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1. 发明专利

AU2003264313A1 AN IMPROVED TONER-CARTRIDGE SEALING STRIP AND THE MANUFACTURING METHOD THEREOF 未知
公开(公告)号：AU2003264313A1
公开(公告)日：2005-03-29
申请号：AU2003264313
申请日：2003-09-09
申请人： YUAN YONGJIAN , HUANG ZHIYUN , SHI LEI
发明人： HUANG ZHIYUN , YUAN YONGJIAN
IPC分类号： G03G15/08 , B32B7/10
摘要： The present invention is an improved sealing strip for sealing the toner chamber slot of a toner cartridge, and its manufacturing method. A sealing strip for toner cartridges includes a sealing film and a double-faced sealing film adhered thereto. The sealing film includes, along a first direction, a sealing portion for sealing a toner chamber slot of a toner cartridge and a pull part extending along one end of the sealing portion. The pull part is used for tearing away the sealing portion. The sealing portion includes two openings adjacent the pull part. The two openings range from 0.5 to 3.5 millimeters in length. The sealing film includes, along a second direction substantially perpendicular to the first direction, a prime layer and a guide layer. The guide layer includes two guide lines substantially parallel to each other and extending along the first direction. The two guide lines intersect the two openings. The double-faced sealing film is adhered to the sealing portion.

2. 发明公开

EP2157139A1 A METHOD FOR MODIFYING NORMAL CLAY AND A METHOD FOR PRODUCING COMPOSITE ELASTOMER FROM THE CLAY 有权
标题翻译：进行修改正常声音和方法的方法，生产复合弹性体距离通
公开(公告)号：EP2157139A1
公开(公告)日：2010-02-24
申请号：EP07800735.8
申请日：2007-08-20
申请人： Shi, Lei
发明人： Shi, Lei
IPC分类号： C09C3/12 , C09C3/10 , C09C1/42 , C08L33/00 , C08J9/00 , C08K3/34
CPC分类号： C09C1/42 , C01P2006/80 , C08K3/346 , C09C3/12 , C08L83/04
摘要： A method for modifying soil and a method for producing composite Elastomer of the soil are disclosed. The method for modifying soil includes drying, pulverizing, sieving, and purifying the soil to obtain soil powder, then dynamically heating the powder and adding surfactant, which includes coupling agent, polysiloxane having reactive functional, emulsifier of organosilicon and aliphatic amine, and water, and then drying the above obtained powder to obtain modified soil. The modified soil and acrylic acid copolymer emulsion are mixed with plasticizer, foaming agent, etc. to form a composite body which is used to produce elastomer floor board, elastomer wall brick, composite soil skin material, and so on. No emission of toxic gas and evaporation of organic solvent can be attained during production and use of the invention, and performance of the product is same as or has superiority over rubber in compression deformation rate, rebound elasticity and durability.
摘要翻译：用于修改土壤和制造方法的土壤复合弹性体的方法是游离缺失光盘。用于修改土壤的方法，包括干燥，粉碎，过筛，并纯化土壤，得到土粉，然后动态加热粉末和添加表面活性剂，其包括偶联剂，具有反应性官能，有机硅和脂族胺和水的乳化剂的聚硅氧烷，然后干燥上述得到的粉末，以获得改性的土壤。修改后的土壤和酸共聚物乳液是混合丙烯酸树脂与增塑剂，发泡剂等，以形成复合体的所有其用于制备弹性地板，弹性体壁砖，复合土表皮材料，等等。有毒气体和有机溶剂的蒸发没有发射可在生产和使用本发明的过程中可以实现，而且产品的性能是相同的或者具有超过橡胶优越性在压缩变形率，回弹性和耐久性。

3. 发明授权

EP2157139B1 A METHOD FOR MODIFYING NORMAL CLAY AND A METHOD FOR PRODUCING COMPOSITE ELASTOMER FROM THE CLAY 有权
标题翻译：进行修改正常声音和方法的方法，生产复合弹性体距离通
公开(公告)号：EP2157139B1
公开(公告)日：2014-03-26
申请号：EP07800735.8
申请日：2007-08-20
申请人： Shi, Lei
发明人： Shi, Lei
IPC分类号： C09C3/12 , C09C3/10 , C09C1/42 , C08L33/00 , C08J9/00 , C08K3/34
CPC分类号： C09C1/42 , C01P2006/80 , C08K3/346 , C09C3/12 , C08L83/04

4. 发明公开

EP2157139A4 A METHOD FOR MODIFYING NORMAL CLAY AND A METHOD FOR PRODUCING COMPOSITE ELASTOMER FROM THE CLAY 有权
标题翻译：进行修改正常声音和方法的方法，生产复合弹性体距离通
公开(公告)号：EP2157139A4
公开(公告)日：2012-03-21
申请号：EP07800735
申请日：2007-08-20
申请人： SHI LEI
发明人： SHI LEI
IPC分类号： C09C3/12 , C08J9/00 , C08K3/34 , C08L33/00 , C09C1/42 , C09C3/10
CPC分类号： C09C1/42 , C01P2006/80 , C08K3/346 , C09C3/12 , C08L83/04

5. 发明申请

WO2021236528A1 DUAL-MODE MULTI-CONJUGATE FILTER BASED ON DIFFERENT VOLTAGE DRIVEN SCHEMES 审中-公开
公开(公告)号：WO2021236528A1
公开(公告)日：2021-11-25
申请号：PCT/US2021/032781
申请日：2021-05-17
申请人： CHEMIMAGE CORPORATION , SHI, Lei , VENTOURIS, George , NELSON, Matthew, P. , TREADO, Patrick, J.
发明人： SHI, Lei , VENTOURIS, George , NELSON, Matthew, P. , TREADO, Patrick, J.
IPC分类号： G02F1/13 , G02F1/133 , G02F1/1337 , G02F1/1347 , G02F1/139
摘要： A multi-conjugate filter (MCF) can be operated in both a single bandpass mode and a multiple bandpass mode. By applying different voltages to different channels of a MCF, the MCF can be used to filter light into (1) a single narrow spectral output or (2) a broad ranged "white light" spectral output.

6. 发明申请

WO2021213511A1 BISPECIFIC ANTIBODIES FOR TREATING CD47-ASSOCIATED DISEASES 审中-公开
公开(公告)号：WO2021213511A1
公开(公告)日：2021-10-28
申请号：PCT/CN2021/089397
申请日：2021-04-23
申请人： VIRTUOSO BINCO, INC. , SHI, Lei
发明人： WANG, Xinhua , CHEN, Xiaocheng , POST, Leonard , WONG, Oi Kwan
IPC分类号： C07K16/46
摘要： Disclosed herein are bispecific antibodies comprising a first targeting moiety that specifically binds to CD47 and a second targeting moiety that specifically binds to EpCAM or EGFR and, pharmaceutical compositions and methods comprising the bispecific antibodies.

7. 发明申请

WO2017184409A1 SPLASH AND ODOR REDUCTION IN DRY TOILET 审中-公开
标题翻译：干厕中的污渍和气味减少
公开(公告)号：WO2017184409A1
公开(公告)日：2017-10-26
申请号：PCT/US2017/027285
申请日：2017-04-13
申请人： SHI, Lei , ZHANG, Yahe
发明人： ZHANG, Yahe
IPC分类号： A47K11/02 , A47K11/00 , A47K11/04
CPC分类号： A47K11/02 , Y02A50/454
摘要： This application describes a splash-proof odor reducing waterless toilet, a funnel-shaped soft passageway, the passageway material being a high polymer, and a rim. Below said sim, Passageway is connected to rim. The user's excreta fall onto passageway, and the dirt and dirty liquid will not splash, reducing the size of the path for odors, mosquitoes and flies to come out.
摘要翻译：本申请描述了一种防飞溅减少臭味的无水马桶，一种漏斗状软通道，通道材料是一种高分子聚合物以及一种轮圈。在所述sim下面，通道连接到边缘。使用者的排泄物落到通道上，污垢和脏液不会飞溅，从而减少了气味，蚊子和苍蝇出来的路径。

8. 发明申请

WO2017184408A1 SPLASH DEODORANT TOILET 审中-公开
标题翻译：喷洒除臭剂厕所
公开(公告)号：WO2017184408A1
公开(公告)日：2017-10-26
申请号：PCT/US2017/027284
申请日：2017-04-13
申请人： SHI, Lei , ZHANG, Yahe
发明人： ZHANG, Yahe
IPC分类号： A47K11/00 , A47K11/02 , A47K11/12 , F16K7/00 , F16K7/02
CPC分类号： A47K11/02 , E04H1/1216 , Y02A50/454
摘要： An odor-proof, splash-proof waterless toilet is formed from a funnel-shaped soft passageway, hereafter referred to as passageway, and a pressing member. Said pressing member is located on one side of the peripheral circle of said passageway, exerting pressure on said passageway, changing the shape of said passageway until said passageway is closed. When said pressing member reduces pressure, said passageway opens. Put simply, the motion, the action of the pressing member increases the pressure on the passageway, which begins to reduce the passageway's ability to allow material to pass through it until it finally closes. A reduction of pressure begins to increase the passageway's ability to allow material to pass through it until it finally opens completely. The said pressing member can be a curved shape, and is tangential to the peripheral circle of said passageway. When the passageway is closed, it prevents odor and splashing.
摘要翻译：
一种防臭，防水的无水马桶由漏斗状软通道（以下称为通道）和加压件形成。所述挤压构件位于所述通道的周边圆的一侧上，对所述通道施加压力，改变所述通道的形状，直到所述通道关闭。当所述按压构件减压时，所述通路打开。简而言之，运动，按压构件的作用增加了通道上的压力，这开始减少通道允许材料穿过它的能力，直到它最终关闭。减少压力开始增加通道允许材料通过它的能力，直到它最终完全打开。所述按压部件可以是弯曲的形状，并且与所述通道的周边圆相切。当通道关闭时，它可以防止异味和飞溅。

9. 发明申请

WO2012126379A1 THREE-DIMENSIONAL SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES 审中-公开
标题翻译：三维系统级包装方法和结构
公开(公告)号：WO2012126379A1
公开(公告)日：2012-09-27
申请号：PCT/CN2012/072772
申请日：2012-03-22
申请人： NANTONG FUJITSU MICROELECTRONICS CO., LTD. , TAO, Yujuan , SHI, Lei , WANG, Honghui
发明人： TAO, Yujuan , SHI, Lei , WANG, Honghui
IPC分类号： H01L25/00 , H01L23/485 , H01L21/60
CPC分类号： H01L23/485 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/80 , H01L24/82 , H01L25/00 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/24195 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/00013 , H01L2924/014 , H01L2924/19105 , H05K1/185 , H01L2924/00014 , H01L2224/29099 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29599
摘要： A 3D system-level packaging method includes providing a packaging substrate (101), forming a glue layer (102) on the substrate (101), and attaching a first chip layer at an opposite side of a functional surface of the first chip layer on the packaging substrate (101) through the glue layer (102). The method also includes forming a first sealant layer on the packaging substrate (101) at a same side attached with the first chip layer and exposing bonding pads of the first chip layer. The method also includes forming first vias in the first sealant layer, forming first vertical metal wiring in the first vias, and forming a first horizontal wiring layer on the sealant layer interconnecting the first chip layer and the first vertical metal wiring. Further, the method includes forming a plurality of package layers on the first sealant layer, wherein each of the plurality of package layers includes a chip layer, a sealant layer covering the chip layer, and vertical metal wiring and a horizontal wiring layer (123) interconnecting adjacent package layers. 3D system-level packaging structures are also provided.
摘要翻译： 3D系统级封装方法包括提供封装衬底（101），在衬底（101）上形成胶层（102），以及将第一芯片层的功能表面的相反侧的第一芯片层与所述包装基板（101）穿过所述胶层（102）。该方法还包括在与第一芯片层相连的同一侧在封装衬底（101）上形成第一密封剂层并且暴露第一芯片层的焊盘。该方法还包括在第一密封剂层中形成第一通孔，在第一通孔中形成第一垂直金属布线，以及在互连第一芯片层和第一垂直金属布线的密封剂层上形成第一水平布线层。此外，该方法包括在第一密封剂层上形成多个封装层，其中多个封装层中的每一个包括芯片层，覆盖芯片层的密封剂层和垂直金属布线以及水平布线层（123）互连相邻的封装层。还提供了3D系统级封装结构。

10. 发明申请

WO2012126375A1 FAN-OUT HIGH-DENSITY PACKAGING METHODS AND STRUCTURES 审中-公开
标题翻译： FAN-OUT高密度包装方法和结构
公开(公告)号：WO2012126375A1
公开(公告)日：2012-09-27
申请号：PCT/CN2012/072766
申请日：2012-03-22
申请人： NANTONG FUJITSU MICROELECTRONICS CO., LTD. , TAO, Yujuan , SHI, Lei
发明人： TAO, Yujuan , SHI, Lei
IPC分类号： H01L21/50 , H01L25/00 , H01L21/56 , H01L23/31 , H01L23/52
CPC分类号： H01L23/49822 , H01L21/50 , H01L21/563 , H01L21/568 , H01L23/3128 , H01L23/3142 , H01L23/49816 , H01L23/49894 , H01L23/5389 , H01L24/23 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/16225 , H01L2224/24226 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73267 , H01L2224/81005 , H01L2224/85005 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H05K1/0306 , H05K1/111 , H05K1/181 , H05K1/185 , H05K2201/0154 , H05K2201/0195 , H05K2201/10674 , H01L2924/00 , H01L2924/00012
摘要： A fan-out high-density packaging method includes providing a packaging substrate, forming a stripping film on the packaging substrate, and forming a first protection layer on the stripping film and pre-designed photolithography pattern openings on the first protection layer. The method also includes forming a metal redistribution layer on the surface of the first protection layer and in the photolithography pattern openings, forming a second protection layer on the first protection layer and partially exposing the metal redistribution layer, and forming at least one package layer on the second protection layer. Each of at least one package layer includes a straight mounting layer, a sealant layer, and a wiring layer formed in sequence, and the package layer connects the metal redistribution layer through the wiring layer. Further, the method includes forming at least one top-level package layer on top of the at least one package layer, removing the packaging substrate and the stripping film to expose the metal redistribution layer in the first protection layer, and planting metal solder balls on the exposed metal redistribution layer.
摘要翻译：扇出式高密度封装方法包括提供封装衬底，在封装衬底上形成剥离膜，以及在剥离膜上形成第一保护层和在第一保护层上形成预先设计的光刻图案孔。该方法还包括在第一保护层的表面上和在光刻图案开口中形成金属再分布层，在第一保护层上形成第二保护层，并部分地暴露金属再分布层，并且形成至少一个封装层第二保护层。至少一个封装层中的每一个包括依次形成的直的安装层，密封剂层和布线层，并且封装层通过布线层连接金属再分配层。此外，该方法包括在至少一个封装层的顶部上形成至少一个顶层封装层，去除封装衬底和剥离膜以暴露第一保护层中的金属再分配层，并将金属焊球放置在暴露的金属再分配层。

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