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1. 发明授权

US07104807B1 Apparatus for an improved peripheral electronic interconnect device 失效
标题翻译：用于改进的外围电子互连装置的装置
公开(公告)号：US07104807B1
公开(公告)日：2006-09-12
申请号：US10888105
申请日：2004-07-09
申请人： Kuang-Yu Wang , Ren-Kang Chiou , Edward W. Lee
发明人： Kuang-Yu Wang , Ren-Kang Chiou , Edward W. Lee
IPC分类号： H01R12/00 , H05K5/14
CPC分类号： H01R12/57 , H01R12/714 , H01R12/721 , H01R12/87
摘要： A plug for coupling with an industry-standard EXPRESSCARD™ receptacle is described. The plug includes a plurality of plug-side metal contacts disposed on a bottom substrate. The plurality of plug-side metal contacts is configured to electrically couple with receptacle-side metal contacts in the industry-standard EXPRESSCARD™ receptacle. When the plug is disconnected from the industry-standard EXPRESSCARD™ receptacle, the surfaces of the plurality plug-side metal contacts are exposed by not being covered by a top housing.
摘要翻译：描述了用于与行业标准EXPRESSCARD（TM）插座连接的插头。插头包括设置在底部基板上的多个插头侧金属触点。多个插塞侧金属触点被配置为与工业标准EXPRESSCARD TM插座中的插座侧金属触点电耦合。当插头与行业标准的EXPRESSCARD TM插座断开连接时，多个插头侧金属触头的表面不被顶部外壳覆盖。

2. 发明授权

US07008240B1 PC card assembly 失效
标题翻译： PC卡组合
公开(公告)号：US07008240B1
公开(公告)日：2006-03-07
申请号：US10826110
申请日：2004-04-16
申请人： KuangYu Wang , Ren-Kang Chiou
发明人： KuangYu Wang , Ren-Kang Chiou
IPC分类号： H01R12/00
CPC分类号： H05K5/0217 , B29C65/08 , B29C65/58 , B29C66/112 , B29C66/114 , B29C66/1142 , B29C66/1162 , B29C66/1222 , B29C66/1224 , B29C66/12463 , B29C66/126 , B29C66/1282 , B29C66/12841 , B29C66/30221 , B29C66/30223 , B29C66/5414 , B29L2031/3425 , H05K5/0269 , Y10S439/946
摘要： A PC card assembly including a printed circuit board assembly (PCBA) and an associated two-piece housing made up of a frame-like body and a top cover. The PCBA includes a printed circuit board (PCB) and a connector that is attached to one end of the PCB. The frame-like body includes parallel side rails and an end rail formed with a step-like mounting structure that includes a peripheral shelf for supporting at least two edges of the PCB, and several alignment protrusions that extend from inside portions of the side rails onto the shelf that engage with alignment notches formed in the PCB during the assembly process. Depressions are formed in top and bottom walls for receiving ICs mounted on the PCB. The frame-like body defines an optional longitudinal slot for slidably receiving the PCB. A top cover is either ultrasonically welded or snap-coupled onto the frame-like body.
摘要翻译：一种PC卡组件，包括印刷电路板组件（PCBA）和由框架体和顶盖构成的相关联的两件式外壳。 PCBA包括印刷电路板（PCB）和连接到PCB的一端的连接器。框架体包括平行的侧轨和形成有阶梯状安装结构的端轨，其包括用于支撑PCB的至少两个边缘的外围架，以及从侧轨的内侧部分延伸的多个对准突起在组装过程中与PCB中形成的对准凹口啮合的搁板。凹陷形成在顶壁和底壁上，用于接收安装在PCB上的IC。框架体限定了用于可滑动地接收PCB的可选的纵向槽。顶盖可以超声波焊接或卡扣耦合到框架体上。

3. 发明授权

US07004794B2 Low-profile USB connector without metal case 失效
标题翻译：薄型USB连接器，不带金属外壳
公开(公告)号：US07004794B2
公开(公告)日：2006-02-28
申请号：US10917672
申请日：2004-08-13
申请人： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou , Edward W. Lee , Tzu-Yih Chu
发明人： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou , Edward W. Lee , Tzu-Yih Chu
IPC分类号： H01R33/00
CPC分类号： G06K19/07732 , G06K19/07733 , H01R24/62
摘要： A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.
摘要翻译：一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。

4. 发明授权

US06933209B2 Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges 失效
标题翻译：使用具有分离插针和针对针桥的扁平引线框架堆叠存储器芯片
公开(公告)号：US06933209B2
公开(公告)日：2005-08-23
申请号：US10707624
申请日：2003-12-24
申请人： Ren-Kang Chiou , Tzu-Yih Chu
发明人： Ren-Kang Chiou , Tzu-Yih Chu
IPC分类号： H01L21/30 , H01L21/301 , H01L21/44 , H01L21/46 , H01L21/48 , H01L21/50 , H01L21/76 , H01L21/78 , H01L25/10 , H05K1/18
CPC分类号： H01L25/105 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49175 , H01L2225/1029 , H01L2225/107 , H01L2924/181 , H05K1/181 , H05K2201/10515 , H05K2201/1053 , H05K2201/10689 , H05K2201/10924 , Y02P70/611 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Memory chips are assembled into a stack with an insertion-pin frame between pins of two stacked memory chips. The insertion-pin frame is not bent or formed into 3-dimensional shapes but is flat, improving use in standard surface-mount processes such as solder printing onto the insertion-pin frame. Flat insertion pins held to the flat insertion-pin frame by necks are soldered to top shoulders of pins on a lower chip. Then bottom feet of pins of an upper chip are soldered to the insertion pins. The necks are punched away or broken to release the insertion-pin frame from the insertion pins that are soldered to the assembled stacked chips. An insulated wire jumper can be placed under the pins to jumper chip-select connections, or a bridge between insertion pins can be formed from the insertion-pin frame. Holding tabs to the bridge are removed with the insertion pins or by punching.
摘要翻译：存储器芯片组装成具有在两个堆叠的存储器芯片的引脚之间的插入引脚框架的堆叠。插入销框架不弯曲或形成三维形状，但是平坦，改善了在标准表面贴装工艺（例如焊接印刷到插针框架上）的使用。通过颈部将扁平插入销固定到扁平插入架框架上焊接到下部芯片上的针脚顶部。然后将上部芯片的引脚的底脚焊接到插入引脚。颈部被冲掉或破裂，以将插入销框架从焊接到组装的堆叠芯片上的插入销释放。绝缘跳线可以放置在引脚下方跳线芯片选择连接，也可以从插针框架形成插入插脚之间的桥。通过插销或冲孔将保持接头连接到桥上。

5. 发明申请

US20050070138A1 Slim USB Plug and Flash-Memory Card with Supporting Underside Ribs Engaging Socket Springs 审中-公开
标题翻译：超薄USB插头和闪存卡，支持底部肋骨啮合套筒弹簧
公开(公告)号：US20050070138A1
公开(公告)日：2005-03-31
申请号：US10904529
申请日：2004-11-15
申请人： Ren-Kang Chiou , Jim Ni
发明人： Ren-Kang Chiou , Jim Ni
IPC分类号： H01L23/28 , H01R12/00 , H01R13/627 , H01R13/717 , H01R24/00 , H01R33/00
CPC分类号： G06K19/07732 , G06K19/07733 , H01R13/717 , H01R13/7175 , H01R24/62
摘要： A two-piece flash-memory-drive card has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a board that is encapsulated by a lower plastic case but no upper plastic case. Components are mounted onto the board on the side opposite the metal contacts and are covered by the lower plastic case. A thinner portion of the plastic case forms a light window that allows a light-emitting diode on the board to shine through the case. The lower plastic case is bonded to the board with adhesive or using snaps. Supporting underside ribs in the lower plastic case opposite the metal contacts allow most of the card to be thinner than the space inside the standard USB socket.
摘要翻译：两片闪存驱动器卡具有集成的超薄通用串行总线（USB）连接器，适合标准USB插座。超薄的USB连接器在板上有4个金属触点，由一个较低的塑料外壳封装，但没有上塑料外壳。组件安装在与金属触点相对的一侧的板上，并被下部塑料外壳覆盖。塑料外壳的较薄部分形成一个光窗，允许板上的发光二极管照射在外壳上。较低的塑料外壳用粘合剂或使用卡扣粘合到板上。与金属触点相对的下部塑料外壳中的支撑下侧肋允许大多数卡片比标准USB插座内的空间更薄。

6. 再颁专利

USRE40115E1 Assembly including slim female USB connector and slim male USB connector with spring-engaging depressions, stabilizing dividers and wider end rails 失效
标题翻译：组合包括超薄的母USB连接器和超薄的雄USB连接器，具有弹簧接合的凹陷，稳定的分隔线和更宽的端轨
公开(公告)号：USRE40115E1
公开(公告)日：2008-02-26
申请号：US11106735
申请日：2005-04-13
申请人： Edward W. Lee , Ren-Kang Chiou , Tzu-Yih Chu
发明人： Edward W. Lee , Ren-Kang Chiou , Tzu-Yih Chu
IPC分类号： H01R12/00
CPC分类号： G06K19/07732 , G06K19/07733 , H01R24/62 , H01R27/02
摘要： A slim male Universal-Serial-Bus (USB) connector fits on only one side of the connector substrate in a standard female USB connector. Wobble or vertical play is reduced by locking depressions in the slim male USB connector that engage metal springs on a metal case that surrounds the female USB connector, locking the two connectors together. Between metal contacts on the slim USM connector are dividers that help fill in gaps when the two connectors are connected together, further reducing play. End rails on the slim USB connector fill in gaps on the sides. The connector substrate of the slim male USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip. The connector is wider than the standard width for a better fit. A slim female USB connector for assembly use with the slim male USB connector is also disclosed.
摘要翻译：通用串行总线（USB）连接器适合于通用串行总线（USB）连接器，适用于<？insert-start id =“INS-S-00001”date =“20080226”？> male <？insert-end id =“INS-S-00001”？仅在标准母USB连接器中的连接器基板的一侧。摆动或垂直播放通过在细长状态下锁定凹陷来减少<？insert-start id =“INS-S-00002”date =“20080226”？> male <？insert-end id =“INS-S-00002”？> USB连接器，将金属弹簧接合在围绕母USB连接器的金属外壳上，将两个连接器锁定在一起。在超薄USM连接器上的金属触点之间的分隔线有助于在两个连接器连接在一起时填补间隙，进一步减少播放。超薄USB连接器上的端部导轨填充两侧的间隙。 USB连接器的连接器基板可以是单独的或者是可以分开的，这个连接器基板的尺寸<？insert-start id =“INS-S-00003”date =“20080226”？> male <？insert-end id =“INS-S-00003” 可以与保存闪存芯片和USB控制器芯片的电路板集成。连接器比标准宽度更宽，更好的适合。一个细长的母USB连接器，用于组装<？insert-start id =“INS-S-00004”date =“20080226”？>使用细长的公头USB？<？insert-end id =“INS-S-00004”？连接器也被公开。

7. 发明授权

US07215551B2 Memory module assembly including heat sink attached to integrated circuits by adhesive 有权
标题翻译：内存模块组件，包括通过粘合剂连接到集成电路的散热片
公开(公告)号：US07215551B2
公开(公告)日：2007-05-08
申请号：US10956893
申请日：2004-09-29
申请人： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
发明人： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/42 , H01L23/3672 , H01L25/105 , H01L2924/0002 , H05K7/20509 , H01L2924/00
摘要： A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
摘要翻译：存储器模块组件包括通过粘合剂连接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的双板散热器。粘合剂是热活化或热固化的。将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。然后将夹具通过烘箱以激活/固化粘合剂。

8. 发明授权

US07182646B1 Connectors having a USB-like form factor for supporting USB and non-USB protocols 失效
标题翻译：连接器具有类似USB的外形，用于支持USB和非USB协议
公开(公告)号：US07182646B1
公开(公告)日：2007-02-27
申请号：US10938691
申请日：2004-09-10
申请人： Horng-Yee Chou , Ren-Kang Chiou , Edward W. Lee
发明人： Horng-Yee Chou , Ren-Kang Chiou , Edward W. Lee
IPC分类号： H01R24/00
CPC分类号： G06K19/07732 , G06K19/07733 , H01R24/62 , H01R27/02
摘要： An extended Universal-Serial Bus (USB) plug and extended Universal-Serial Bus (USB) socket are disclosed. The extended Universal-Serial Bus (USB) plug includes an extended pin substrate, the extended pin substrate and at least some of a plurality of contacts thereon being dimensioned to be mechanically compatible with an industry-standard USB socket. The extended USB plug further lacks an industry-standard cover associated with an industry-standard USB plug, thereby causing the extended USB plug to be thinner than the industry-standard USB plug. The extended Universal-Serial Bus (USB) socket, which includes an extended cavity having an extended cavity length longer than a length of a cavity of an industry-standard USB connector socket. The extended cavity and at least some of a plurality of pins therein are dimensioned to be mechanically compatible with an industry-standard USB connector plug.
摘要翻译：公开了一种扩展的通用串行总线（USB）插头和扩展通用串行总线（USB）插座。扩展的通用串行总线（USB）插头包括扩展的引脚基板，延伸的引脚基板和其上的多个触点中的至少一些触点的尺寸被设计成与工业标准USB插座机械兼容。扩展的USB插头还缺少与行业标准USB插头相关的行业标准封面，从而使扩展的USB插头比行业标准的USB插头更薄。扩展的通用串行总线（USB）插座，其包括具有比工业标准USB连接器插座的腔的长度长的扩展腔长度的延伸空腔。扩展腔和其中的多个销中的至少一些销的尺寸被设计成与工业标准USB连接器插头机械兼容。

9. 发明申请

US20060067054A1 Memory module assembly including heat sink attached to integrated circuits by adhesive 有权
标题翻译：内存模块组件，包括通过粘合剂连接到集成电路的散热片
公开(公告)号：US20060067054A1
公开(公告)日：2006-03-30
申请号：US10956893
申请日：2004-09-29
申请人： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
发明人： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/3672 , H01L25/105 , H01L2924/0002 , H05K7/20509 , H01L2924/00
摘要： A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
摘要翻译：存储器模块组件包括通过粘合剂连接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的双板散热器。粘合剂是热活化或热固化的。将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。然后将夹具通过烘箱以激活/固化粘合剂。

10. 发明申请

US20050142694A1 STACKING MEMORY CHIPS USING FLAT LEAD-FRAME WITH BREAKAWAY INSERTION PINS AND PIN-TO-PIN BRIDGES 失效
标题翻译：使用平面引线框架与BREAKAWAY插入引脚和引脚对引脚桥块堆叠存储卡
公开(公告)号：US20050142694A1
公开(公告)日：2005-06-30
申请号：US10707624
申请日：2003-12-24
申请人： Ren-Kang Chiou , Tzu-Yih Chu
发明人： Ren-Kang Chiou , Tzu-Yih Chu
IPC分类号： H01L21/30 , H01L21/301 , H01L21/44 , H01L21/46 , H01L21/48 , H01L21/50 , H01L21/76 , H01L21/78 , H01L25/10 , H05K1/18
CPC分类号： H01L25/105 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49175 , H01L2225/1029 , H01L2225/107 , H01L2924/181 , H05K1/181 , H05K2201/10515 , H05K2201/1053 , H05K2201/10689 , H05K2201/10924 , Y02P70/611 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Memory chips are assembled into a stack with an insertion-pin frame between pins of two stacked memory chips. The insertion-pin frame is not bent or formed into 3-dimensional shapes but is flat, improving use in standard surface-mount processes such as solder printing onto the insertion-pin frame. Flat insertion pins held to the flat insertion-pin frame by necks are soldered to top shoulders of pins on a lower chip. Then bottom feet of pins of an upper chip are soldered to the insertion pins. The necks are punched away or broken to release the insertion-pin frame from the insertion pins that are soldered to the assembled stacked chips. An insulated wire jumper can be placed under the pins to jumper chip-select connections, or a bridge between insertion pins can be formed from the insertion-pin frame. Holding tabs to the bridge are removed with the insertion pins or by punching.
摘要翻译：存储器芯片组装成具有在两个堆叠的存储器芯片的引脚之间的插入引脚框架的堆叠。插入销框架不弯曲或形成三维形状，但是平坦，改善了在标准表面贴装工艺（例如焊接印刷到插针框架上）的使用。通过颈部将扁平插入销固定到扁平插入架框架上焊接到下部芯片上的针脚顶部。然后将上部芯片的引脚的底脚焊接到插入引脚。颈部被冲掉或破裂，以将插入销框架从焊接到组装的堆叠芯片上的插入销释放。绝缘跳线可以放置在引脚下方跳线芯片选择连接，也可以从插针框架形成插入插脚之间的桥。通过插销或冲孔将保持接头连接到桥上。

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