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    • 6. 发明申请
    • METHOD OF MAKING PILLARS USING PHOTORESIST SPACER MASK
    • 使用光电隔离膜掩模制作支柱的方法
    • WO2010062515A1
    • 2010-06-03
    • PCT/US2009/061643
    • 2009-10-22
    • SANDISK 3D LLCCHEN, Yung-TinWANG, Chun-MingRADIGAN, Steven, J.
    • CHEN, Yung-TinWANG, Chun-MingRADIGAN, Steven, J.
    • H01L21/033
    • H01L21/0337
    • A method of making a device includes forming a first hard mask layer over an underlying layer, forming first features over the first hard mask layer, forming a first spacer layer over the first features, etching the first spacer layer to form a first spacer pattern and to expose top of the first features, removing the first features, patterning the first hard mask using the first spacer pattern as a mask to form first hard mask features, removing the first spacer pattern. The method also includes forming second features over the first hard mask features, forming a second spacer layer over the second features, etching the second spacer layer to form a second spacer pattern and to expose top of the second features, removing the second features, etching the first hard mask features using the second spacer pattern as a mask to form second hard mask features, and etching at least part of the underlying layer using the second hard mask features as a mask.
    • 制造器件的方法包括在下层上形成第一硬掩模层,在第一硬掩模层上形成第一特征,在第一特征上形成第一间隔层,蚀刻第一间隔层以形成第一间隔图案, 为了暴露第一特征的顶部,去除第一特征,使用第一间隔图案作为掩模来图案化第一硬掩模以形成第一硬掩模特征,去除第一间隔图案。 该方法还包括在第一硬掩模特征上形成第二特征,在第二特征上形成第二间隔层,蚀刻第二间隔层以形成第二间隔图案并暴露第二特征的顶部,去除第二特征,蚀刻 第一硬掩模使用第二间隔图案作为掩模形成第二硬掩模特征,并且使用第二硬掩模特征作为掩模蚀刻至少部分下层。
    • 10. 发明申请
    • METHOD OF CREATING MEMS DEVICE CAVITIES BY A NON-ETCHING PROCESS
    • 通过非蚀刻工艺来创建MEMS器件腔的方法
    • WO2007078495A3
    • 2007-12-06
    • PCT/US2006045925
    • 2006-11-30
    • QUALCOMM INCWANG CHUN-MINGLAN JEFFREYSASAGAWA TERUO
    • WANG CHUN-MINGLAN JEFFREYSASAGAWA TERUO
    • B81B3/00G02B26/00G02B26/08
    • B81C1/00047B81B2201/047B81C2201/0108B81C2201/0111G02B26/001
    • MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.
    • MEMS器件(诸如干涉式调制器)可以使用含有可热蒸发聚合物的牺牲层来制造,以在可移动层和衬底之间形成间隙。 一个实施例提供了一种制造MEMS器件的方法,该方法包括:在衬底上沉积聚合物层;在聚合物层上形成导电层;以及蒸发至少一部分聚合物层,以在衬底和电气之间形成空腔 导电层。 另一个实施例提供了一种制造干涉式调制器的方法,该方法包括提供衬底,在衬底的至少一部分上沉积第一导电材料,在第一导电材料的至少一部分上沉积牺牲材料,沉积绝缘体 在衬底上并且与牺牲材料相邻以形成支撑结构,以及在牺牲材料的至少一部分上沉积第二导电材料,牺牲材料通过热汽化可去除,从而在第一电气 导电层和第二导电层。