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1. 发明申请

US20090277673A1 PCB having electronic components embedded therein and method of manufacturing the same 审中-公开
标题翻译：具有嵌入其中的电子部件的PCB及其制造方法
公开(公告)号：US20090277673A1
公开(公告)日：2009-11-12
申请号：US12215414
申请日：2008-06-27
申请人： Seung Hyun Sohn , Yul Kyo Chung , Byoung Chan Kim , Moon Il Kim , Kwan Kyu Kim , Yee Na Shin
发明人： Seung Hyun Sohn , Yul Kyo Chung , Byoung Chan Kim , Moon Il Kim , Kwan Kyu Kim , Yee Na Shin
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K1/185 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/92144 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/025 , H05K3/4602 , H05K2201/10674 , H05K2203/0152 , H05K2203/063 , H05K2203/1152 , H05K2203/1469 , Y10T29/49124 , Y10T29/4913 , H01L2924/00
摘要： Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.
摘要翻译：本发明提供一种嵌入其中的电子部件的PCB，该PCB包括嵌入其中的电子部件的芯层和在其上形成的树脂层。形成在树脂层上并与电子部件电连接的内层电路; 形成在所述内层电路上的绝缘层; 以及形成在绝缘层上并与内部层电路电连接的外部层电路。

2. 发明申请

US20110216515A1 ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电子设备嵌入式印刷电路板及其制造方法
公开(公告)号：US20110216515A1
公开(公告)日：2011-09-08
申请号：US12852063
申请日：2010-08-06
申请人： Jin-Won LEE , Yul-Kyo Chung , Doo-Hwan Lee , Seung-Hyun Sohn , Dae-Jung Byun
发明人： Jin-Won LEE , Yul-Kyo Chung , Doo-Hwan Lee , Seung-Hyun Sohn , Dae-Jung Byun
IPC分类号： H05K1/18 , B32B38/10 , B32B38/04
CPC分类号： B32B38/04 , B32B38/10 , H01L24/19 , H01L2224/04105 , H01L2224/32145 , H01L2224/73267 , H01L2224/92244 , H01L2924/351 , H05K1/18 , H01L2924/00
摘要： An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.
摘要翻译：公开了电子装置嵌入式印刷电路板及其制造方法。根据本发明的实施例，通过以下方式制造电子装置嵌入式印刷电路板：通过面朝下方法将第一电子装置粘附在支撑体上; 通过面朝上方法将第二电子装置粘附在第一电子装置的上表面上; 在支撑体的上侧堆叠纯树脂层和增强层，其中第一电装置和第二电装置嵌入在纯树脂层中; 去除支撑体; 在第一电子装置的下侧堆叠绝缘层，浸渍在绝缘层中的增强材料; 并且在每个加强层和绝缘层上构图电路。

3. 发明申请

US20110034606A1 COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITANCE WITH TEMPERATURE AND SIGNAL-MATCHING EMBEDDED CAPACITOR PREPARED USING THE SAME 审中-公开
标题翻译：具有使用其制备的具有温度和信号匹配嵌入式电容器的电容的小变化的复合介电组合物
公开(公告)号：US20110034606A1
公开(公告)日：2011-02-10
申请号：US12906540
申请日：2010-10-18
申请人： Eun Tae PARK , Yul Kyo Chung , Seung Hyun Sohn , Min Ji Ko
发明人： Eun Tae PARK , Yul Kyo Chung , Seung Hyun Sohn , Min Ji Ko
IPC分类号： C08K3/22
CPC分类号： H05K1/162 , H01G4/206 , H01L2924/0002 , H05K2201/0209 , H01L2924/00
摘要： Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature.
摘要翻译：本文公开了一种具有小的电容变化与温度的复合电介质组合物，其包括表现出电容与温度的正或负变化的聚合物基体和陶瓷填料的组合，所述陶瓷填料表现出与温度成反比的电容的负或正变化与聚合物基体的相同; 以及通过使用相同组成制备的信号匹配嵌入式电容器。特别地，本发明提供一种复合电介质组合物，其包含显示电容与温度的正或负变化的聚合物基质和表现出与聚合物基体相反的电容变化的陶瓷填料; 以及具有相同组成并且具有不大于5％的电容与温度变化的信号匹配嵌入式电容器，并且Dgr; C / C×100（％）。本发明的复合电介质组合物由于电容随温度的变化小而可用于制备信号匹配嵌入式电容器。

4. 发明申请

US20090314419A1 PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF 审中-公开
标题翻译：用于嵌入式被动设备的印刷电路板材料及其制备方法
公开(公告)号：US20090314419A1
公开(公告)日：2009-12-24
申请号：US12550178
申请日：2009-08-28
申请人： Seung Hyun SOHN , Hyo-Soon Shin
发明人： Seung Hyun SOHN , Hyo-Soon Shin
IPC分类号： B32B37/00 , B05D5/12
CPC分类号： B32B7/04 , H05K1/0233 , H05K1/024 , H05K1/162 , H05K3/386 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0254 , H05K2201/0355 , H05K2201/086 , H05K2201/09309 , Y10T428/24917 , Y10T428/249994 , Y10T428/256
摘要： A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.
摘要翻译：提供了一种具有优异的电磁特性和可靠性的嵌入式无源器件印刷电路板材料。本发明提供一种印刷电路板材料，包括：导电铜箔层; 形成在导电层上的树脂粘结层，包括70-100体积％的树脂和0-30体积％的填料; 以及形成在树脂粘合层上并包括树脂和填料的功能层。印刷电路板材料具有插入在铜箔层和功能层之间的树脂粘合层。因此，即使功能层中的填料的含量增加，也可以确保导电层与功能层之间的粘合强度，而不会劣化功能层的性质，例如电介质和磁性。

5. 发明申请

US20090152121A1 THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：薄膜电容器嵌入式印刷电路板及其制造方法
公开(公告)号：US20090152121A1
公开(公告)日：2009-06-18
申请号：US12370818
申请日：2009-02-13
申请人： Jin Seok MOON , Yul Kyo Chung , Soo Hyun Lyoo , Seung Hyun Sohn
发明人： Jin Seok MOON , Yul Kyo Chung , Soo Hyun Lyoo , Seung Hyun Sohn
IPC分类号： C25D5/00
CPC分类号： H05K1/162 , H05K3/388 , H05K2201/0175 , H05K2201/0179 , Y10T29/417 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.
摘要翻译：这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

6. 发明申请

US20070148421A1 PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF 审中-公开
标题翻译：用于嵌入式被动设备的印刷电路板材料及其制备方法
公开(公告)号：US20070148421A1
公开(公告)日：2007-06-28
申请号：US11539532
申请日：2006-10-06
申请人： Seung Hyun SOHN , Hyo SHIN
发明人： Seung Hyun SOHN , Hyo SHIN
IPC分类号： B05D5/12
CPC分类号： B32B7/04 , H05K1/0233 , H05K1/024 , H05K1/162 , H05K3/386 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0254 , H05K2201/0355 , H05K2201/086 , H05K2201/09309 , Y10T428/24917 , Y10T428/249994 , Y10T428/256
摘要： A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.
摘要翻译：提供了一种具有优异的电磁特性和可靠性的嵌入式无源器件印刷电路板材料。本发明提供一种印刷电路板材料，包括：导电铜箔层; 形成在导电层上的树脂粘结层，包括70-100体积％的树脂和0-30体积％的填料; 以及形成在树脂粘合层上并包括树脂和填料的功能层。印刷电路板材料具有插入在铜箔层和功能层之间的树脂粘合层。因此，即使功能层中的填料的含量增加，也可以确保导电层与功能层之间的粘合强度，而不会劣化功能层的性质，例如电介质和磁性。

7. 发明授权

US07886436B2 Thin film capacitor-embedded printed circuit board and method of manufacturing the same 有权
标题翻译：薄膜电容器嵌入式印刷电路板及其制造方法
公开(公告)号：US07886436B2
公开(公告)日：2011-02-15
申请号：US12370818
申请日：2009-02-13
申请人： Jin Seok Moon , Yul Kyo Chung , Soo Hyun Lyoo , Seung Hyun Sohn
发明人： Jin Seok Moon , Yul Kyo Chung , Soo Hyun Lyoo , Seung Hyun Sohn
IPC分类号： H05K3/10
CPC分类号： H05K1/162 , H05K3/388 , H05K2201/0175 , H05K2201/0179 , Y10T29/417 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.
摘要翻译：这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

8. 发明授权

US07737529B2 Printed circuit board with film capacitor embedded therein and method for manufacturing the same 有权
标题翻译：嵌入薄膜电容器的印刷电路板及其制造方法
公开(公告)号：US07737529B2
公开(公告)日：2010-06-15
申请号：US11582954
申请日：2006-10-19
申请人： Jin Seok Moon , Seung Eun Lee , Hyung Mi Jung , Yul Kyo Chung , Seung Hyun Sohn
发明人： Jin Seok Moon , Seung Eun Lee , Hyung Mi Jung , Yul Kyo Chung , Seung Hyun Sohn
IPC分类号： H01L29/00
CPC分类号： H05K1/162 , H05K3/388 , H05K2201/0175 , H05K2201/0179
摘要： The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.
摘要翻译：本发明提供一种其中嵌有薄膜电容器的PCB及其制造方法。 PCB包括形成在绝缘基板上的下电极; 通过低温成膜形成在下电极上的非晶顺电膜; 形成在所述非晶正电介质膜上的缓冲层; 形成在缓冲层上的金属种子层; 以及形成在金属籽晶层上的上电极。

9. 发明授权

US07675756B2 Thin film-capacitor-embedded printed circuit board and method of manufacturing the same 有权
标题翻译：薄膜电容器嵌入式印刷电路板及其制造方法
公开(公告)号：US07675756B2
公开(公告)日：2010-03-09
申请号：US11593088
申请日：2006-11-06
申请人： Jin Seok Moon , Yul Kyo Chung , Soo Hyun Lyoo , Seung Hyun Sohn
发明人： Jin Seok Moon , Yul Kyo Chung , Soo Hyun Lyoo , Seung Hyun Sohn
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/388 , H05K2201/0175 , H05K2201/0179 , Y10T29/417 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.
摘要翻译：这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

10. 发明申请

US20090057860A1 Semiconductor memory package 审中-公开
标题翻译：半导体存储器封装
公开(公告)号：US20090057860A1
公开(公告)日：2009-03-05
申请号：US12230243
申请日：2008-08-26
申请人： Seok Bae , Yul-Kyo Chung , Sung-Taek Lim , Hyung-Mi Jung , Yee-Na Shin , Seung-Hyun Sohn , Jin-Seok Moon
发明人： Seok Bae , Yul-Kyo Chung , Sung-Taek Lim , Hyung-Mi Jung , Yee-Na Shin , Seung-Hyun Sohn , Jin-Seok Moon
IPC分类号： H01L23/48
CPC分类号： H01L23/49822 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L23/642 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45139 , H01L2224/4824 , H01L2224/73215 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/18165 , H01L2924/19015 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2924/01049
摘要： Disclosed is a semiconductor memory package having a thin-film decoupling capacitor that reduces radio frequency noise. The semiconductor memory package in accordance with an embodiment of the present invention includes a substrate, a memory chip being mounted on one side of the substrate and a decoupling capacitor formed in the vicinity one the side of the substrate where the memory chip is mounted.
摘要翻译：公开了一种具有降低射频噪声的薄膜去耦电容器的半导体存储器封装。根据本发明的实施例的半导体存储器封装包括衬底，安装在衬底的一侧的存储芯片和形成在衬底的安装有存储器芯片的一侧的附近的去耦电容器。

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