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1. 发明申请

WO2004103015A1 MICROPHONE WITH ADJUSTABLE PROPERTIES 审中-公开
标题翻译：麦克风具有可调性能
公开(公告)号：WO2004103015A1
公开(公告)日：2004-11-25
申请号：PCT/DK2004/000321
申请日：2004-05-06
申请人： OTICON A/S , SØRENSEN, Per, Kokholm , RASMUSSEN, Frank, Engel , RASMUSSEN, Karsten, Bo
发明人： SØRENSEN, Per, Kokholm , RASMUSSEN, Frank, Engel , RASMUSSEN, Karsten, Bo
IPC分类号： H04R1/32
CPC分类号： H04R1/34 , H04R1/40 , H04R25/405 , H04R25/456 , H04R2410/07
摘要： The invention concerns a microphone with a membrane. The membrane has a first side which is in fluid contact with the surroundings and a second side which is facing a back chamber, where a barometric relief opening or vent opening is provided between the back chamber and the surroundings. According to the invention control means are provided for controlling the barometric relief opening.
摘要翻译：本发明涉及具有膜的麦克风。膜具有与周围液体接触的第一侧和面向后室的第二侧，其中在后室和周围环境之间设置有气压释放开口或通气口。根据本发明，提供控制装置用于控制气压释放口。

2. 发明申请

WO2009118221A1 HEARING AID WITH A MANUAL INPUT TERMINAL COMPRISING A TOUCH SENSITIVE SENSOR 审中-公开
标题翻译：用包含感应敏感传感器的手动输入端子进行听力助听
公开(公告)号：WO2009118221A1
公开(公告)日：2009-10-01
申请号：PCT/EP2009/051904
申请日：2009-02-18
申请人： OTICON A/S , DITLEFSEN, Laetitia Hourman , RASMUSSEN, Frank Engel , RASMUSSEN, Torben , ØLLGAARD, Mogens
发明人： DITLEFSEN, Laetitia Hourman , RASMUSSEN, Frank Engel , RASMUSSEN, Torben , ØLLGAARD, Mogens
IPC分类号： H04R25/00 , G06F3/033
CPC分类号： H04R25/558 , G06F3/03547 , G06F3/038 , H04R2225/61
摘要： The invention is directed to a hearing aid (10) that comprises a processing circuitry (22) for processing a signal that is fed to an earphone (24), a control unit (26) for controlling operation of the processing circuitry (24), and a manual input terminal (28) for entering control commands to the hearing aid (10). The manual input terminal comprises a touch-sensitive sensor (28) that exhibits a touch- sensitive surface (16) and that comprises a plurality of sensor elements (30). The touch-sensitive sensor (28) is adapted to sense virtually forceless touches of the touch-sensitive surface (16) of the sensor elements (30), respectively.
摘要翻译：本发明涉及一种助听器（10），其包括用于处理馈送到耳机（24）的信号的处理电路（22），用于控制处理电路（24）的操作的控制单元（26）以及用于向所述助听器（10）输入控制命令的手动输入端子（28）。手动输入端子包括具有触敏表面（16）并且包括多个传感器元件（30）的触敏传感器（28）。感测传感器（28）适于分别感测传感器元件（30）的触敏表面（16）的实质上无力的触摸。

3. 发明申请

WO2006077192A1 HEARING AID WITH RECHARGEABLE BATTERY AND RECHARGEABLE BATTERY 审中-公开
标题翻译：用可充电电池和可充电电池进行听力助听
公开(公告)号：WO2006077192A1
公开(公告)日：2006-07-27
申请号：PCT/EP2006/050168
申请日：2006-01-12
申请人： OTICON A/S , PETERSEN, Anders, Erik , RASMUSSEN, Frank, Engel , POULSEN, Henning, Knak , GUDNASON, Gunnar
发明人： PETERSEN, Anders, Erik , RASMUSSEN, Frank, Engel , POULSEN, Henning, Knak , GUDNASON, Gunnar
IPC分类号： H01M4/75 , H01M10/04
CPC分类号： H01M4/66 , H01M4/75 , H01M10/0431 , H01M10/052 , H01M10/0562 , H01M10/0587 , H01M10/46 , H01M2300/0071 , H02J7/025 , H02J50/10 , H04R25/00 , H04R2225/31
摘要： A rechargeable battery is provided comprising a flexible elongate electron conductive core (1) surrounded by a first electrochemically active layer (2), and a second electrochemically active layer (4), separated by a separation layer (3) and where an electron conducting element (5) contacts the outer surface of the second electrochemically active layer, whereby at least one of the two electrochemically active layers (2, 4) and the separation layer (3) are comprised of thin-film layers. Further a hearing aid is provided wherein a battery comprising thin film layers is provided. Such a battery may be curled or wound to accommodate an irregular space inside the hearing aid.
摘要翻译：提供了可再充电电池，其包括由第一电化学活性层（2）包围的柔性细长电子导电芯（1）和由分离层（3）分开的第二电化学活性层（4），并且其中电子传导元件（5）接触第二电化学活性层的外表面，由此两个电化学活性层（2,4）和分离层（3）中的至少一个由薄膜层构成。此外，提供了一种助听器，其中提供了包括薄膜层的电池。这样的电池可以卷曲或卷绕以适应助听器内的不规则空间。

4. 发明申请

WO2004109770A3 THROUGH WAFER VIA PROCESS AND AMPLIFIER WITH THROUGH WAFER VIA 审中-公开
标题翻译：通过通过WAFER的过程和放大器通过WAFER
公开(公告)号：WO2004109770A3
公开(公告)日：2005-02-03
申请号：PCT/DK2004000367
申请日：2004-05-26
申请人： OTICON AS , RASMUSSEN FRANK ENGEL , SKINDHOEJ JOERGEN , PETERSEN ANDERS ERIK
发明人： RASMUSSEN FRANK ENGEL , SKINDHOEJ JOERGEN , PETERSEN ANDERS ERIK
IPC分类号： H01L21/768 , H01L23/48
CPC分类号： H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401
摘要： The invention concerns a process for generating a through wafer via from a first to a second external surface of a CMOS or similar circuitry containing wafer, whereby a metal layer is deposited on the second surface of the wafer and where a DRIE process is subsequently used to generate the hole through the wafer material from the first surface to the metal layer and using the metal layer as an etch stop, and whereafter an electrical insulation layer is deposited on the side walls of the hole and an electrically conducting material is provided on top of the electrical insulation material.
摘要翻译：本发明涉及一种用于从CMOS或类似的包含晶片的电路的第一外部表面产生通过晶片通孔的方法，由此金属层沉积在晶片的第二表面上，并且随后将DRIE工艺用于通过晶片材料从第一表面到金属层产生孔，并使用金属层作为蚀刻停止层，然后在孔的侧壁上沉积电绝缘层，并且导电材料设置在电绝缘材料。

5. 发明申请

WO2006029970A1 AUDIO PROCESSING DEVICE WITH ENCAPSULATED ELECTRONIC COMPONENT. 审中-公开
标题翻译：具有封装电子元件的音频处理器件。
公开(公告)号：WO2006029970A1
公开(公告)日：2006-03-23
申请号：PCT/EP2005/054355
申请日：2005-09-05
申请人： OTICON A/S , RASMUSSEN, Frank Engel , SKINDHØJ, Jørgen , PETERSEN, Anders Erik
发明人： RASMUSSEN, Frank Engel , SKINDHØJ, Jørgen , PETERSEN, Anders Erik
IPC分类号： H04R19/04 , H04R19/00 , H01L23/31
CPC分类号： H05K3/4694 , H01L23/315 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15192 , H01L2924/19041 , H01L2924/3025 , H05K1/16 , H05K1/186 , H05K3/284 , H05K3/4644 , H01L2224/0401
摘要： The invention regards an audio processing device with at least one encapsulated electronic component mounted and electrically connected to electric leads in a mounting substrate. Further electric components are mounted for connection with the encapsulated electronic component through the substrate and the encapsulation material is moulded onto the substrate. According to the invention at least one metal layer is deposited on a surface part of the encapsulation material. The invention further regards a method for producing an amplifier for an audio device whereby at least one encapsulated electronic component is mounted on, and electrically connected to a PCB and where the encapsulation material is provided to protect the electronic component wherein further a metal layer is generated at least on a surface area of the encapsulation material.
摘要翻译：本发明涉及一种具有至少一个被封装的电子部件的音频处理装置，并且在安装基板中电连接到电引线。另外的电气部件被安装用于通过衬底与封装的电子部件连接，并且封装材料被模制到衬底上。根据本发明，至少一个金属层沉积在封装材料的表面部分上。本发明还涉及一种用于制造用于音频装置的放大器的方法，其中至少一个封装的电子部件安装在PCB上并电连接到PCB，并且其中提供封装材料以保护电子部件，其中还产生金属层至少在封装材料的表面积上。

6. 发明申请

WO2004109770A2 THROUGH WAFER VIA PROCESS AND AMPLIFIER WITH THROUGH WAFER VIA 审中-公开
标题翻译：通过通过WAFER的过程和放大器通过WAFER
公开(公告)号：WO2004109770A2
公开(公告)日：2004-12-16
申请号：PCT/DK2004/000367
申请日：2004-05-26
申请人： OTICON A/S , RASMUSSEN, Frank, Engel , SKINDHØJ, Jørgen , PETERSEN, Anders, Erik
发明人： RASMUSSEN, Frank, Engel , SKINDHØJ, Jørgen , PETERSEN, Anders, Erik
IPC分类号： H01L21/00
CPC分类号： H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401
摘要： The invention concerns a process for generating a through wafer via from a first to a second external surface of a CMOS or similar circuitry containing wafer, whereby a metal layer is deposited on the second surface of the wafer and where a DRIE process is subsequently used to generate the hole through the wafer material from the first surface to the metal layer and using the metal layer as an etch stop, and whereafter an electrical insulation layer is deposited on the side walls of the hole and an electrically conducting material is provided on top of the electrical insulation material.
摘要翻译：本发明涉及一种用于从CMOS或类似的包含晶片的电路的第一外部表面产生通过晶片通孔的方法，由此金属层沉积在晶片的第二表面上，并且随后将DRIE工艺用于通过晶片材料从第一表面到金属层产生孔，并使用金属层作为蚀刻停止层，然后在孔的侧壁上沉积电绝缘层，并且导电材料设置在电绝缘材料。

7. 发明申请

WO2003105207A1 FEED-THROUGH PROCESS AND AMPLIFIER WITH FEED-THROUGH 审中-公开
标题翻译： FEED-THROUGH过程和放大器与进给
公开(公告)号：WO2003105207A1
公开(公告)日：2003-12-18
申请号：PCT/DK2003/000339
申请日：2003-05-22
申请人： OTICON A/S , RASMUSSEN, Frank, Engel , SKINDHOJ, Jorgen , PETERSEN, Anders, Erik
发明人： RASMUSSEN, Frank, Engel , SKINDHOJ, Jorgen , PETERSEN, Anders, Erik
IPC分类号： H01L21/302
CPC分类号： H01L21/30608 , H01L21/76898
摘要： The invention concerns a process for generating a feed-through in a semiconductor wafer, which has electric circuitry embedded in a front surface whereby the hole for the feed-through is generated by the combined use of a front side protection layer and a wet KOH etch process etching the hole from the back side of the wafer, where a photomasking process is subsequently used do define the via followed by deposition of the via material.
摘要翻译：本发明涉及一种用于在半导体晶片中产生馈通的方法，该半导体晶片具有嵌入在前表面中的电路，由此通过组合使用前侧保护层和湿KOH蚀刻来产生馈通孔从晶片的背面对孔进行蚀刻，随后使用光掩模工艺来确定通孔，然后沉积通孔材料。

8. 发明申请

WO2003059010A1 WIND NOISE INSENSITIVE HEARING AID 审中-公开
标题翻译：风噪声无知听力助听器
公开(公告)号：WO2003059010A1
公开(公告)日：2003-07-17
申请号：PCT/DK2003/000003
申请日：2003-01-07
申请人： OTICON A/S , RASMUSSEN, Karsten, Bo , FREDERIKSEN, Peter , RASMUSSEN, Frank, Engel , PETERSEN, Kim, Spetzler
发明人： RASMUSSEN, Karsten, Bo , FREDERIKSEN, Peter , RASMUSSEN, Frank, Engel , PETERSEN, Kim, Spetzler
IPC分类号： H04R25/00
CPC分类号： H04R25/402 , H04R25/407 , H04R2410/07
摘要： The invention concerns a hearing aid with at least one primary sound to electric converting transducer converting sounds in the environment into electrical signals and a signal processing unit for amplifying the electrical signal according to the needs of the user and an electrical to sound transducer for receiving the amplified electrical signal and delivering a sound signal to the ear wherein at least one further sound to electrical transducer is provided. The said further transducer has a sensitivity to wind noise which is smaller than the sensitivity to wind noise of the primary transducer and further the signal processing unit has means for detecting the level of wind noise in the signal from the primary sound to electric converting transducer. According to the invention also selecting means are provided for selecting the signal to be amplified from either the primary- or the at least one further sound to electrical transducer.
摘要翻译：本发明涉及一种助听器，其具有至少一个主要声音以电转换换能器将环境中的声音转换为电信号;以及信号处理单元，用于根据用户的需要放大电信号，以及电 - 声换能器，用于接收放大的电信号并将声音信号传送到耳朵，其中提供至少一个另外的声音到电传感器。所述另外的传感器对风噪声的灵敏度小于主要传感器的风噪声的灵敏度，此外，信号处理单元具有用于检测从主声音到电转换换能器的信号中的风噪声水平的装置。根据本发明，还提供了选择装置，用于从主或至少一个另外的声音到电变换器中选择要放大的信号。

9. 发明申请

WO2003053098A1 HEARING AID WITH A CASING 审中-公开
标题翻译：听力助听
公开(公告)号：WO2003053098A1
公开(公告)日：2003-06-26
申请号：PCT/DK2002/000857
申请日：2002-12-16
申请人： OTICON A/S , FREDERIKSEN, Peter , PETERSEN, Kim, Spetzler , RASMUSSEN, Karsten, Bo , RASMUSSEN, Frank, Engel
发明人： FREDERIKSEN, Peter , PETERSEN, Kim, Spetzler , RASMUSSEN, Karsten, Bo , RASMUSSEN, Frank, Engel
IPC分类号： H04R25/00
CPC分类号： H04R25/604 , H04R25/453
摘要： Hearing aid with a casing (5) accomodating at least one sound to electric converting transducer (2) converting sounds in the environment into electrical signals and a signal processing unit (4) for amplifying the electrical signal and an electrical to sound transducer (3) for receiving the amplified electrical signal and delivering a sound signal to the ear, whereby at least one further sound to electric converting transducer (6, 7) is provided, whereby a sound passage leads from the interior of the casing (5) to one of the at least one further transducer and/or whereby a sound passage is provided between the casing and one of the at least one further transducers.
摘要翻译：将具有至少一个声音的壳体（5）的助听器耦合到电转换换能器（2），将环境中的声音转换为电信号;以及用于放大电信号的信号处理单元（4）和电 - 声换能器（3）用于接收放大的电信号并将声音信号传送到耳朵，由此提供至少一个另外的声音电转换换能器（6,7），由此声音通道从壳体（5）的内部引导到所述至少一个另外的换能器和/或由此在所述壳体和所述至少一个其它换能器中的一个之间提供声音通道。

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