Fa-Hao Wu , Chen-Yu Chia , Chi-Chih Chu , Cheng-Yi Weng , Ya-Wen Hsu
发明人： Kuang-Hsiung Chen , Chi-Chih Shen , Jen-Chuan Chen , Wen-Hsiung Chang , Hui-Shan Chang , Pei-Yu Hsu , Fa-Hao Wu , Chen-Yu Chia , Chi-Chih Chu , Cheng-Yi Weng , Ya-Wen Hsu
IPC分类号： H01L21/44 , H01L21/302 , H01L21/461
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
摘要翻译：在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。封装主体的侧表面基本上与衬底单元的侧表面对准。包装体限定了至少部分地暴露相应的连接元件的开口。连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

5. 发明申请

US20120049338A1 STACKABLE SEMICONDUCTOR DEVICE PACKAGES 审中-公开
标题翻译：堆叠式半导体器件封装
公开(公告)号：US20120049338A1
公开(公告)日：2012-03-01
申请号：US13290819
申请日：2011-11-07
申请人： Kuang-Hsiung Chen , Chi-Chih Shen , Jen-Chuan Chen , Wen-Hsiung Chang , Hui-Shan Chang , Pei-Yu Hsu , Fa-Hao Wu , Chen-Yu Chia , Chi-Chih Chu , Cheng-Yi Weng , Ya-Wen Hsu
发明人： Kuang-Hsiung Chen , Chi-Chih Shen , Jen-Chuan Chen , Wen-Hsiung Chang , Hui-Shan Chang , Pei-Yu Hsu , Fa-Hao Wu , Chen-Yu Chia , Chi-Chih Chu , Cheng-Yi Weng , Ya-Wen Hsu
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
摘要翻译：在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。封装主体的侧表面基本上与衬底单元的侧表面对准。包装体限定了至少部分地暴露相应的连接元件的开口。连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

6. 发明申请

US20220409459A1 Transmission Device of Hospital Bed 有权
公开(公告)号：US20220409459A1
公开(公告)日：2022-12-29
申请号：US17903170
申请日：2022-09-06
申请人： Pei-Yu Hsu
发明人： Pei-Yu Hsu
IPC分类号： A61G7/018 , A61G7/012
摘要： A transmission device of a hospital bed contains: a main motor, a connection rod unit, a gear unit, and a driver. The gear unit includes a first coupling post, a second coupling post, a first gear, a second gear, a third gear, a third coupling post, and a fourth gear. The driver includes a first case, a second case, a first driving motor, a second driving motor, and a power cable. The first case has a first chamber, a third chamber configured to accommodate the first driving motor, and a fourth chamber configured to accommodate the second driving motor. The second case has a second chamber. The first coupling post, the second coupling post, the first gear, the second gear and the third gear are accommodated in the first chamber. The third coupling post and the fourth gear are accommodated in the second chamber.

7. 发明申请

US20220192906A1 TRANSMISSION DEVICE OF HOSPITAL BED 有权
公开(公告)号：US20220192906A1
公开(公告)日：2022-06-23
申请号：US17128188
申请日：2020-12-20
申请人： Pei-Yu Hsu
发明人： Pei-Yu Hsu
IPC分类号： A61G7/018 , A61G7/012
摘要： A transmission device of a hospital bed, the hospital bed includes a body, a head, and a bed end. The transmission device contains: a main motor, a connection rod unit, and a driver. The main motor is disposed on a bottom of the body and includes a socket. The connection rod unit includes a first fixing rod connected to the head and a second fixing rod connected to the bed end. The driver is mounted on the main motor and includes an accommodation space, a driving motor, a reducer, a power cable, and a drive shaft. The first case has a first coupling orifice, and the second case has a second coupling orifice. The power cable is connected between the socket and the driving motor so as to supply a power to the driving motor and to lift or descend the head and the bed end synchronously.

8. 发明申请

US20140054154A1 ULTRA-THIN COMPUTER INPUT DEVICE 审中-公开
标题翻译：超薄电脑输入装置
公开(公告)号：US20140054154A1
公开(公告)日：2014-02-27
申请号：US13592990
申请日：2012-08-23
申请人： Pei-Yu HSU
发明人： Pei-Yu HSU
IPC分类号： H01H1/10
CPC分类号： H01H13/79 , H01H13/702 , H01H2203/02 , H01H2221/05 , H01H2227/036
摘要： An ultra-thin computer input device includes a substrate carrying a circuit layout having sets of comb-like contact portions arranged in a staggered manner, and an outer membrane arranged on the substrate and provided with conducting portions corresponding to the comb-like contact portions of the circuit layout of the substrate and electrically insulative beads located on a part of the bottom side of each conducting portion and stopped against the comb-like contact portions of the circuit layout of the substrate. Because the invention eliminates the use of metal domes, rubber domes or scissor-type linking elements, the thickness and number of component parts of the ultra-thin computer input device can be greatly reduced.
摘要翻译：一种超薄型计算机输入装置，具备承载电路布局的基板，该电路布局具有以交错方式配置的梳状接触部分，以及布置在基板上的外部膜，并且设置有对应于梳状接触部分的梳状接触部分的导电部分基板和电绝缘珠的电路布局，其位于每个导电部分的底侧的一部分上，并且抵靠基板的电路布局的梳状接触部分。因为本发明消除了使用金属圆顶，橡胶圆顶或剪刀式连接元件，所以可以大大减少超薄计算机输入装置的部件的厚度和数量。

9. 发明申请

US20130299326A1 WIRELESS KEYBOARD WITH A SPECIALLY DESIGNED POWER SWITCH STRUCTURE 审中-公开
标题翻译：具有特殊设计的电源开关结构的无线键盘
公开(公告)号：US20130299326A1
公开(公告)日：2013-11-14
申请号：US13471088
申请日：2012-05-14
申请人： Pei-Yu HSU
发明人： Pei-Yu HSU
IPC分类号： H01H13/76
CPC分类号： G06F1/26 , G06F1/1632 , G06F3/0208 , G06F3/0221 , G06F3/0231 , H01H36/0033 , H01H36/0046 , H01H2223/05
摘要： A wireless keyboard includes a keyboard body carrying a set of operating key switches, an elongated spacer block hinged to the front side of the keyboard body and turnable between a first position where the elongated spacer block is kept at the front side of the keyboard body in a substantially flush manner and a second position where the elongated spacer block is attached to a bottom side of the keyboard body for supporting the keyboard body on a flat surface in a tilted condition, a circuit module consisting of a circuit board, a battery power supply, a wireless module and a solenoid switch, and a magnetic member for acting with the solenoid switch to switch off the battery power supply when the elongated spacer block is in the first position or to switch on the battery power supply when the elongated spacer block is in the second position.
摘要翻译：一种无线键盘包括一个携带一组操作键开关的键盘体，一个细长的间隔块，它铰接到键盘体的前侧，并在第一位置和第一位置之间转动，在第一位置，细长间隔块保持在键盘体的前侧基本上齐平的方式和第二位置，其中细长间隔块被附接到键盘体的底侧，用于在倾斜状态下将键盘体支撑在平坦表面上;电路模块，包括电路板，电池电源，无线模块和电磁开关，以及用于与电磁开关一起作用的磁性构件，以在细长间隔块处于第一位置时关闭电池电源，或者当细长间隔块为处于第二位置。

10. 发明申请

US20100171205A1 Stackable Semiconductor Device Packages 有权
标题翻译：可堆叠半导体器件封装
公开(公告)号：US20100171205A1
公开(公告)日：2010-07-08
申请号：US12507305
申请日：2009-07-22
申请人： Kuang-Hsiung CHEN , Chi-Chih SHEN , Jen-Chuan CHEN , Wen-Hsiung CHANG , Hui-Shan CHANG , Pei-Yu HSU , Fa-Hao WU , Chen-Yu CHIA , Chi-Chih CHU , Cheng-Yi WENG , Ya-Wen HSU
发明人： Kuang-Hsiung CHEN , Chi-Chih SHEN , Jen-Chuan CHEN , Wen-Hsiung CHANG , Hui-Shan CHANG , Pei-Yu HSU , Fa-Hao WU , Chen-Yu CHIA , Chi-Chih CHU , Cheng-Yi WENG , Ya-Wen HSU
IPC分类号： H01L21/56 , H01L23/498 , H01L23/00
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
摘要翻译：在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。封装主体的侧表面基本上与衬底单元的侧表面对准。包装体限定了至少部分地暴露相应的连接元件的开口。连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式