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1. 发明授权

US09017023B2 Fan structure and electronic device applied with the same 有权
标题翻译：风扇结构和电子设备应用相同
公开(公告)号：US09017023B2
公开(公告)日：2015-04-28
申请号：US13361413
申请日：2012-01-30
申请人： Fei-Kai Hsiao , Te-Chuan Wang , Ting-Chiang Huang
发明人： Fei-Kai Hsiao , Te-Chuan Wang , Ting-Chiang Huang
IPC分类号： F04D29/64 , G06F1/20 , F04D29/42 , F04D29/52 , H05K7/20 , F04D17/16 , F04D25/06 , F04D29/60 , H01L23/427
CPC分类号： G06F1/203 , F04D17/16 , F04D25/0613 , F04D29/4226 , F04D29/522 , F04D29/601 , H01L23/427 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： An electronic device comprises a back plate, a fan and a coupling element. The fan includes a supporting base, a cover and a fan blade. The cover is disposed on the supporting base to form a fan blade accommodating space, the fan blade is disposed inside the accommodating space and is pivotally connected to the supporting base. In addition, the supporting base includes a coupling hole which is disposed inside the accommodating space. The coupling element passes through the coupling hole in order to have the supporting base installed on the back plate. Whereby, a bottom area of the fan is reduced by having both the coupling hole and the fan blade disposed inside the accommodating space, so that less space of circuit layout for a circuit board is occupied by the fan.
摘要翻译：电子设备包括背板，风扇和耦合元件。风扇包括支撑底座，盖子和风扇叶片。所述盖设置在所述支撑基座上以形成风扇叶片容纳空间，所述风扇叶片设置在所述容纳空间的内部并且枢转地连接到所述支撑基座。此外，支撑基座包括设置在容纳空间内的联接孔。联接元件通过联接孔，以便将支撑底座安装在背板上。由此，通过将耦合孔和风扇叶片设置在容纳空间内部来减小风扇的底部区域，使得电路板的电路布局的空间较小。

2. 发明授权

US07940528B2 Electronic device and heat sink thereof 有权
标题翻译：电子设备及其散热器
公开(公告)号：US07940528B2
公开(公告)日：2011-05-10
申请号：US12539182
申请日：2009-08-11
申请人： Feng-Ku Wang , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/3677 , F28F3/022 , F28F3/06 , G06F1/203 , H01L2924/0002 , H01L2924/00
摘要： An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.
摘要翻译：电子设备包括壳体，热产生元件和散热器。热产生元件设置在壳体内并用于产生热能。散热器包括热转印板和多个可移动热转印构件。热传递板接触热发生元件并且包括多个凹部。每个可移动热传递构件具有重量端和自由端。重物端部容纳在凹部中。由热发生元件产生的热能通过热传递板被传导到可动热传递部件。当壳体倾斜一定角度时，可移动热转印构件相对于热转印板摆动，使得其自由端指向与正常状态下的重力加速度相反的方向。

3. 发明授权

US07826227B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07826227B2
公开(公告)日：2010-11-02
申请号：US12068909
申请日：2008-02-13
申请人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
IPC分类号： H01L23/34 , F28F7/00
CPC分类号： H01L23/467 , F28F1/30 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.
摘要翻译：散热装置设置在电子装置中，与电子装置的电子部件进行热交换。散热装置包括散热片和多个颤振片。散热器附着在电子部件上，以传导电子部件的热能。颤振片设置在散热器上，并且当电子设备移动时，振动片被致动以产生气流，从而干扰电子设备内部的空气，从而达到提高散热性能的目的。

4. 发明申请

US20130077242A1 FAN STRUCTURE AND ELECTRONIC DEVICE APPLIED WITH THE SAME 有权
标题翻译：风扇结构和电子设备应用于此
公开(公告)号：US20130077242A1
公开(公告)日：2013-03-28
申请号：US13361413
申请日：2012-01-30
申请人： Fei-Kai HSIAO , Te-Chuan WANG , Ting-Chiang HUANG
发明人： Fei-Kai HSIAO , Te-Chuan WANG , Ting-Chiang HUANG
IPC分类号： H05K7/20 , F04D1/00
CPC分类号： G06F1/203 , F04D17/16 , F04D25/0613 , F04D29/4226 , F04D29/522 , F04D29/601 , H01L23/427 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： An electronic device comprises a back plate, a fan and a coupling element. The fan includes a supporting base, a cover and a fan blade. The cover is disposed on the supporting base to form a fan blade accommodating space, the fan blade is disposed inside the accommodating space and is pivotally connected to the supporting base. In addition, the supporting base includes a coupling hole which is disposed inside the accommodating space. The coupling element passes through the coupling hole in order to have the supporting base installed on the back plate. Whereby, a bottom area of the fan is reduced by having both the coupling hole and the fan blade disposed inside the accommodating space, so that less space of circuit layout for a circuit board is occupied by the fan.
摘要翻译：电子设备包括背板，风扇和耦合元件。风扇包括支撑底座，盖子和风扇叶片。所述盖设置在所述支撑基座上以形成风扇叶片容纳空间，所述风扇叶片设置在所述容纳空间的内部并且枢转地连接到所述支撑基座。此外，支撑基座包括设置在容纳空间内的联接孔。联接元件通过联接孔，以便将支撑底座安装在背板上。由此，通过将耦合孔和风扇叶片设置在容纳空间内部来减小风扇的底部区域，使得电路板的电路布局的空间较小。

5. 发明授权

US07775778B2 Heat dissipation module 有权
标题翻译：散热模块
公开(公告)号：US07775778B2
公开(公告)日：2010-08-17
申请号：US11849746
申请日：2007-09-04
申请人： Shaw-Fuu Wang , Ting-Chiang Huang , Shih-Chen Shen , Sheng-Jie Syu
发明人： Shaw-Fuu Wang , Ting-Chiang Huang , Shih-Chen Shen , Sheng-Jie Syu
IPC分类号： F04B19/00 , H05K5/00
CPC分类号： F24F13/075 , F04D33/00 , F24F2013/148 , H02K7/06 , H02K7/14
摘要： A heat dissipation module including a supporting frame, a driver, a linkage, a first magnet and a plurality of magnetic blades is provided. The supporting frame has a chute. Moreover, one end of the linkage has a protrusion passing through the chute. The other end of the linkage is connected to the driver. The first magnet is disposed on the protrusion. In addition, the repelling magnetic blades are pivoted on the supporting frame. The outermost magnetic blade faces the first magnet and they repel each other.
摘要翻译：提供了一种散热模块，包括支撑框架，驱动器，联动装置，第一磁体和多个磁性叶片。支撑框架有滑槽。此外，连杆的一端具有穿过滑槽的突起。连接的另一端连接到驱动器。第一磁体设置在突起上。此外，排斥磁性叶片在支撑框架上枢转。最外面的磁性刀片面对第一个磁体并且它们彼此排斥。

6. 发明申请

US20090321055A1 LOOP HEAT PIPE 审中-公开
标题翻译： LOOP热管
公开(公告)号：US20090321055A1
公开(公告)日：2009-12-31
申请号：US12491752
申请日：2009-06-25
申请人： FENG-KU WANG , Chiun-Peng Chen , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
发明人： FENG-KU WANG , Chiun-Peng Chen , Ting-Chiang Huang , Shaw-Fuu Wang , Sheng-Jie Syu
IPC分类号： F28D15/04
CPC分类号： F28D15/043 , F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A loop heat pipe for heat dissipating to a heat source including a first pipe, a first capillary structure, a second capillary structure, a second pipe, and a working fluid is provided. The first pipe has an evaporating portion adjacent to the heat source and a condensing portion. The first capillary structure is disposed on an inner surface of the first pipe and extends from the evaporating portion to the condensing portion. The second capillary structure is disposed on the inner surface and located within the evaporating portion. The second pipe is connected between the evaporating portion and the condensing portion. The working fluid disposed in the first pipe and the second pipe is capable of being transferred from the evaporating portion to the condensing portion via the second pipe, and is capable of being transferred from the condensing portion to the evaporating portion in the first.
摘要翻译：提供了一种用于散热到包括第一管，第一毛细结构，第二毛细结构，第二管和工作流体的热源的回路热管。第一管具有与热源相邻的蒸发部分和冷凝部分。第一毛细结构设置在第一管的内表面上并从蒸发部延伸到冷凝部。第二毛细结构设置在内表面上并位于蒸发部分内。第二管连接在蒸发部和冷凝部之间。设置在第一管和第二管中的工作流体能够经由第二管从蒸发部转移到冷凝部，并且能够从第一管中的冷凝部转移到蒸发部。

7. 发明授权

US07621725B2 Swing type fan 有权
标题翻译：回转式风扇
公开(公告)号：US07621725B2
公开(公告)日：2009-11-24
申请号：US12016419
申请日：2008-01-18
申请人： Ting-Chiang Huang , Shaw-Fuu Wang , Shih-Chen Shen , Sheng-Jie Syu
发明人： Ting-Chiang Huang , Shaw-Fuu Wang , Shih-Chen Shen , Sheng-Jie Syu
IPC分类号： F04B19/00
CPC分类号： F04D33/00
摘要： A swing type fan including a frame, a motor, at least one blade, at least one first magnetic element and at least one second magnetic element is provided. The motor is fixed to the frame and has a shaft passing through the frame. The blade is disposed between the shaft and the frame and has a first side and a second side opposite to the first side. The first side of the blade is connected to the frame. The first magnetic element is disposed on the blade and is located between the first side and the second side of the blade. The second magnetic element is connected to the shaft and is corresponding to the first magnetic element. The second side of the blade swings via a magnetic force between the first magnetic element and the second magnetic element as the shaft drives the second magnetic element to rotate.
摘要翻译：提供了包括框架，电动机，至少一个叶片，至少一个第一磁性元件和至少一个第二磁性元件的摆动式风扇。电机固定在框架上，并有一个穿过框架的轴。刀片设置在轴和框架之间，并且具有与第一侧相对的第一侧和第二侧。叶片的第一侧连接到框架。第一磁性元件设置在叶片上并且位于叶片的第一侧和第二侧之间。第二磁性元件连接到轴并且对应于第一磁性元件。当轴驱动第二磁性元件旋转时，刀片的第二侧通过第一磁性元件和第二磁性元件之间的磁力摆动。

8. 发明申请

US20090213555A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20090213555A1
公开(公告)日：2009-08-27
申请号：US12035802
申请日：2008-02-22
申请人： Shaw-Fuu WANG , Ting-Chiang HUANG , Shih-Chen SHEN , Sheng-Jie SYU
发明人： Shaw-Fuu WANG , Ting-Chiang HUANG , Shih-Chen SHEN , Sheng-Jie SYU
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , F04D29/582 , F04D33/00
摘要： A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation device has at least one coil and at least one vibrating sheet. The coil is used to receive the intermittent power source to produce a magnetic field. One end of the vibrating sheet is fixed, and the other end is suspended over the coil. The suspended end flutters periodically under the magnetic force of the intermittent magnetic field, so as to produce an airflow.
摘要翻译：电气连接到间歇电源的散热装置用于散发由电路板上的发热元件产生的热量。散热装置具有至少一个线圈和至少一个振动片。线圈用于接收间歇电源以产生磁场。振动片的一端固定，另一端悬挂在线圈上。悬挂的末端在间歇磁场的磁力下周期性地摆动，以产生气流。

9. 发明申请

US20090201647A1 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US20090201647A1
公开(公告)日：2009-08-13
申请号：US12068909
申请日：2008-02-13
申请人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
发明人： Feng-Ku Wang , Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F1/30 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.
摘要翻译：散热装置设置在电子装置中，与电子装置的电子部件进行热交换。散热装置包括散热片和多个颤振片。散热器附着在电子部件上，以传导电子部件的热能。颤振片设置在散热器上，并且当电子设备移动时，振动片被致动以产生气流，以便干扰电子设备内的空气，从而达到提高散热性能的目的。

10. 发明授权

US07204750B2 Airflow guide structure and manufacture thereof 有权
标题翻译：气流引导结构及其制造
公开(公告)号：US07204750B2
公开(公告)日：2007-04-17
申请号：US10988643
申请日：2004-11-16
申请人： Ben Hung-Ping Shen , Chei-Ju Tsai , Han-Tun Chen , Ting-Chiang Huang
发明人： Ben Hung-Ping Shen , Chei-Ju Tsai , Han-Tun Chen , Ting-Chiang Huang
IPC分类号： H05K5/02
CPC分类号： G06F1/20 , H01L23/467 , H01L2924/0002 , H05K7/20727 , H01L2924/00
摘要： An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.
摘要翻译：气流引导结构及其制造用于允许在工厂中用模具切割气流引导件的部件以形成薄板，每个薄板具有多条可弯曲的线，并被运送到主机组合工厂中以存储在其中。当主机想要组装时，气流引导件的每个部件在生产线上被折叠成三维型式。由于气流引导件的每个部件是薄板，重量较轻，因此可以在组装三维盖体之前与另一部件堆叠在一起。因此，节省空间，运输和仓储更方便。

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